Semiconductor Wafer Inspection | 715-330106-003

Provide nano-scale precision inspection station components and customized transformation, significantly improve wafer defect recognition rate and production line yield. Chinsor Tech is a physical factory integrating R & D and precision manufacturing. It refuses OEM and provides you with factory price and fast delivery cycle.

0.02 roughness
within three microns Flatness
eight inch wafer Applicable
300 degrees Celsius Temperature resistance
high purity alumina Material
ultra-high vacuum Vacuum
Semiconductor Wafer Inspection | 715-330106-003

gear

micron motion precision control:

Using closed-loop servo feedback system to control the mechanical base, the repeat positioning accuracy is controlled within three microns, the edge alignment error of wafer scanning is reduced by 80%, and the scanning detection efficiency and accuracy are greatly improved.

gear

high purity ceramic material pollution prevention:

The components are made of alumina ceramics with a purity of up to 99.99%, which completely avoids the precipitation of metal ions, reduces the secondary particle contamination rate in the detection process to close to zero, and protects the cleanliness of the wafer.

gear

Excellent cavity vacuum retention:

The sealing structure is optimized for the vacuum chamber of the detection equipment, the leakage rate is less than ten to the negative tenth power, the time required from pumping to ultra-high vacuum state is shortened by 30 minutes, and the continuous operation cycle of the equipment without failure is effectively prolonged.

gear

customized electrostatic chuck design:

Equipped with high-voltage electrostatic field distribution optimization technology, it provides stable and uniform adsorption force to ensure that the sheet will not undergo small deformation or sliding out of focus during high-speed rotation detection, thus stabilizing the yield of production line end products.

gear

high temperature and anti corrosion treatment:

The core metal surface is treated with special anodic oxidation and chemical coating, which can work stably in high temperature of 300 degrees Celsius and fluorine-containing gas environment for a long time, and the service life is twice as long as that of traditional untreated aluminum parts.

gear

Original level seamless replacement compatible:

As a professional semiconductor equipment parts manufacturer, all the dimensions of the inspection parts we provide strictly comply with the original tolerance standards, realizing plug and play without cumbersome modification of the underlying system parameters.

Specification NameSpecifications Details
Equipment application scenariossemiconductor wafer inspection
Core replacement part nameLIFT PIN, 125MM, CHUCK
Product Identification CodePN code: 715-330106-003
Main manufacturing materials99.99% high-purity alumina ceramic/anodic aluminum alloy
Size and specifications supportedCustom-designed for 8-inch integrated circuit production line equipment
Surface polishing precisionRa 0.02 micrometer level
Maximum withstand temperature300 degrees Celsius
Supplier Qualification NatureISO 9001 certified semiconductor chamber parts supplier

The inspection parts produced by Chinsor Tech are finished with high-purity ceramics and special alloys. Compared with ordinary machined parts on the market, not only the surface roughness is reduced by 5 times, but also the inspection parts have excellent corrosion resistance and high temperature resistance. As a senior component source factory, Chinsor Tech has mastered the core coating technology and high-precision tolerance control. All replacement parts have undergone strict three-dimensional testing. The operation stability and service life of the equipment far exceed the industry average standard of more than two years.

Semiconductor Wafer Inspection | 715-330106-003
solution

Thoroughly remove the wafer back scratch hazard:

Optimize the polishing process of the contact surface between the suction cup and the thimble, and solve the problem that the traditional rough material is easy to cause small scratches and metal contamination on the back of the wafer during high-speed transmission and detection clamping.

solution

Eliminate image blur caused by high-frequency vibration:

The rigid and damping structure of the base is improved to overcome the phenomenon of focus misalignment and false defect alarm caused by slight mechanical resonance during high magnification scanning of optical detection equipment.

solution

Solve the problem of high delivery cost of original spare parts:

Provide domestic precision parts solutions that are fully compatible with mainstream platforms, break overseas monopolies, and solve the long-term downtime and waiting for materials caused by large fabs waiting for imported replacement parts.

Large wafer foundry equipment engineers:

Technical experts responsible for maintaining high productivity of front-end manufacturing and back-end test equipment are in urgent need of high-stability, long-life test platform replacement parts to reduce downtime maintenance frequency and expensive spare parts procurement costs.

semiconductor wafer inspection for the crowd

semiconductor equipment refurbishment and transformation of suppliers:

Enterprise project managers who specialize in the refurbishment and reorganization of second-hand equipment need to find source suppliers who can provide a complete set of high-quality processed parts to ensure that the refurbished inspection machine can successfully pass the strict acceptance of the fab.

semiconductor wafer inspection for the crowd

Defect detection and measurement process experts:

Researchers who focus on yield improvement and micro-defect analysis have extremely high requirements for wafer loading, heating and positioning accuracy of inspection equipment to ensure absolute accuracy and high repeatability of inspection data.

semiconductor wafer inspection for the crowd

microelectronics research institute laboratory supervisor:

Managers responsible for cutting-edge chip process development and small batch trial production need highly customized precision machining parts to build or transform experimental testing platforms to meet the stringent testing standards of special new materials.

semiconductor wafer inspection for the crowd
011

Please be sure to disassemble the multi-layer vacuum packaging in the 100-level clean room environment, wear anti-static gloves and masks throughout the operation, to avoid human dander or dust pollution of high cleanliness parts surface.

022

Use a high-precision torque wrench to tighten the fixing bolts in cross order to ensure uniform force on the flange surface. When installing the ceramic thimble, handle it gently to prevent the brittle material from breaking.

033

After installation, start the dry pump and molecular pump for vacuum pumping operation, and use helium leak detector to carry out detailed helium spray test on all sealing ring interfaces to confirm that the ultra-high vacuum standard is reached.

044

Open the servo control software of the system, perform zero reset and limit stroke learning, test the positioning accuracy for 10 cycles of no-load operation, and put into actual wafer testing after confirming that there is no abnormal noise.

certificate

6 1

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

How are these parts compatible with different brands of wafer inspection equipment?
Our parts are strictly in accordance with the original specifications of international mainstream semiconductor equipment for reverse mapping and strict tolerance control, which can be perfectly compatible with a variety of 8-inch machines and can be directly replaced and installed without secondary modification.
What are the specific advantages of high purity ceramic materials in the actual detection environment?
The use of 99.99% purity of alumina ceramics, not only high hardness and extremely wear-resistant, more importantly, in high temperature or high-energy electron beam bombardment will not produce metal ion precipitation, to ensure that the wafer is absolutely clean.
How long does it take to order custom-sized vacuum chamber parts?
Thanks to the complete CNC machining center and perfect supply chain management, conventional specifications of components are available in stock, and special customized drawings usually only take about four weeks of production time from confirmation to completion of factory inspection.
How to ensure that the surface roughness of each factory part reaches the nanometer level?
We have introduced advanced ultra-precision grinding and polishing equipment and three-dimensional white light interferometer to inspect the smoothness and flatness of each part before leaving the factory, and never let any out-of-tolerance products flow into the hands of customers.
Will the suction decay occur during the frequent adsorption and release of the electrostatic chuck?
The internal electrode structure is designed with anti-fatigue and average pressure optimization, and the insulating layer is made of high density material. After more than 100,000 charge and discharge cycles, the electrostatic adsorption force is still stable at the very high level of the initial value.
Is it necessary to re-level the equipment after installing a new drive lift pin?
Although our lifting pins have extremely high dimensional consistency, in order to ensure the highest standards of defect scanning requirements, it is recommended to use a standard flat gauge for a basic level correction after each replacement of mechanical transmission components.
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Semiconductor Wafer Inspection | 715-330106-003

Provide nano-scale precision inspection station components and customized transformation, significantly improve wafer defect recognition rate and production line yield. Chinsor Tech is a physical factory integrating R & D and precision manufacturing. It refuses OEM and provides you with factory price and fast delivery cycle.

Semiconductor Wafer Inspection | 715-330106-003

gear

Using closed-loop servo feedback system to control the mechanical base, the repeat positioning accuracy is controlled within three microns, the edge alignment error of wafer scanning is reduced by 80%, and the scanning detection efficiency and accuracy are greatly improved.

gear

The components are made of alumina ceramics with a purity of up to 99.99%, which completely avoids the precipitation of metal ions, reduces the secondary particle contamination rate in the detection process to close to zero, and protects the cleanliness of the wafer.

gear

The sealing structure is optimized for the vacuum chamber of the detection equipment, the leakage rate is less than ten to the negative tenth power, the time required from pumping to ultra-high vacuum state is shortened by 30 minutes, and the continuous operation cycle of the equipment without failure is effectively prolonged.

gear

Equipped with high-voltage electrostatic field distribution optimization technology, it provides stable and uniform adsorption force to ensure that the sheet will not undergo small deformation or sliding out of focus during high-speed rotation detection, thus stabilizing the yield of production line end products.

gear

The core metal surface is treated with special anodic oxidation and chemical coating, which can work stably in high temperature of 300 degrees Celsius and fluorine-containing gas environment for a long time, and the service life is twice as long as that of traditional untreated aluminum parts.

gear

As a professional semiconductor equipment parts manufacturer, all the dimensions of the inspection parts we provide strictly comply with the original tolerance standards, realizing plug and play without cumbersome modification of the underlying system parameters.

Specification NameSpecifications Details
Equipment application scenariossemiconductor wafer inspection
Core replacement part nameLIFT PIN, 125MM, CHUCK
Product Identification CodePN code: 715-330106-003
Main manufacturing materials99.99% high-purity alumina ceramic/anodic aluminum alloy
Size and specifications supportedCustom-designed for 8-inch integrated circuit production line equipment
Surface polishing precisionRa 0.02 micrometer level
Maximum withstand temperature300 degrees Celsius
Supplier Qualification NatureISO 9001 certified semiconductor chamber parts supplier

semiconductor wafer inspection comparison point

Semiconductor Wafer Inspection | 715-330106-003
solution
Thoroughly remove the wafer back scratch hazard:

Optimize the polishing process of the contact surface between the suction cup and the thimble, and solve the problem that the traditional rough material is easy to cause small scratches and metal contamination on the back of the wafer during high-speed transmission and detection clamping.

solution
Eliminate image blur caused by high-frequency vibration:

The rigid and damping structure of the base is improved to overcome the phenomenon of focus misalignment and false defect alarm caused by slight mechanical resonance during high magnification scanning of optical detection equipment.

solution
Solve the problem of high delivery cost of original spare parts:

Provide domestic precision parts solutions that are fully compatible with mainstream platforms, break overseas monopolies, and solve the long-term downtime and waiting for materials caused by large fabs waiting for imported replacement parts.

Large wafer foundry equipment engineers:

Technical experts responsible for maintaining high productivity of front-end manufacturing and back-end test equipment are in urgent need of high-stability, long-life test platform replacement parts to reduce downtime maintenance frequency and expensive spare parts procurement costs.

semiconductor wafer inspection for the crowd

semiconductor equipment refurbishment and transformation of suppliers:

Enterprise project managers who specialize in the refurbishment and reorganization of second-hand equipment need to find source suppliers who can provide a complete set of high-quality processed parts to ensure that the refurbished inspection machine can successfully pass the strict acceptance of the fab.

semiconductor wafer inspection for the crowd

Defect detection and measurement process experts:

Researchers who focus on yield improvement and micro-defect analysis have extremely high requirements for wafer loading, heating and positioning accuracy of inspection equipment to ensure absolute accuracy and high repeatability of inspection data.

semiconductor wafer inspection for the crowd

microelectronics research institute laboratory supervisor:

Managers responsible for cutting-edge chip process development and small batch trial production need highly customized precision machining parts to build or transform experimental testing platforms to meet the stringent testing standards of special new materials.

semiconductor wafer inspection for the crowd
011

Please be sure to disassemble the multi-layer vacuum packaging in the 100-level clean room environment, wear anti-static gloves and masks throughout the operation, to avoid human dander or dust pollution of high cleanliness parts surface.

022

Use a high-precision torque wrench to tighten the fixing bolts in cross order to ensure uniform force on the flange surface. When installing the ceramic thimble, handle it gently to prevent the brittle material from breaking.

033

After installation, start the dry pump and molecular pump for vacuum pumping operation, and use helium leak detector to carry out detailed helium spray test on all sealing ring interfaces to confirm that the ultra-high vacuum standard is reached.

044

Open the servo control software of the system, perform zero reset and limit stroke learning, test the positioning accuracy for 10 cycles of no-load operation, and put into actual wafer testing after confirming that there is no abnormal noise.

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Submitting!
Success!
Submission failed! Please try again later!
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FAQ

FAQ

How are these parts compatible with different brands of wafer inspection equipment?
Our parts are strictly in accordance with the original specifications of international mainstream semiconductor equipment for reverse mapping and strict tolerance control, which can be perfectly compatible with a variety of 8-inch machines and can be directly replaced and installed without secondary modification.
What are the specific advantages of high purity ceramic materials in the actual detection environment?
The use of 99.99% purity of alumina ceramics, not only high hardness and extremely wear-resistant, more importantly, in high temperature or high-energy electron beam bombardment will not produce metal ion precipitation, to ensure that the wafer is absolutely clean.
How long does it take to order custom-sized vacuum chamber parts?
Thanks to the complete CNC machining center and perfect supply chain management, conventional specifications of components are available in stock, and special customized drawings usually only take about four weeks of production time from confirmation to completion of factory inspection.
How to ensure that the surface roughness of each factory part reaches the nanometer level?
We have introduced advanced ultra-precision grinding and polishing equipment and three-dimensional white light interferometer to inspect the smoothness and flatness of each part before leaving the factory, and never let any out-of-tolerance products flow into the hands of customers.
Will the suction decay occur during the frequent adsorption and release of the electrostatic chuck?
The internal electrode structure is designed with anti-fatigue and average pressure optimization, and the insulating layer is made of high density material. After more than 100,000 charge and discharge cycles, the electrostatic adsorption force is still stable at the very high level of the initial value.
Is it necessary to re-level the equipment after installing a new drive lift pin?
Although our lifting pins have extremely high dimensional consistency, in order to ensure the highest standards of defect scanning requirements, it is recommended to use a standard flat gauge for a basic level correction after each replacement of mechanical transmission components.
certificate