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The second-hand Applied Materials Endura 5500 has become a cost-effective and high-capacity choice for 8-inch wafer production due to its excellent metallization process stability and multi-chamber parallel processing capabilities. Chinsor Tech, as a source manufacturer with 52 patents, skips middlemen to supply directly, and relies on its own parts production and equipment renovation strength to provide you with highly competitive ex-factory prices and in-depth technical support.
Used Applied Materials Endura 5500 is mainly used in logic chip manufacturing, power device production, MEMS packaging and integrated circuit metallization wiring.
Endura 5500 uses a unique dual vacuum load lock and multi-process chamber configuration to support pre-cleaning, degassing and PVD processes in one machine, significantly reducing the time of wafer exposure to the atmosphere and improving film purity.
Through advanced magnetron sputtering technology, the equipment can strictly control the thickness unevenness of the metal film within 3%, ensuring excellent step coverage and electrical performance stability in complex deep hole structures.
equipped with high-performance cryogenic pump and ion pump system, the vacuum degree of the process chamber quickly reaches a very low level, effectively reducing the gap impurity content, thus reducing the resistivity of the key metal layer by about 15%, and improving the reliability of the device.
Chinsor Tech uses its own 8-inch CVD and PVD core technology reserves to provide Endura with self-developed vacuum chambers and wafer heating components to ensure that second-hand equipment still maintains a very low failure rate in long-term operation.
equipped with optimized VHP robot arm, positioning accuracy of 0.1mm level, with 11 software copyright optimized control logic, can reduce the wafer transmission damage rate to less than one in ten thousand, to ensure the yield of mass production.
Compared with the purchase of new machines, the second-hand system not only shortens the delivery time by more than 50%, but also reduces the cost of consumables by 20% by Chinsor Tech’s original factory-level renovation process, which can help the factory achieve rapid return to capital within 12 months.
Unlike traders in the market who only clean their appearance, Chinsor Tech has fully upgraded the core heater and vacuum sealing system of Endura 5500, replacing wearing parts with our own semiconductor parts, extending the average trouble-free running time of used equipment by more than 30%. Thanks to Chinsor Tech’s layout in Wuxi and its overseas markets, we not only provide equipment sales, but also rely on our deep renovation experience in AMAT Centura 5200 and Endura platform to provide customers with one-stop closed-loop service from installation and commissioning to spare parts supply, thus completely eliminating the maintenance problems after purchasing second-hand equipment.
Chinsor Tech has 52 patents and supporting manufacturing plants. We have solved the problem of machine shutdown caused by the shutdown of the original factory and can provide long-term stable ceramic and metal spare parts support for Endura 5500.
with the independent technology accumulation of PVD wafer heating and vacuum chamber, Chinsor Tech solves the problem of difficult process matching for customers on site, shortens the verification cycle, and enables the equipment to reach the mass production standard within two weeks after entering the market.
through the strict quality control and ISO 9001 system of tax credit A- level enterprises, Chinsor Tech has solved the common problem of excessive particle control of second-hand equipment, ensuring that each delivered 5500 machine reaches the leading level in key process links.
suitable for foundries that need low-cost expansion of 8-inch production lines, this equipment can provide mature PVD process capabilities at a much lower price than new machines, solving the problem of insufficient budget for expansion.
suitable for teams developing MOSFETs, IGBTs and other devices, Endura fully meets the stringent requirements of power semiconductors for metal layer thickness and uniformity 5500 its robust thick metal deposition capability.
For partners looking for high-quality bare metal sources around the world, Chinsor Tech’s stable equipment sources and strong factory modification capabilities can be used as a reliable secondary supply chain support.
Suitable for research and development of new thin-film materials in scientific research institutions, multi-chamber configuration supports the completion of a variety of material composite deposition without breaking vacuum, greatly improving the efficiency of research and development and the accuracy of experimental data.
the operator needs to start the cryogenic pump of each chamber through the software interface first, and observe whether the vacuum degree drops below 5 times 10 minus 7 torr to ensure that the internal environment meets the process standard.
Put the 8-inch wafer into the load lock, and the system will automatically carry out positioning verification. It is necessary to confirm that the robot arm has no abnormal noise during transmission and the grasping position is in the center of the wafer.
Select the corresponding titanium or aluminum deposition recipe from the control terminal, monitor the sputtering power, gas flow and chamber temperature, and ensure that the parameters fluctuate within the preset process window.
After each run of a certain number of cycles, the shields should be replaced in accordance with the manual and the chamber walls should be treated with a special cleaning tool provided by Chinsor Tech to prevent particle contamination.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Wafer size
up to 4 process chambers
Number of chambers
less than 10 negative 8 torr
Vacuum pressure
Wuxi Zhanshuo