Semiconductor Wafer Fabrication Equipment | 0040-09212

Chinsor Tech focuses on the development and manufacturing of key cavities and epitaxial components of the front-line semiconductor wafer manufacturing equipment, with independent technology accumulation and a high proportion of invention patents to enable the efficient operation of mature process production lines. Chinsor Tech has its own physical mass production plant and a complete production supply chain system. As a pure source manufacturer rather than a transshipment trader, we can directly eliminate the middleman premium for you and provide faster international order delivery speed and highly competitive direct ex-factory price.

eight inch wafer Applicable size

high quality aviation aluminum Cavity material

hard anodic oxidation Surface treatment

minus seven of ten Ultimate vacuum

plus or minus 1 degrees Celsius Temperature control accuracy

nine percent 9.9 Material purity

high standard vacuum grade Sealing grade

2 kW RF power

Get a Quote

Semiconductor Wafer Fabrication Equipment（images 1）

Our products

This product is mainly used in thin film chemical vapor deposition process, physical vapor deposition wafer heating, vacuum reaction chamber construction and high density dry plasma etching processing equipment in semiconductor wafer manufacturing equipment.

semiconductor wafer fabrication equipment Features

Advanced coating technology reduces machine particle contamination

the surface of the internal reaction cavity of semiconductor wafer manufacturing equipment is fully treated with high-density anodic oxidation, and the film thickness is uniform and greater than 50 microns. In the face of high-intensity process gas bombardment, the number of dust particles in the cavity can be reduced by more than 85%, directly blocking wafer impurity contamination and significantly improving the yield of the chip patterning process.

High-precision CNC machining to achieve seamless in-situ substitution

all precision parts for semiconductor wafer manufacturing equipment are integrated with advanced multi-axis CNC machine tools, mechanical tolerance is strictly limited to plus or minus 0.01mm. This allows the components to be 100% seamlessly adapted to the mainstream process platform, and field engineers can complete rapid assembly without making secondary corrections.

High-purity brittle materials extend the life cycle of wearing parts

the key cover ring and shower head components inside the equipment are fully selected from electronic grade ceramics and high-purity quartz with a purity of up to 99.99%. The material has a very low substrate consumption rate in a highly corrosive plasma environment, which can extend the overall service life of components by more than 3 months, effectively reducing the procurement cost of production line consumables.

Optimize thermal field management to ensure uniform film deposition thickness

The wafer heating system in semiconductor wafer manufacturing equipment has undergone precise internal structural improvements, so that the overall surface temperature unevenness of an eight-inch wafer is controlled within plus or minus 1 degrees Celsius under a high temperature process of more than 400 degrees Celsius. This helps to greatly eliminate the edge effect of thin film deposition and ensures that the thickness of the dielectric layer is highly consistent in all areas of the wafer.

Strict helium mass spectrometry leak detection ensures a stable vacuum environment

every factory-delivered semiconductor wafer manufacturing equipment vacuum chamber component is fully loaded with a high-sensitivity helium mass spectrometer for leak detection, and the overall gas leak rate is stably controlled at a very low level. Excellent static seal retention eliminates pressure fluctuations due to trace leaks during the process, perfectly guaranteeing the stability of the chemical vapor deposition gas flow.

Impedance optimization electrode improves plasma discharge efficiency

The core conductive circuit and RF input structure of semiconductor wafer manufacturing equipment are treated with low impedance surface coating, which greatly reduces heat dissipation during high frequency energy transmission. The overall RF power transmission efficiency of the system is improved 5%, which effectively prevents the plasma from flickering or abnormally extinguishing, and ensures the continuous and efficient etching and deposition processes.

Detailed Structural Parameter Table for Semiconductor Wafer Fabrication Equipment

Core system classification	Technical parameters	Industry-wide Standards and Testing Benchmarks
Process wafer compatibility	200 mm wafer size	Compatible with internationally recognized standard notches and laser positioning grooves for wafers
Cavity main structure material	6061-T6 grade high-purity forged aluminum alloy	After a complete set of vacuum annealing stress-relieving treatments, the cavity deformation is prevented.
Cavity ultimate background vacuum	$1.0 \times 10^{-7}\text{ Torr}$ to $5.0 \times 10^{-7}\text{ Torr}$	The results were obtained through combined testing of a standard high-vacuum dry pump and a molecular pump.
Wafer heating operating temperature	Maximum operating temperature supported: 650 degrees Celsius	A multi-channel thermocouple closed-loop feedback control system is used for regulation.
RF power adapter power	Maximum 2500 watts in continuous wave operation mode	Matching standard frequency 13.56 MHz high-frequency power supply
Total gas leakage rate of the cavity	Less than $1.0 \times 10^{-9}\text{ std.cc/sec}$	Leak detection was performed using a helium mass spectrometer under fully loaded, sealed conditions.
Critical contact ceramic purity	The aluminum oxide or aluminum nitride content is greater than 99.7%.	Strictly control the elemental abundance of metallic impurities such as iron, copper, and sodium.
Uniform distribution of process gases	Porous quartz or ceramic gas spray head structure	After optimization through fluid dynamics simulation, laminar flow distribution of the airflow is ensured.

semiconductor wafer fabrication equipment comparison points

The core components of semiconductor wafer manufacturing equipment manufactured by Chinsor Tech have been deeply upgraded in the application of corrosion-resistant anodic oxide layers and dense ceramic materials, which has improved its consumption resistance in strong plasma etching environments by 40% compared to ordinary third-party refurbishments. Relying on the strong local physical factory mass production capacity, Chinsor Tech can reduce the six-month spare parts delivery cycle of the traditional international supply chain to a few weeks, helping fabs to establish a more secure and flexible localized parts library.

Semiconductor Wafer Fabrication Equipment（images 2）

Chinsor Tech High Stability Vacuum Reaction Chamber

In view of the pain points that mature process semiconductor wafer manufacturing equipment is prone to sudden drop of vacuum degree and abnormal termination of process due to micro-vibration at the joint of the chamber during long-term high-power operation, we have solved the problems of accelerated wear of sealing surface of vacuum valve and frequent fluctuation of air pressure by improving the design of geometric sealing groove and connection rigidity of the chamber.

Chinsor Tech Edge Temperature-Controlled Wafer Heater

In order to solve the problem that the critical dimensions of wafer edge chips exceed the standard due to too fast heat dissipation at the edge of the heating plate in the process of large-scale thin film deposition, we have designed the array power density redistribution of the internal heating wire to solve the problems of excessive temperature gradient on the wafer surface and low yield of edge chips.

Chinsor Tech Plasma Particle Resistant Ceramic Ring

In view of the pain point that traditional semiconductor wafer manufacturing equipment has to be shut down frequently for equipment maintenance due to insufficient tolerance of the cover ring and easy peeling of tiny particles to contaminate the wafer surface under frequent plasma bombardment, we have fully adopted high-purity compact ceramic consumables to solve the problem of frequent shutdown for PM reducing the overall productivity of the production line.

semiconductor wafer fabrication equipment applicable crowd

Mature process wafer foundry equipment director

suitable for senior managers responsible for the smooth operation of six-inch or eight-inch wafer production line equipment. The product can be used as a long-term stable high-quality alternative source, helping it to significantly reduce the daily annual maintenance costs of semiconductor wafer manufacturing equipment without sacrificing process yield.

semiconductor wafer fabrication equipment applicable crowd

Semiconductor second-hand equipment refurbishment and transformation experts

suitable for independent technical teams specializing in the renovation of old machines, functional upgrades and overall skin-pulling transformation. This equipment component provides highly compatible standard mechanical dimensions and interface specifications, which can perfectly assist it in quickly completing the reconstruction of the reaction cavity part of the old system and the recovery of process parameters.

Expansion Fab Supply Chain and Purchasing Manager

Suitable for new plant or expansion project purchasing decision makers who screen high-quality hardware supply chains on a global scale. Chinsor Tech’s high percentage of patent endorsements, ISO 9001 quality certification, and pure factory direct sales model are a perfect match for its compliance requirements against risk supply chain audits.

Microelectronics and integrated circuit research laboratory technician

suitable for equipment managers of national key micro-nano processing open platforms such as universities and research institutes. The highly reliable and cross-contamination resistant equipment components can well cope with the harsh test of a variety of unconventional process materials and frequent switching of gases on the cavity environment in scientific research tests.

semiconductor wafer fabrication equipment instructions

Deep cleaning of the sealing surface

Before loading the new components into the semiconductor wafer manufacturing equipment, the sealing surface of the cavity must be thoroughly wiped with high-purity isopropyl alcohol to ensure that the surface is free of any dust, fibers and grease residues, and then the vacuum sealing ring is accurately embedded in the positioning groove.

Precision centering and fixing

When moving key components such as heating plates or trays into semiconductor wafer manufacturing equipment, special measuring tools must be used to calibrate the relative position of the wafer placement center and the upper spray head axis to ensure that the mechanical error is within the required range to ensure the uniformity of the subsequent process.

Long-cycle vacuum baking

Do not fire the process gas immediately after the assembly is installed and the cavity is closed. The vacuum pumping system of the semiconductor wafer manufacturing equipment should be operated first, and baking should be carried out for several hours under the heating state of the machine to completely discharge the water vapor adsorbed in the cavity.

Power Gradient Load Test

When starting up the semiconductor wafer fabrication equipment for the first time, a test process with step-by-step power should be used. Inactive gas is introduced first for low-power plasma trial operation, and the standard process formula can be introduced after confirming that the reflected power of the high-frequency matching device is normal.

factory and certificate

certificate

FAQ And Contact Us

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

Can your semiconductor wafer fabrication equipment parts directly replace original factory parts?

Yes. All the core components we produce are strictly compared with the mechanical dimensions, electrical characteristics and thermodynamic parameters of the international mainstream machine platform for micron-level engineering modeling and manufacturing, the interface is completely consistent, can achieve in-situ seamless direct replacement.

How do you confirm that your products are produced by the source factory rather than changing hands by traders?

Chinsor Tech is a high-tech enterprise with a professional manufacturing base in China and a mass production plant in Taizhou, with a registered capital of 15 million RMB and dozens of core independent intellectual property rights and software copyrights. Buyers are welcome to conduct on-site factory audits.

Will the wafer manufacturing yield fluctuate after replacing your equipment components?

Since we use high-purity ceramic and quartz raw materials and apply strict hard anodized surface treatment to the metal cavity, the physical and chemical indexes and thermal field characteristics of the components are highly in line with the original factory standards, and the wafer factory can maintain a stable yield after introducing the existing process formula.

What are the international export qualifications of your semiconductor wafer manufacturing equipment components?

Our factory strictly implements the ISO 9001 quality management system, and the high-precision metal processing parts and ceramic brittle material spare parts have been sold to the United States, Malaysia, Japan, Singapore and South Korea and other overseas mature semiconductor markets for a long time, with rich international delivery experience.

Can you provide customized upgrades for old or special semiconductor wafer fabrication equipment?

Yes. As a source manufacturer with independent technology accumulation, we not only supply standard replacement spare parts, but also design and manufacture customized cavity improvement solutions according to the non-standard pain points encountered by customers’ production lines in actual processes such as film deposition, wafer heating, vacuum sealing, etc.

How long is the lead time for bulk procurement of core components of semiconductor wafer manufacturing equipment?

Thanks to the sufficient capacity and full-process independent manufacturing advantages of our Taizhou mass production plant, after receiving overseas or domestic bulk orders, we can avoid the cross-border order transfer process of traditional middlemen, quickly complete manufacturing within a few weeks and arrange on-time delivery, greatly shortening the delivery time.

Please feel free to contact us. We look forward to hearing from you.

Semiconductor Wafer Fabrication Equipment | 0040-09212

Chinsor Tech focuses on the development and manufacturing of key cavities and epitaxial components of the front-line semiconductor wafer manufacturing equipment, with independent technology accumulation and a high proportion of invention patents to enable the efficient operation of mature process production lines. Chinsor Tech has its own physical mass production plant and a complete production supply chain system. As a pure source manufacturer rather than a transshipment trader, we can directly eliminate the middleman premium for you and provide faster international order delivery speed and highly competitive direct ex-factory price.

Semiconductor Wafer Fabrication Equipment（images 7）

eight inch wafer

Applicable size

high quality aviation aluminum

Cavity material

hard anodic oxidation

Surface treatment

Get a Quote

semiconductor wafer fabrication equipment Features

Advanced coating technology reduces machine particle contamination

the surface of the internal reaction cavity of semiconductor wafer manufacturing equipment is fully treated with high-density anodic oxidation, and the film thickness is uniform and greater than 50 microns. In the face of high-intensity process gas bombardment, the number of dust particles in the cavity can be reduced by more than 85%, directly blocking wafer impurity contamination and significantly improving the yield of the chip patterning process.

High-precision CNC machining to achieve seamless in-situ substitution

all precision parts for semiconductor wafer manufacturing equipment are integrated with advanced multi-axis CNC machine tools, mechanical tolerance is strictly limited to plus or minus 0.01mm. This allows the components to be 100% seamlessly adapted to the mainstream process platform, and field engineers can complete rapid assembly without making secondary corrections.

High-purity brittle materials extend the life cycle of wearing parts

the key cover ring and shower head components inside the equipment are fully selected from electronic grade ceramics and high-purity quartz with a purity of up to 99.99%. The material has a very low substrate consumption rate in a highly corrosive plasma environment, which can extend the overall service life of components by more than 3 months, effectively reducing the procurement cost of production line consumables.

Optimize thermal field management to ensure uniform film deposition thickness

The wafer heating system in semiconductor wafer manufacturing equipment has undergone precise internal structural improvements, so that the overall surface temperature unevenness of an eight-inch wafer is controlled within plus or minus 1 degrees Celsius under a high temperature process of more than 400 degrees Celsius. This helps to greatly eliminate the edge effect of thin film deposition and ensures that the thickness of the dielectric layer is highly consistent in all areas of the wafer.

Strict helium mass spectrometry leak detection ensures a stable vacuum environment

every factory-delivered semiconductor wafer manufacturing equipment vacuum chamber component is fully loaded with a high-sensitivity helium mass spectrometer for leak detection, and the overall gas leak rate is stably controlled at a very low level. Excellent static seal retention eliminates pressure fluctuations due to trace leaks during the process, perfectly guaranteeing the stability of the chemical vapor deposition gas flow.

Impedance optimization electrode improves plasma discharge efficiency

The core conductive circuit and RF input structure of semiconductor wafer manufacturing equipment are treated with low impedance surface coating, which greatly reduces heat dissipation during high frequency energy transmission. The overall RF power transmission efficiency of the system is improved 5%, which effectively prevents the plasma from flickering or abnormally extinguishing, and ensures the continuous and efficient etching and deposition processes.

Detailed Structural Parameter Table for Semiconductor Wafer Fabrication Equipment

Core system classification	Technical parameters	Industry-wide Standards and Testing Benchmarks
Process wafer compatibility	200 mm wafer size	Compatible with internationally recognized standard notches and laser positioning grooves for wafers
Cavity main structure material	6061-T6 grade high-purity forged aluminum alloy	After a complete set of vacuum annealing stress-relieving treatments, the cavity deformation is prevented.
Cavity ultimate background vacuum	$1.0 \times 10^{-7}\text{ Torr}$ to $5.0 \times 10^{-7}\text{ Torr}$	The results were obtained through combined testing of a standard high-vacuum dry pump and a molecular pump.
Wafer heating operating temperature	Maximum operating temperature supported: 650 degrees Celsius	A multi-channel thermocouple closed-loop feedback control system is used for regulation.
RF power adapter power	Maximum 2500 watts in continuous wave operation mode	Matching standard frequency 13.56 MHz high-frequency power supply
Total gas leakage rate of the cavity	Less than $1.0 \times 10^{-9}\text{ std.cc/sec}$	Leak detection was performed using a helium mass spectrometer under fully loaded, sealed conditions.
Critical contact ceramic purity	The aluminum oxide or aluminum nitride content is greater than 99.7%.	Strictly control the elemental abundance of metallic impurities such as iron, copper, and sodium.
Uniform distribution of process gases	Porous quartz or ceramic gas spray head structure	After optimization through fluid dynamics simulation, laminar flow distribution of the airflow is ensured.

semiconductor wafer fabrication equipment comparison points

Semiconductor Wafer Fabrication Equipment（images 8）

Chinsor Tech High Stability Vacuum Reaction Chamber

In view of the pain points that mature process semiconductor wafer manufacturing equipment is prone to sudden drop of vacuum degree and abnormal termination of process due to micro-vibration at the joint of the chamber during long-term high-power operation, we have solved the problems of accelerated wear of sealing surface of vacuum valve and frequent fluctuation of air pressure by improving the design of geometric sealing groove and connection rigidity of the chamber.

Chinsor Tech Edge Temperature-Controlled Wafer Heater

In order to solve the problem that the critical dimensions of wafer edge chips exceed the standard due to too fast heat dissipation at the edge of the heating plate in the process of large-scale thin film deposition, we have designed the array power density redistribution of the internal heating wire to solve the problems of excessive temperature gradient on the wafer surface and low yield of edge chips.

Chinsor Tech Plasma Particle Resistant Ceramic Ring

In view of the pain point that traditional semiconductor wafer manufacturing equipment has to be shut down frequently for equipment maintenance due to insufficient tolerance of the cover ring and easy peeling of tiny particles to contaminate the wafer surface under frequent plasma bombardment, we have fully adopted high-purity compact ceramic consumables to solve the problem of frequent shutdown for PM reducing the overall productivity of the production line.

semiconductor wafer fabrication equipment applicable crowd

Mature process wafer foundry equipment director

suitable for senior managers responsible for the smooth operation of six-inch or eight-inch wafer production line equipment. The product can be used as a long-term stable high-quality alternative source, helping it to significantly reduce the daily annual maintenance costs of semiconductor wafer manufacturing equipment without sacrificing process yield.

Semiconductor second-hand equipment refurbishment and transformation experts

suitable for independent technical teams specializing in the renovation of old machines, functional upgrades and overall skin-pulling transformation. This equipment component provides highly compatible standard mechanical dimensions and interface specifications, which can perfectly assist it in quickly completing the reconstruction of the reaction cavity part of the old system and the recovery of process parameters.

Expansion Fab Supply Chain and Purchasing Manager

Suitable for new plant or expansion project purchasing decision makers who screen high-quality hardware supply chains on a global scale. Chinsor Tech’s high percentage of patent endorsements, ISO 9001 quality certification, and pure factory direct sales model are a perfect match for its compliance requirements against risk supply chain audits.

Microelectronics and integrated circuit research laboratory technician

suitable for equipment managers of national key micro-nano processing open platforms such as universities and research institutes. The highly reliable and cross-contamination resistant equipment components can well cope with the harsh test of a variety of unconventional process materials and frequent switching of gases on the cavity environment in scientific research tests.

semiconductor wafer fabrication equipment instructions

Deep cleaning of the sealing surface

Before loading the new components into the semiconductor wafer manufacturing equipment, the sealing surface of the cavity must be thoroughly wiped with high-purity isopropyl alcohol to ensure that the surface is free of any dust, fibers and grease residues, and then the vacuum sealing ring is accurately embedded in the positioning groove.

Precision centering and fixing

When moving key components such as heating plates or trays into semiconductor wafer manufacturing equipment, special measuring tools must be used to calibrate the relative position of the wafer placement center and the upper spray head axis to ensure that the mechanical error is within the required range to ensure the uniformity of the subsequent process.

Long-cycle vacuum baking

Do not fire the process gas immediately after the assembly is installed and the cavity is closed. The vacuum pumping system of the semiconductor wafer manufacturing equipment should be operated first, and baking should be carried out for several hours under the heating state of the machine to completely discharge the water vapor adsorbed in the cavity.

Power Gradient Load Test

When starting up the semiconductor wafer fabrication equipment for the first time, a test process with step-by-step power should be used. Inactive gas is introduced first for low-power plasma trial operation, and the standard process formula can be introduced after confirming that the reflected power of the high-frequency matching device is normal.

Know Us and Contact Us

Get a Free Quote Today.

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