Semiconductor Wafer Equipment | 0021-76708 | 0020-20691

Chinsor Tech focuses on the independent research and development and manufacturing of 8-inch integrated circuit thin film chemical vapor deposition equipment, wafer heating, vacuum chamber and other key components, providing high precision and strong stability semiconductor wafer equipment solutions for global customers. As a source manufacturing plant, Chinsor Tech has a complete production line for precision machining and ceramic brittle materials, completely eliminating middlemen, and can directly provide global buyers with highly competitive ex-factory prices, customized technical support and fast delivery cycles.

8 inches Applicable wafer size:

chemical vapor deposition and physical vapor deposition chamber Process chamber type:

room temperature to 650 degrees Celsius Wafer heating temperature:

plus or minus 1.5 degrees Celsius Temperature uniformity:

10 minus 5 Pascal Ultimate vacuum:

high purity aluminum alloy and special stainless steel Body material:

high purity alumina precision ceramics Insulating brittle material:

multi-channel proton flow control Process gas control:

less than 10 negative 9 Pascal cubic meters per second Cavity leakage rate:

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Our products

Semiconductor wafer equipment is mainly used in silicon wafer epitaxial growth process, thin film deposition process, wafer high uniformity heating conduction and plasma etching in high vacuum environment.

semiconductor wafer equipment features

How high the proportion of invention patent protection technical barriers:

with 52 patents and 11 software copyrights, the core film deposition and cavity design fully realize the accumulation of independent technology, to ensure that the equipment components in the complex process environment does not release particle pollution.

Bi-material cross processing meets the extreme working conditions:

with mature metal precision processing and ceramic brittle material production line, it can perfectly deliver composite components with high temperature resistance and plasma etching resistance, and extend the service life of key components of the equipment.

Strictly passed the international quality management system certification:

the factory implements ISO 9001 quality management standards throughout the line, from raw material incoming spectrum detection to three-coordinate precision measurement, to ensure that the assembly tolerance of factory parts is controlled within 3 microns.

Rich experience in the transformation of the first-line fab platform:

with large-scale interconnected innovation centers and well-known integrated circuit manufacturing enterprises equipment renovation experience, perfect adaptation to the mainstream platform load cavity transformation and lower cavity replacement.

Ten million benchmark projects to verify commercial performance:

many times won more than ten million semiconductor etching equipment and refurbishment procurement projects, with large quantities, high standards of stable financial, tax credit and capacity protection.

Global mature direct export capacity in overseas markets:

products have been exported to the United States, Singapore, Japan, South Korea and Malaysia in bulk, with a sound international logistics and technical support response mechanism to reduce the risk of cross-border procurement.

Detailed Structural Parameter Table for Semiconductor Wafer Equipment

Parameter Classification	Detailed technical specifications	Chinsor Tech Standard Production Parameters
Process capability	Applicable Wafer Size	200 mm (i.e., 8-inch integrated circuit wafer)
Process capability	Main Process Applications	Thin film chemical vapor deposition, physical vapor deposition with heating, plasma etching
Cavity adapter	Core Compatible Assembly	Includes upgrade parts and related spare parts for the 5000/5200 WXZ CHAMBER.
thermal properties	Maximum Heating Temp of Wafer Heating Mount	650 degrees Celsius
thermal properties	Surface temperature distribution uniformity (thermal uniformity)	Less than or equal to ±0.5% of the rated operating temperature
Mechanical and Tolerance	Machining tolerance for metal structural components	The tolerance of the key sealing surface is controlled within 0.003 mm.
Mechanical and Tolerance	Processing types of brittle materials (Ceramic Materials)	Custom parts made of alumina ceramics, aluminum nitride ceramics and special brittle materials
Vacuum and Sealing	Vacuum chamber volume leakage rate	Better than 1.0 x 10^-9 Pa·m³/s
Compliance and Qualification	Factory management and credit certifications	Tax credit rating of A, ISO 9001 quality management system certification

semiconductor wafer equipment comparison point

Relying on its deep technical-oriented strength, Chinsor Tech has achieved a high degree of autonomy in the manufacture of 8-inch thin film chemical vapor deposition equipment and key vacuum chamber components. Compared with the parts provided by ordinary traders or single processing workshops in the market, the parts of Chinsor Tech have improved the uniformity of heat conduction and the maintenance of ultimate vacuum by more than 15%. At the same time, the company has the composite processing capability of metal and ceramic dual materials, which significantly enhances the anti-spalling performance of the delivered wafer heating seat and cavity internal parts in a highly corrosive plasma environment, and greatly reduces the wafer scrap rate caused by the shedding of component particles.

Original parts are too long and expensive:

Chinsor Tech Wafer Equipment parts as source factory direct sales, we have solved the pain points of months-long waiting for key parts caused by original factory shutdowns or supply chain breaks.

Mainstream equipment old platform faces shutdown:

Chinsor Tech provides professional Chamber Lower Dps upgrade and cavity replacement program, we solve the semiconductor equipment refurbishment business in the face of the old platform parts missing can not carry out the whole machine performance upgrade problem.

Non-standard custom parts cross-border procurement compliance risk is high:

Chinsor Tech has 52 patents and strict implementation of international standards, we have addressed overseas integrators’ concerns about intellectual property rights and quality compliance when purchasing Chinese non-standard custom precision parts.

semiconductor wafer equipment for the crowd

Semiconductor equipment refurbishers and complete machine upgrades:

Suitable for companies specializing in the global mainstream semiconductor equipment platform refurbishment, technological transformation and second-hand equipment reconstruction. This group requires a large number of high-quality, highly compatible vacuum chamber parts, load chamber modification kits, and wafer heating plates to restore or improve the overall process performance of older equipment.

semiconductor wafer equipment for the crowd

Large semiconductor wafer foundry procurement and equipment department:

Suitable for manufacturing plants with 8-inch integrated circuit production lines, wafer epitaxial growth lines and etching process lines. Equipment engineers and purchasing managers can optimize plant operating costs and shorten equipment maintenance cycles by directly docking the source plant and customizing original replacement parts.

Semiconductor precision equipment integrators and upstream supply chain managers:

It is suitable for integrators with diversified global supply chain configuration in overseas semiconductor core markets such as the United States, Singapore, Japan and South Korea. They need to find high-tech enterprises with international quality certification, independent intellectual property rights and mature export experience as long-term strategic partners.

Photoelectric Pilot Research Institute and Semiconductor R & D Institution:

It is suitable for all kinds of scientific research institutes and pilot line platforms engaged in the deposition of new materials and the research and development of new semiconductor devices. Such users have high customization requirements for wafer equipment, and Chinsor Tech can perfectly meet its non-standard R & D needs with its strong software copyright and structural design capabilities.

semiconductor wafer equipment instructions

Disassembly and assembly operation of vacuum chamber:

under the ten-thousand-grade dust-free operation environment, the operator shall wear dust-free gloves, and tighten the connecting bolts of the chamber symmetrically and circularly in strict accordance with the torque specified in the drawing to ensure that the flange sealing surface is stressed evenly.

Guide for electrical connection of wafer heating base:

connect the thermocouple and heating power line of the heating base to the control cabinet. Before energizing, high megohmmeter must be used to test the insulation resistance of the heating element to the ground, so as to ensure that the temperature can be raised within a safe range.

Vacuum leak detection and limit air tightness test:

before the cavity is officially put into the process, helium mass spectrometer leak detector is used to spray helium leak detection on all dynamic and static sealing points, bellows and ceramic insulating leads to confirm that the leak rate reaches the design index.

Initial heating curve and process baking specification:

after the first use or cavity maintenance, a step-by-step heating procedure should be adopted to gradually raise the temperature to the set process temperature at a rate of 5 degrees Celsius per minute, and high-temperature vacuum baking should be carried out to eliminate adsorbed gas.

factory and certificate

certificate

FAQ And Contact Us

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

Question 1: Which mainstream platforms are the semiconductor wafer equipment components produced by Chinsor Tech mainly compatible?

Answer: Our core technology accumulation covers 8-inch integrated circuit thin film chemical vapor deposition equipment, physical vapor deposition wafer heating system and vacuum chamber. Our components and modifications are perfectly adapted and compatible with a wide range of mainstream semiconductor process equipment platforms such as the 5000/5200 WXZ CHAMBER.

Question 2: As a source factory, what specific standards do you have for product precision and quality control?

Answer: Chinsor Tech is a high-tech enterprise and has passed the ISO 9001 quality management system certification. We have 52 patents and 11 software copyrights. The manufacturing precision and assembly tolerance of key metal processing parts and ceramic brittle material products have reached the domestic leading level.

Question 3: What specific equipment modification and renovation services can you provide? Do you have experience in large-scale projects?

Answer: We have rich experience in bidding and delivery of large-scale projects. The specific transformation services include load cavity transformation, lower cavity replacement and equipment renovation of the whole machine platform. We have previously successfully delivered over 10 million equipment refurbishment projects and etching machine procurement projects.

Question 4: Do we have mature export experience in overseas Chinsor Tech and how to ensure delivery?

Answer: We have been selling metalworking parts overseas in bulk since 2021. Up to now, our metal and ceramic semiconductor spare parts have been steadily exported to countries such as the United States, Malaysia, Japan and Singapore. The source factory supplies directly, the logistics and customs declaration process is mature, and the delivery period is highly controllable.

Question 5: If we need to find specific CVD chamber components, can you provide them?

Answer: Yes. We have independent accumulation of thin film deposition and vacuum chamber technology, and can provide customization and foundry of a variety of high-precision vapor deposition core chamber components including DXZ TEOS Chamber Assy, barrier plates, and showerheads.

Question 6: How do I initiate a customized procurement inquiry with you? What information do I need to provide?

Answer: Purchasers and engineers can contact our sales team directly through our official email [email protected] or by WhatsApp. In order to quickly provide you with ex-factory price and technical evaluation, it is recommended that you attach relevant 2D or 3D technical drawings, material requirements and specific process application scenarios to your inquiry.

Please feel free to contact us. We look forward to hearing from you.

Semiconductor Wafer Equipment | 0021-76708 | 0020-20691

Chinsor Tech focuses on the independent research and development and manufacturing of 8-inch integrated circuit thin film chemical vapor deposition equipment, wafer heating, vacuum chamber and other key components, providing high precision and strong stability semiconductor wafer equipment solutions for global customers. As a source manufacturing plant, Chinsor Tech has a complete production line for precision machining and ceramic brittle materials, completely eliminating middlemen, and can directly provide global buyers with highly competitive ex-factory prices, customized technical support and fast delivery cycles.

8 inches

Applicable wafer size:

chemical vapor deposition and physical vapor deposition chamber

Process chamber type:

room temperature to 650 degrees Celsius

Wafer heating temperature:

Get a Quote

semiconductor wafer equipment features

How high the proportion of invention patent protection technical barriers:

with 52 patents and 11 software copyrights, the core film deposition and cavity design fully realize the accumulation of independent technology, to ensure that the equipment components in the complex process environment does not release particle pollution.

Bi-material cross processing meets the extreme working conditions:

with mature metal precision processing and ceramic brittle material production line, it can perfectly deliver composite components with high temperature resistance and plasma etching resistance, and extend the service life of key components of the equipment.

Strictly passed the international quality management system certification:

the factory implements ISO 9001 quality management standards throughout the line, from raw material incoming spectrum detection to three-coordinate precision measurement, to ensure that the assembly tolerance of factory parts is controlled within 3 microns.

Rich experience in the transformation of the first-line fab platform:

with large-scale interconnected innovation centers and well-known integrated circuit manufacturing enterprises equipment renovation experience, perfect adaptation to the mainstream platform load cavity transformation and lower cavity replacement.

Ten million benchmark projects to verify commercial performance:

many times won more than ten million semiconductor etching equipment and refurbishment procurement projects, with large quantities, high standards of stable financial, tax credit and capacity protection.

Global mature direct export capacity in overseas markets:

products have been exported to the United States, Singapore, Japan, South Korea and Malaysia in bulk, with a sound international logistics and technical support response mechanism to reduce the risk of cross-border procurement.

Detailed Structural Parameter Table for Semiconductor Wafer Equipment

Parameter Classification	Detailed technical specifications	Chinsor Tech Standard Production Parameters
Process capability	Applicable Wafer Size	200 mm (i.e., 8-inch integrated circuit wafer)
Process capability	Main Process Applications	Thin film chemical vapor deposition, physical vapor deposition with heating, plasma etching
Cavity adapter	Core Compatible Assembly	Includes upgrade parts and related spare parts for the 5000/5200 WXZ CHAMBER.
thermal properties	Maximum Heating Temp of Wafer Heating Mount	650 degrees Celsius
thermal properties	Surface temperature distribution uniformity (thermal uniformity)	Less than or equal to ±0.5% of the rated operating temperature
Mechanical and Tolerance	Machining tolerance for metal structural components	The tolerance of the key sealing surface is controlled within 0.003 mm.
Mechanical and Tolerance	Processing types of brittle materials (Ceramic Materials)	Custom parts made of alumina ceramics, aluminum nitride ceramics and special brittle materials
Vacuum and Sealing	Vacuum chamber volume leakage rate	Better than 1.0 x 10^-9 Pa·m³/s
Compliance and Qualification	Factory management and credit certifications	Tax credit rating of A, ISO 9001 quality management system certification

semiconductor wafer equipment comparison point

Original parts are too long and expensive:

Chinsor Tech Wafer Equipment parts as source factory direct sales, we have solved the pain points of months-long waiting for key parts caused by original factory shutdowns or supply chain breaks.

Mainstream equipment old platform faces shutdown:

Chinsor Tech provides professional Chamber Lower Dps upgrade and cavity replacement program, we solve the semiconductor equipment refurbishment business in the face of the old platform parts missing can not carry out the whole machine performance upgrade problem.

Non-standard custom parts cross-border procurement compliance risk is high:

Chinsor Tech has 52 patents and strict implementation of international standards, we have addressed overseas integrators’ concerns about intellectual property rights and quality compliance when purchasing Chinese non-standard custom precision parts.

semiconductor wafer equipment for the crowd

Semiconductor equipment refurbishers and complete machine upgrades:

Suitable for companies specializing in the global mainstream semiconductor equipment platform refurbishment, technological transformation and second-hand equipment reconstruction. This group requires a large number of high-quality, highly compatible vacuum chamber parts, load chamber modification kits, and wafer heating plates to restore or improve the overall process performance of older equipment.

Large semiconductor wafer foundry procurement and equipment department:

Suitable for manufacturing plants with 8-inch integrated circuit production lines, wafer epitaxial growth lines and etching process lines. Equipment engineers and purchasing managers can optimize plant operating costs and shorten equipment maintenance cycles by directly docking the source plant and customizing original replacement parts.

Semiconductor precision equipment integrators and upstream supply chain managers:

It is suitable for integrators with diversified global supply chain configuration in overseas semiconductor core markets such as the United States, Singapore, Japan and South Korea. They need to find high-tech enterprises with international quality certification, independent intellectual property rights and mature export experience as long-term strategic partners.

Photoelectric Pilot Research Institute and Semiconductor R & D Institution:

It is suitable for all kinds of scientific research institutes and pilot line platforms engaged in the deposition of new materials and the research and development of new semiconductor devices. Such users have high customization requirements for wafer equipment, and Chinsor Tech can perfectly meet its non-standard R & D needs with its strong software copyright and structural design capabilities.

semiconductor wafer equipment instructions

Disassembly and assembly operation of vacuum chamber:

under the ten-thousand-grade dust-free operation environment, the operator shall wear dust-free gloves, and tighten the connecting bolts of the chamber symmetrically and circularly in strict accordance with the torque specified in the drawing to ensure that the flange sealing surface is stressed evenly.

Guide for electrical connection of wafer heating base:

connect the thermocouple and heating power line of the heating base to the control cabinet. Before energizing, high megohmmeter must be used to test the insulation resistance of the heating element to the ground, so as to ensure that the temperature can be raised within a safe range.

Vacuum leak detection and limit air tightness test:

before the cavity is officially put into the process, helium mass spectrometer leak detector is used to spray helium leak detection on all dynamic and static sealing points, bellows and ceramic insulating leads to confirm that the leak rate reaches the design index.

Initial heating curve and process baking specification:

after the first use or cavity maintenance, a step-by-step heating procedure should be adopted to gradually raise the temperature to the set process temperature at a rate of 5 degrees Celsius per minute, and high-temperature vacuum baking should be carried out to eliminate adsorbed gas.