Semiconductors & Semiconductor Equipment

Wuxi Chinsor Technology Co., Ltd. specializes in the research, development, and manufacturing of 8-inch thin-film deposition CVD equipment, PVD wafer heating systems, and critical components for vacuum chambers. As an original equipment manufacturer of core semiconductor spare parts, Chinsor Tech boasts its own production lines and proprietary technological assets. By eliminating intermediaries, we not only offer highly competitive ex-factory prices and faster delivery times but also ensure the reliable, consistent supply of high-precision components in volume.

8 inches Applicable wafer size

chemical vapor deposition Process chamber type

micro-torr per second less than 1 negative ninth power Vacuum leakage rate of cavity

positive and negative 1% Ceramic heating uniformity

plus or minus 0.005mm Metalworking tolerances

high purity alumina ceramic Brittle material material

up to 0.2 microns Surface roughness

Anmai Real Estate 5,200 Systems Compatible with mainstream platforms

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semiconductors & semiconductor equipment（images 1）

Our products

This product and key components are mainly used in integrated circuit thin film chemical vapor deposition process, physical vapor deposition wafer heating, semiconductor machine vacuum chamber sealing and etching equipment parts replacement.

semiconductors & semiconductor equipment Features

0.005mm precision machining:

Through high-precision CNC machine tools and strict process control, the machining tolerances of metal and ceramic parts are stable within plus or minus 0.005mm. This micron-level matching accuracy can significantly reduce mechanical wear and extend the service life of spare parts by more than 30%.

High-purity semiconductor-grade ceramics:

epitaxial components and spare parts are made of alumina ceramic materials with a purity greater than 99.7%. In the high temperature and strong corrosion film deposition environment, the material has excellent chemical stability and wear resistance and erosion resistance, effectively avoiding the wafer from being contaminated by metal ions.

Positive and negative 1% heating uniformity:

PVD wafer heating components use innovative multi-zone independent temperature control technology. In a process environment of up to 400 degrees Celsius, the wafer surface temperature unevenness is controlled within plus or minus 1%, ensuring the thickness uniformity of thin film deposition and improving wafer yield.

1 negative ninth power ultra-high vacuum sealing:

the vacuum chamber and parts pass precision grinding and strict vacuum testing, and the static leakage rate of the chamber reaches the level of 1 negative ninth power. This can provide an extremely pure and stable low-pressure reaction environment for chemical vapor deposition, and eliminate process defects caused by external gas leakage.

Seamless compatibility of original factory-level machines:

products are independently developed based on deep technical accumulation, and key dimensions and electrical interfaces can seamlessly match mainstream wafer manufacturing platforms such as Anmai Real Estate. The purchaser does not need to change the existing equipment hardware, can realize the direct replacement and upgrade of the original factory level parts.

Independent property rights and compliance endorsement:

the enterprise has 52 patents and 11 software copyrights, and the product design has completely independent intellectual property rights. Combined with the quality management system certification, it avoids potential technical compliance risks for global buyers and ensures the long-term security of the supply chain.

Detailed Structural Parameter Table for Semiconductors & Semiconductor Equipment

Parameter categories	Detailed parameter items	Industry standards and technical specifications
Equipment and process performance	Core equipment types	8-inch thin-film integrated circuit chemical vapor deposition equipment
	Applicable process steps	Thin film deposition, physical vapor deposition, wafer heating, vacuum chamber sealing
	Process temperature range	100 to 650 degrees Celsius
Precision machining indicators	Metal parts tolerances	±0.005 millimeters
	Surface roughness	0.2 to 0.8 micrometers
	Ceramic spare parts tolerances	±0.01 millimeters
Material physical properties	Purity of brittle ceramics	Alumina content greater than 99.7%
	Metal substrate selection	High-purity aluminum alloys, stainless steel, refractory metals
	Material compressive strength	Greater than 300 megapascals
Vacuum and Sealing	Cavity static leak rate	Less than 1 to the power of negative 9 lift per second
	Working vacuum	Torsius -1 to -1,000
Quality and Qualification Endorsement	Quality system certification	International Organization for Standardization 9001 Certification
	Number of technology assets	Fifty-two patents and eleven software copyrights

semiconductors & semiconductor equipment Comparison Point

With its independent technology accumulation in thin film deposition, PVD wafer heating and vacuum chamber, Chinsor Tech has made its semiconductor equipment and precision spare parts reach the industry-leading level in terms of wear resistance, thermal uniformity and vacuum retention. Relying on the production advantages of the local source factory, Chinsor Tech can quickly customize the research and development according to the special process needs of customers, and shorten the overseas procurement cycle by 50% while ensuring the original factory-level technical specifications.

High cost of original spare parts:

Chinsor Tech semiconductor equipment spare parts provide a cost-effective original-level alternative to help fabs and refurbishers significantly reduce parts procurement and machine maintenance costs while maintaining the same high precision and long life.

The shutdown of key components leads to the shutdown of the machine:

Chinsor Tech cavity upgrade and transformation service provides uninterrupted spare parts support and structural improvement for the old mainstream platform, and solves the passive situation of scrapping the whole machine or long-term shutdown of the production line due to the shutdown of original parts.

Ordinary third-party spare parts purity low-contamination wafers:

Chinsor Tech high-purity ceramic and metal epitaxial components use harsh semiconductor-grade materials and surface cleaning process, to solve the common spare parts in the strong corrosion process easy to release impurities, resulting in large-area contamination of the wafer and yield decline of the pain point.

semiconductors & semiconductor equipment Applicable Crowd

Large integrated circuit wafer manufacturing plant:

applicable to the purchasing director and supply chain manager responsible for the stable operation of the whole plant production line and supply chain security management. This product provides a long-term replacement for original factory-level spare parts, helping fabs optimize their consumables procurement budgets and reduce the risk of supply interruptions from a single supplier.

semiconductors & semiconductor equipment Applicable Crowd

Semiconductor equipment refurbishment and refurbishment providers:

For third-party technology companies specializing in the refurbishment, upgrading and remanufacturing of used semiconductor machines. This group needs a large number of high-precision and high-adaptability metal processing parts and ceramic vacuum parts to restore the performance of the old platform.

In-house equipment and process engineers in the fab:

suitable for technicians who are responsible for improving machine output, process fine-tuning and reducing equipment failure rates on site. The high heat uniformity and ultra-low vacuum leakage rate of the product can directly assist engineers to solve difficult process problems such as uneven film deposition or cavity vacuum fluctuation.

Semiconductor epitaxial wafer and scientific research frontier institutions:

suitable for a new generation of semiconductor material epitaxial growth, micro-nano manufacturing process research and development of scientific research institutes and pilot test platform. These organizations have a strong demand for non-standard customized cavities and heating components, and the customized manufacturing capabilities of this product can be perfectly matched.

semiconductors & semiconductor equipment Instructions

Factory inspection and surface cleaning:

After unpacking in the clean room, the surface of the spare parts must be checked for transportation micro-cracks. Surface wiping with semiconductor-grade high-purity isopropyl alcohol removes residual particles and ensures that the parts are free of any organic or inorganic contamination.

Precision alignment and module installation:

align the spare parts with the positioning pins inside the machine cavity, and use a special torque key to lock the bolts in the specified cross sequence. It is strictly forbidden to use pneumatic tools directly to avoid ceramic brittle material fracture or metal sealing surface deformation due to uneven stress.

Vacuum baking and leak rate test:

after installation, close the cavity and start the vacuum pump system for vacuuming procedure. Heat the chamber to one hundred and fifty degrees Celsius for at least four hours of baking and degassing, and then use a helium mass leak detector to detect the leak rate at the connection of the chamber.

Temperature Calibration and Routine Maintenance:

Before the first introduction of process gas, start the multi-zone temperature control program of the wafer heating system and calibrate the surface temperature uniformity using the temperature measuring wafer. Periodically inspect for metal spatter and clean up surface deposits after each fixed number of process hours.

factory and certificate

certificate

FAQ And Contact Us

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

Q: Can the semiconductor spare parts you produce directly replace the original parts?

A: Yes. Our products are independently developed and precision manufactured in strict comparison with industry standards in key dimensions, tolerances, material purity and electrical interfaces, and can be seamlessly replaced with mainstream machine platforms such as 5000/5200 WXZ CHAMBER without changing existing equipment.

Q: What are the core advantages of Chinsor Tech in the manufacture of key semiconductor components?

A: We are the source manufacturer with independent technology accumulation. The company holds 52 patents in key process steps such as thin-film deposition, wafer heating, and vacuum chamber operations, and possesses dual manufacturing capabilities for high-purity ceramics and precision metals.

Q: How to ensure that your metal or ceramic spare parts will not produce particle pollution in a strong corrosive environment?

A: We choose alumina ceramics with a purity greater than 99.7% and high-purity semiconductor-grade metal substrates. All products undergo rigorous surface finishing and cleanroom cleaning prior to shipment, ensuring high material stability under high-temperature and corrosive conditions.

Q: How long does your customized semiconductor equipment transformation project usually take?

A: As a source factory, we have eliminated all the intermediate links. Typically, upon receiving a customer’s detailed technical drawings or equipment specifications, we can complete the design proposal and produce the first batch of prototypes within a few weeks, significantly shortening the delivery lead time compared to overseas procurement.

Q: What is the sealing performance standard of your Chamber Body Hdp-cvd cavity and key components?

A: Through micron-level precision machining and fine grinding process, our cavity and component vacuum leak rate test results can be stabilized at microtorr per second less than 1 minus ninth power level, which can provide excellent vacuum environment for various thin film deposition processes.

Q: Can Chinsor Tech supply China Gas Box, Wcvd related components for gas path control?

A: Yes. We have deep independent manufacturing technology of epitaxial components and spare parts for vapor deposition, and can produce high-specification gas boxes and key components for process gas control according to process standards to ensure stable delivery of high-purity gas.

Please feel free to contact us. We look forward to hearing from you.

Semiconductors & Semiconductor Equipment

Wuxi Chinsor Technology Co., Ltd. specializes in the research, development, and manufacturing of 8-inch thin-film deposition CVD equipment, PVD wafer heating systems, and critical components for vacuum chambers. As an original equipment manufacturer of core semiconductor spare parts, Chinsor Tech boasts its own production lines and proprietary technological assets. By eliminating intermediaries, we not only offer highly competitive ex-factory prices and faster delivery times but also ensure the reliable, consistent supply of high-precision components in volume.

8 inches

Applicable wafer size

chemical vapor deposition

Process chamber type

micro-torr per second less than 1 negative ninth power

Vacuum leakage rate of cavity

Get a Quote

semiconductors & semiconductor equipment Features

0.005mm precision machining:

Through high-precision CNC machine tools and strict process control, the machining tolerances of metal and ceramic parts are stable within plus or minus 0.005mm. This micron-level matching accuracy can significantly reduce mechanical wear and extend the service life of spare parts by more than 30%.

High-purity semiconductor-grade ceramics:

epitaxial components and spare parts are made of alumina ceramic materials with a purity greater than 99.7%. In the high temperature and strong corrosion film deposition environment, the material has excellent chemical stability and wear resistance and erosion resistance, effectively avoiding the wafer from being contaminated by metal ions.

Positive and negative 1% heating uniformity:

PVD wafer heating components use innovative multi-zone independent temperature control technology. In a process environment of up to 400 degrees Celsius, the wafer surface temperature unevenness is controlled within plus or minus 1%, ensuring the thickness uniformity of thin film deposition and improving wafer yield.

1 negative ninth power ultra-high vacuum sealing:

the vacuum chamber and parts pass precision grinding and strict vacuum testing, and the static leakage rate of the chamber reaches the level of 1 negative ninth power. This can provide an extremely pure and stable low-pressure reaction environment for chemical vapor deposition, and eliminate process defects caused by external gas leakage.

Seamless compatibility of original factory-level machines:

products are independently developed based on deep technical accumulation, and key dimensions and electrical interfaces can seamlessly match mainstream wafer manufacturing platforms such as Anmai Real Estate. The purchaser does not need to change the existing equipment hardware, can realize the direct replacement and upgrade of the original factory level parts.

Independent property rights and compliance endorsement:

the enterprise has 52 patents and 11 software copyrights, and the product design has completely independent intellectual property rights. Combined with the quality management system certification, it avoids potential technical compliance risks for global buyers and ensures the long-term security of the supply chain.

Detailed Structural Parameter Table for Semiconductors & Semiconductor Equipment

Parameter categories	Detailed parameter items	Industry standards and technical specifications
Equipment and process performance	Core equipment types	8-inch thin-film integrated circuit chemical vapor deposition equipment
	Applicable process steps	Thin film deposition, physical vapor deposition, wafer heating, vacuum chamber sealing
	Process temperature range	100 to 650 degrees Celsius
Precision machining indicators	Metal parts tolerances	±0.005 millimeters
	Surface roughness	0.2 to 0.8 micrometers
	Ceramic spare parts tolerances	±0.01 millimeters
Material physical properties	Purity of brittle ceramics	Alumina content greater than 99.7%
	Metal substrate selection	High-purity aluminum alloys, stainless steel, refractory metals
	Material compressive strength	Greater than 300 megapascals
Vacuum and Sealing	Cavity static leak rate	Less than 1 to the power of negative 9 lift per second
	Working vacuum	Torsius -1 to -1,000
Quality and Qualification Endorsement	Quality system certification	International Organization for Standardization 9001 Certification
	Number of technology assets	Fifty-two patents and eleven software copyrights

semiconductors & semiconductor equipment Comparison Point

semiconductors & semiconductor equipment（images 8）

High cost of original spare parts:

Chinsor Tech semiconductor equipment spare parts provide a cost-effective original-level alternative to help fabs and refurbishers significantly reduce parts procurement and machine maintenance costs while maintaining the same high precision and long life.

The shutdown of key components leads to the shutdown of the machine:

Chinsor Tech cavity upgrade and transformation service provides uninterrupted spare parts support and structural improvement for the old mainstream platform, and solves the passive situation of scrapping the whole machine or long-term shutdown of the production line due to the shutdown of original parts.

Ordinary third-party spare parts purity low-contamination wafers:

Chinsor Tech high-purity ceramic and metal epitaxial components use harsh semiconductor-grade materials and surface cleaning process, to solve the common spare parts in the strong corrosion process easy to release impurities, resulting in large-area contamination of the wafer and yield decline of the pain point.

semiconductors & semiconductor equipment Applicable Crowd

Large integrated circuit wafer manufacturing plant:

applicable to the purchasing director and supply chain manager responsible for the stable operation of the whole plant production line and supply chain security management. This product provides a long-term replacement for original factory-level spare parts, helping fabs optimize their consumables procurement budgets and reduce the risk of supply interruptions from a single supplier.

Semiconductor equipment refurbishment and refurbishment providers:

For third-party technology companies specializing in the refurbishment, upgrading and remanufacturing of used semiconductor machines. This group needs a large number of high-precision and high-adaptability metal processing parts and ceramic vacuum parts to restore the performance of the old platform.

In-house equipment and process engineers in the fab:

suitable for technicians who are responsible for improving machine output, process fine-tuning and reducing equipment failure rates on site. The high heat uniformity and ultra-low vacuum leakage rate of the product can directly assist engineers to solve difficult process problems such as uneven film deposition or cavity vacuum fluctuation.

Semiconductor epitaxial wafer and scientific research frontier institutions:

suitable for a new generation of semiconductor material epitaxial growth, micro-nano manufacturing process research and development of scientific research institutes and pilot test platform. These organizations have a strong demand for non-standard customized cavities and heating components, and the customized manufacturing capabilities of this product can be perfectly matched.

semiconductors & semiconductor equipment Instructions

Factory inspection and surface cleaning:

After unpacking in the clean room, the surface of the spare parts must be checked for transportation micro-cracks. Surface wiping with semiconductor-grade high-purity isopropyl alcohol removes residual particles and ensures that the parts are free of any organic or inorganic contamination.

Precision alignment and module installation:

align the spare parts with the positioning pins inside the machine cavity, and use a special torque key to lock the bolts in the specified cross sequence. It is strictly forbidden to use pneumatic tools directly to avoid ceramic brittle material fracture or metal sealing surface deformation due to uneven stress.

Vacuum baking and leak rate test:

after installation, close the cavity and start the vacuum pump system for vacuuming procedure. Heat the chamber to one hundred and fifty degrees Celsius for at least four hours of baking and degassing, and then use a helium mass leak detector to detect the leak rate at the connection of the chamber.

Temperature Calibration and Routine Maintenance:

Before the first introduction of process gas, start the multi-zone temperature control program of the wafer heating system and calibrate the surface temperature uniformity using the temperature measuring wafer. Periodically inspect for metal spatter and clean up surface deposits after each fixed number of process hours.

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