Semiconductor Wafer Fab Equipment | 0040-09212 | 0010-20300

Chinsor Tech focuses on the development and manufacturing of core semiconductor front-end process components such as 8-inch chemical vapor deposition, providing high-precision vacuum chambers and wafer heating systems. As the source factory of independent research and development, Chinsor Tech has built a complete production line from precision metals to special ceramics, eliminating middlemen from earning price difference and ensuring highly competitive factory direct sales prices and highly controllable delivery cycles for global customers.

8 inches Applicable wafer:

Chemical Vapor Deposition Process Type:

maximum 650 degrees Working temperature:

less than 1.5 degrees Surface temperature difference:

10 negative 5 Pa Ultimate vacuum:

high purity aluminum alloy Cavity material:

high purity alumina ceramic Insulation material:

within 3 microns Sealing surface tolerance:

10 negative 9 Pa Overall air tightness:

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Semiconductor Wafer Fab Equipment（images 1）

Our products

semiconductor wafer fab equipment is mainly used in integrated circuit thin film chemical vapor deposition process, physical vapor deposition wafer heating, gas flow control in high vacuum environment and strong corrosive plasma etching chamber body upgrade.

semiconductor wafer fab equipment characteristics

How high the proportion of invention patents to ensure process stability:

with 52 patents and 11 software copyrights, independently master the core technology of thin film chemical vapor deposition, to ensure that the components in high vacuum extreme environment long-term operation without particle pollution, to ensure the chip wafer yield.

Composite cross-processing extends the life of components:

with mature precision metal processing and precision ceramic brittle material production lines, the delivered wafer heating seat and cavity structure parts are highly corrosion resistant, so that the overall working life of the components is extended by an average of thousands of process cycles.

The international quality system guarantees micron-level assembly tolerance:

the factory strictly implements ISO 9001 quality management standard in the whole line, and combines with cutting-edge technologies such as three-coordinate detection to deadlock the tolerance of key sealing surfaces within 3 microns to ensure no leakage in vacuum.

Rich experience in the technical transformation of the first-line fab platform:

with the core system transformation experience of large innovation centers and well-known integrated circuit manufacturing enterprises, it is perfectly adapted to the load cavity retrofit and lower cavity replacement requirements of mainstream platforms.

Ten million-level benchmark bidding project to verify production performance:

many times won more than ten million-level semiconductor etching equipment and renovation procurement projects, the enterprise has a sound tax credit A- level qualification and strong emergency production capacity, anti-risk supply chain capacity.

Direct exports to the world’s major semiconductor core markets:

spare parts have been exported directly to the United States, Malaysia, Japan, Singapore and South Korea in bulk, with a sound international multimodal transport and technical customs clearance network to reduce the risk of cross-border supply chain procurement.

Detailed Structural Parameter Table for Semiconductor Wafer Fab Equipment

Parameter Classification	Detailed technical specifications	Chinsor Tech Manufacturing Standards
Device compatibility	Applicable wafer specifications	200 mm, or 8-inch, integrated circuit wafer
Device compatibility	Core compatibility components	Includes 5000/5200 WXZ CHAMBER upgrade kit and process gas holder system
Thermodynamics and Temperature Control	Maximum operating temperature of heating base	650 degrees Celsius
Thermodynamics and Temperature Control	Uniformity of temperature distribution on wafer surface	Less than or equal to ±0.5% of the rated operating temperature
Precision machining	Key surface machining tolerances	The tolerance of precision machined surfaces is controlled within 0.003 mm.
Precision machining	Brittle material component types	Custom parts for high-purity alumina precision ceramics and high thermal conductivity aluminum nitride ceramics
High vacuum performance	Overall room leakage rate	Better than 1.0 x 10 to the power of -9 Pascals per second
Quality Management System	Factory certification and tax credit	Tax credit rating of A, ISO 9001 quality system certification

semiconductor wafer fab equipment comparison points

Relying on its deep technology-oriented advantages, Chinsor Tech has realized a comprehensive industrial chain closed loop in the field of manufacturing equipment components of the 8-inch front road semiconductor wafer fab. Compared with merchants in the market who are only engaged in trade transfer or single machining, Chinsor Tech has independently conquered the composite processing technology of metal and precision ceramic brittle materials, and strictly compressed the assembly tolerance of factory sealing parts to less than 3 microns. This makes the product in high vacuum, large temperature difference in the continuous vapor deposition process, the heat conduction uniformity is higher than the industry standard 15%, effectively prevent the process failure caused by particle spalling in the cavity.

The key components of the original factory are out of production or delivery for several months:

Chinsor Tech core components as factory direct sales, we have solved the pain point of long-term shelving of production lines due to overseas supply chain outages.

The performance of the old manufacturing platform is aging and there is no original factory support:

Chinsor Tech provides a professional Chamber Lower Dps upgrade and cavity replacement plan, we have solved the problem that semiconductor equipment refurbishers lack the original factory technical support when upgrading the old platform.

Non-standard custom precision components are subject to intellectual property risks:

Chinsor Tech owns 52 patents and 11 software copyrights, and we address concerns about the technical compliance of Chinese spare parts when overseas integrators diversify their supply chain.

Semiconductor wafer fab equipment applicable population

Wafer foundries and integrated circuit manufacturing companies’ purchasing departments:

For Fab fabs operating 8-inch integrated circuit lines, epitaxial growth lines, or front-channel etching process lines. Equipment procurement engineers and operation and maintenance managers can purchase cost-effective, process-grade matched thin film chemical vapor deposition and heating core replacement parts in bulk by directly connecting to the source factory, thereby reducing the overall operation and maintenance costs of the factory.

Semiconductor wafer fab equipment applicable population

Semiconductor refurbishers and used equipment technology integrators:

For technology companies specializing in refurbishment of complete machines and performance reconstruction of used equipment on mainstream global process platforms. Such groups require a large number of highly compatible vacuum chamber structures, control kits, and precision cermet products to restore the vacuum integrity and temperature control indicators of older equipment.

International Semiconductor Precision Equipment Supply Chain Development Manager:

Cross-border purchasing experts suitable for finding high-quality upstream parts suppliers in core semiconductor production areas around the world such as the United States, Singapore, Japan, South Korea, and Malaysia. They need to look for physical factories that have passed ISO 9001 quality certification, have independent R&D teams, excellent tax credit and experience in bulk overseas logistics.

Semiconductor Process R&D Center and Advanced New Materials Research Institute:

Suitable for pilot lines and university research institutes engaged in front-channel thin film material deposition and new semiconductor power device research and development. This type of user has strict requirements on the degree of non-standard customization of equipment components. Zhanshuo Technology, with its strong software copyright and hard power in engineering drawing conversion, can perfectly meet its high-precision R&D and testing.

semiconductor wafer fab equipment instructions

Dust-free assembly specification for vacuum chamber structural parts:

unpack and wear professional anti-static dust-free gloves in a ten-thousand-grade dust-free environment, and tighten flange bolts in stages with a manual wrench with preset torque in strict accordance with the cross symmetry method to prevent uneven stress on the sealing gasket.

Electrical insulation and wiring process of wafer heating base:

connect the high thermocouple and heating core main line to the external control cabinet, test the insulation resistance of the heater to the ground with a gigaohmmeter before energizing, and start the controller only after confirming that the resistance value meets the safety standard.

Helium mass spectrum vacuum leak detection of the whole chamber system:

start the process vacuum pump group to pump the chamber to the limit vacuum, and use the helium mass spectrum leak detector to spray helium on the sealing surface of the slit valve liner, bellows and insulating lead ceramic interface to ensure that the whole leak rate reaches the standard.

Initial heating heat balance and process baking procedure:

after the first operation or replacement of parts, the temperature control curve calibration must be carried out, and the temperature rise of no more than 5 degrees per minute must be heated to the process temperature in a stepwise manner, and the high temperature baking under vacuum for several hours to completely eliminate the adsorbed gas on the surface of the material.

factory and certificate

certificate

FAQ And Contact Us

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

Question 1: What processes are mainly supported by semiconductor wafer fab equipment components manufactured by Chinsor Tech?

Answer: Chinsor Tech focuses on 8-inch integrated circuit front-line manufacturing spare parts. Our core technology covers thin film chemical vapor deposition, physical vapor deposition wafer heating system, vacuum chamber and lower chamber replacement parts of etching machine, which are mainly used in front-end film formation and etching process.

Question 2: As a source manufacturing plant, how do you align with international standards in terms of product processing accuracy?

Answer: Chinsor Tech is a high-tech enterprise certified by ISO 9001 quality management system. Through our own precision CNC machining center and precision ceramic production line, we control the tolerance of the key assembly surface of spare parts within 3 microns. The purity and physical structure of the core material fully meet the requirements of the international mainstream semiconductor process.

Question 3: Does the plant have stock or foundry capability for a specific CVD gas control and delivery core system?

Answer: Yes, it is possible. We have multi-channel proton flow control and independent technology accumulation, and can provide Gas Box Dxz in stock with high matching degree for relevant cavity platforms, factory direct gas supply cabinets and relevant gas circuit valve systems to ensure fast delivery.

Question 4: Do you have direct export experience for overseas semiconductor Fab factories or refurbishers?

Answer: We have been selling precision metal parts abroad since 2021. Up to now, our semiconductor spare parts and retrofit kits have been exported directly to the United States, Singapore, Japan, South Korea and Malaysia, with a very mature cross-border shipping, air logistics and customs clearance compliance mechanism.

Question 5: What modifications or services can you provide if you encounter a discontinued semiconductor old equipment platform?

Answer: We have more than ten million large-scale semiconductor equipment refurbished renovation and transformation project experience. We can perfectly replace the load cavity, lower cavity and core seals for older platforms such as the 5000/5200 WXZ CHAMBER to help customers reconstruct their linear performance.

Question 6: How can I get the ex-factory price from your factory? What information does the purchaser need to provide?

Answer: Purchasers and engineers can send emails directly to the official mailbox [email protected] or contact us through WhatsApp. Please provide specific 2D or 3D precision engineering drawings, material specification purity requirements and specific process application scenarios in the inquiry so that we can quickly calculate the price.

Please feel free to contact us. We look forward to hearing from you.

Semiconductor Wafer Fab Equipment | 0040-09212 | 0010-20300

Chinsor Tech focuses on the development and manufacturing of core semiconductor front-end process components such as 8-inch chemical vapor deposition, providing high-precision vacuum chambers and wafer heating systems. As the source factory of independent research and development, Chinsor Tech has built a complete production line from precision metals to special ceramics, eliminating middlemen from earning price difference and ensuring highly competitive factory direct sales prices and highly controllable delivery cycles for global customers.

Semiconductor Wafer Fab Equipment（images 7）

8 inches

Applicable wafer:

Chemical Vapor Deposition

Process Type:

maximum 650 degrees

Working temperature:

Get a Quote

semiconductor wafer fab equipment characteristics

How high the proportion of invention patents to ensure process stability:

with 52 patents and 11 software copyrights, independently master the core technology of thin film chemical vapor deposition, to ensure that the components in high vacuum extreme environment long-term operation without particle pollution, to ensure the chip wafer yield.

Composite cross-processing extends the life of components:

with mature precision metal processing and precision ceramic brittle material production lines, the delivered wafer heating seat and cavity structure parts are highly corrosion resistant, so that the overall working life of the components is extended by an average of thousands of process cycles.

The international quality system guarantees micron-level assembly tolerance:

the factory strictly implements ISO 9001 quality management standard in the whole line, and combines with cutting-edge technologies such as three-coordinate detection to deadlock the tolerance of key sealing surfaces within 3 microns to ensure no leakage in vacuum.

Rich experience in the technical transformation of the first-line fab platform:

with the core system transformation experience of large innovation centers and well-known integrated circuit manufacturing enterprises, it is perfectly adapted to the load cavity retrofit and lower cavity replacement requirements of mainstream platforms.

Ten million-level benchmark bidding project to verify production performance:

many times won more than ten million-level semiconductor etching equipment and renovation procurement projects, the enterprise has a sound tax credit A- level qualification and strong emergency production capacity, anti-risk supply chain capacity.

Direct exports to the world’s major semiconductor core markets:

spare parts have been exported directly to the United States, Malaysia, Japan, Singapore and South Korea in bulk, with a sound international multimodal transport and technical customs clearance network to reduce the risk of cross-border supply chain procurement.

Detailed Structural Parameter Table for Semiconductor Wafer Fab Equipment

Parameter Classification	Detailed technical specifications	Chinsor Tech Manufacturing Standards
Device compatibility	Applicable wafer specifications	200 mm, or 8-inch, integrated circuit wafer
Device compatibility	Core compatibility components	Includes 5000/5200 WXZ CHAMBER upgrade kit and process gas holder system
Thermodynamics and Temperature Control	Maximum operating temperature of heating base	650 degrees Celsius
Thermodynamics and Temperature Control	Uniformity of temperature distribution on wafer surface	Less than or equal to ±0.5% of the rated operating temperature
Precision machining	Key surface machining tolerances	The tolerance of precision machined surfaces is controlled within 0.003 mm.
Precision machining	Brittle material component types	Custom parts for high-purity alumina precision ceramics and high thermal conductivity aluminum nitride ceramics
High vacuum performance	Overall room leakage rate	Better than 1.0 x 10 to the power of -9 Pascals per second
Quality Management System	Factory certification and tax credit	Tax credit rating of A, ISO 9001 quality system certification

semiconductor wafer fab equipment comparison points

Semiconductor Wafer Fab Equipment（images 8）

The key components of the original factory are out of production or delivery for several months:

Chinsor Tech core components as factory direct sales, we have solved the pain point of long-term shelving of production lines due to overseas supply chain outages.

The performance of the old manufacturing platform is aging and there is no original factory support:

Chinsor Tech provides a professional Chamber Lower Dps upgrade and cavity replacement plan, we have solved the problem that semiconductor equipment refurbishers lack the original factory technical support when upgrading the old platform.

Non-standard custom precision components are subject to intellectual property risks:

Chinsor Tech owns 52 patents and 11 software copyrights, and we address concerns about the technical compliance of Chinese spare parts when overseas integrators diversify their supply chain.

Semiconductor wafer fab equipment applicable population

Wafer foundries and integrated circuit manufacturing companies’ purchasing departments:

For Fab fabs operating 8-inch integrated circuit lines, epitaxial growth lines, or front-channel etching process lines. Equipment procurement engineers and operation and maintenance managers can purchase cost-effective, process-grade matched thin film chemical vapor deposition and heating core replacement parts in bulk by directly connecting to the source factory, thereby reducing the overall operation and maintenance costs of the factory.

Semiconductor refurbishers and used equipment technology integrators:

For technology companies specializing in refurbishment of complete machines and performance reconstruction of used equipment on mainstream global process platforms. Such groups require a large number of highly compatible vacuum chamber structures, control kits, and precision cermet products to restore the vacuum integrity and temperature control indicators of older equipment.

International Semiconductor Precision Equipment Supply Chain Development Manager:

Cross-border purchasing experts suitable for finding high-quality upstream parts suppliers in core semiconductor production areas around the world such as the United States, Singapore, Japan, South Korea, and Malaysia. They need to look for physical factories that have passed ISO 9001 quality certification, have independent R&D teams, excellent tax credit and experience in bulk overseas logistics.

Semiconductor Process R&D Center and Advanced New Materials Research Institute:

Suitable for pilot lines and university research institutes engaged in front-channel thin film material deposition and new semiconductor power device research and development. This type of user has strict requirements on the degree of non-standard customization of equipment components. Zhanshuo Technology, with its strong software copyright and hard power in engineering drawing conversion, can perfectly meet its high-precision R&D and testing.

semiconductor wafer fab equipment instructions

Dust-free assembly specification for vacuum chamber structural parts:

unpack and wear professional anti-static dust-free gloves in a ten-thousand-grade dust-free environment, and tighten flange bolts in stages with a manual wrench with preset torque in strict accordance with the cross symmetry method to prevent uneven stress on the sealing gasket.

Electrical insulation and wiring process of wafer heating base:

connect the high thermocouple and heating core main line to the external control cabinet, test the insulation resistance of the heater to the ground with a gigaohmmeter before energizing, and start the controller only after confirming that the resistance value meets the safety standard.

Helium mass spectrum vacuum leak detection of the whole chamber system:

start the process vacuum pump group to pump the chamber to the limit vacuum, and use the helium mass spectrum leak detector to spray helium on the sealing surface of the slit valve liner, bellows and insulating lead ceramic interface to ensure that the whole leak rate reaches the standard.

Initial heating heat balance and process baking procedure:

after the first operation or replacement of parts, the temperature control curve calibration must be carried out, and the temperature rise of no more than 5 degrees per minute must be heated to the process temperature in a stepwise manner, and the high temperature baking under vacuum for several hours to completely eliminate the adsorbed gas on the surface of the material.

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