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Chinsor Tech provides selection, modification and complete machine renovation services for high-quality used semiconductor processing equipment, covering 8-inch chemical vapor deposition and supporting core epitaxial components. As a source manufacturer of semiconductor key components with independent production lines and core technology assets, Chinsor Tech is able to directly interface with terminal procurement, avoid traders’ layer-by-layer price increase, and ensure a full range of machine upgrades with more competitive ex-factory prices and rapid supply chain response.
The used semiconductor processing equipment of this class is mainly applied to the characteristic process expansion of small and medium-sized integrated circuit manufacturing plants, the construction of micro-nano manufacturing test lines for semiconductor start-ups, the upgrading of thin film deposition machines for old production lines, and the epitaxial growth and development of non-standard materials in scientific research institutions.
providing used semiconductor processing equipment optimized by precision surveying and mapping and engineering. Its critical mechanical dimensions and electrical interface tolerances are stable within plus or minus 0.005mm, ensuring that refurb machines can be seamlessly integrated into existing production lines.
relying on 52 independent patents owned by the enterprise, the body Hdp-cvd cavity body, the core Chamber of used semiconductor processing equipment, is deeply renovated, the static leakage rate reaches the level of 1 minus ninth power, and the chemical vapor deposition performance of the machine platform is restored and improved.
in the used semiconductor processing equipment key process contact surface, the comprehensive replacement of alumina ceramic epitaxial components with purity greater than 99.7%, from the source to prevent heavy metal ions on the wafer cross-contamination.
advanced multi-zone independent temperature control heating module is configured for upgrading used semiconductor processing equipment. Under the normal process of 400 degrees Celsius, the temperature unevenness is controlled within the positive and negative 1%, and the uniformity of the film deposition thickness is significantly improved.
due to its independent precision metal and brittle material processing line, Chinsor Tech can provide long-term replacement parts support for the sold used semiconductor processing equipment, and solve the risk of machine shutdown caused by the shutdown of the original factory.
all used semiconductor processing equipment and supporting transformation components have passed strict export compliance review. The company has rich experience in large-scale project delivery, and its products have been successfully sold to the core semiconductor markets such as the United States, Japan, Korea, Malaysia and New Korea.
The used semiconductor processing equipment provided by Chinsor Tech is not a simple resale of second-hand disassembled parts, but relies on the deep film deposition, heating components and independent manufacturing technology of the source factory to reconstruct the bottom layer of the equipment in all directions. Compared to ordinary traders, Chinsor Tech is able to ensure that the machine meets the original factory-level process targets, while relying on strong local manufacturing flexibility, customized structural improvements for customers’ specific non-standard processes, and the overall delivery cycle can be reduced by half.
Chinsor Tech has established an uninterrupted replacement spare parts library for used semiconductor processing equipment, solving the pain point of machine scrapping faced by small and medium-sized enterprises after the original factory announced the suspension of equipment or technical support.
Chinsor Tech has thoroughly cleaned and ground the under-performing cavity and upgraded high-purity semiconductor-grade ceramic parts in an all-round way, thus solving the pain point that second-hand equipment is easy to release particles after long-term operation and causing large-area pollution of wafer wafers.
Chinsor Tech has replaced the independently developed high-uniformity heating base for the used semiconductor processing equipment, which solves the pain points of uneven film deposition thickness and low yield caused by the aging of the heating module of the old machine.
for purchasing directors who are in urgent need of rapid capacity expansion and additional specialty process lines within a limited capital expenditure budget. This used semiconductor processing equipment can meet its 8-inch thin film deposition process requirements with a very high return on investment.
for supply chain leaders who have just established a process route and are in the sample proofing and small batch trial production stages. This product can help start-ups avoid the high cost and long delivery time of purchasing new equipment, and realize the rapid construction of wire body and product production.
For technology-based companies that specialize in recycling, refurbishing and resale used equipment. This group can directly purchase the cavity upgrade module and precision spare parts of this product when rebuilding the function of the complex used semiconductor processing equipment.
a laboratory platform suitable for teaching and scientific research on micro-nano electronic devices, advanced semiconductor materials epitaxial growth and micro-processing technology. The product can not only provide the original factory-level process environment, but also has a high degree of flexibility, perfect fit non-standard scientific research needs.
disassemble the external protection assembly of the used semiconductor processing equipment in a thousand-level clean room environment, and use semiconductor-level high-purity isopropyl alcohol to finely wipe the inside of the cavity to completely eliminate trace mechanical particles that may be generated during transportation.
use a precision level to adjust the used semiconductor processing equipment to the process level line, and connect the special process gas pipeline and vacuum exhaust pipeline according to the original factory-level interface standard to ensure that the gasket at the interface is evenly stressed.
start the matching dry pump and molecular pump group to pump the reaction chamber to the working vacuum degree, and at the same time turn on the heating system to 150 degrees Celsius to maintain a high temperature vacuum baking for at least four hours to completely discharge the trace moisture and gas adsorbed on the inner wall of the chamber.
Before the official production, the test wafer is introduced for the standard process test run of thin film chemical vapor deposition. The thickness of the film was measured using ellipsometer and other testing equipment, and the multi-zone temperature control parameters were fine-tuned until the wafer surface uniformity reached the design target.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
8 inches
Wafer size
chemical vapor deposition
Process chamber
micro-torr per second less than 1 negative ninth power
Cavity leakage rate