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For high-density packaging and thin wafer processing, we provide micron-level precision semiconductor wafer dicing key components and tool components, significantly reducing cutting edge and improving wafer yield. As the source manufacturing plant of the self-built production line, Chinsor Tech eliminates the middleman link and can provide cost-effective bulk supply services and rapid delivery response for global fabs.
This product is mainly used in silicon-based wafer cutting, silicon carbide third-generation semiconductor dicing, high-density integrated circuit back-end packaging and MEMS chip separation.
The flange coaxiality can reach 0.002mm through high-precision numerical control grinding process, which reduces the high-frequency vibration during cutting by 65% and effectively prevents micro-cracks on the wafer edge.
nano-scale diamond-like carbon-based coating is adopted to increase the wear-resistant life of the blade assembly by 40%, significantly prolonging the tool change cycle of continuous operation of high-strength semiconductor wafer dicing.
the internal fluid dynamic structure can make the cooling water evenly cover the cutting channel, reduce the heat affected zone of the dicing area by 50%, and completely eliminate the wafer delamination caused by thermal stress.
The precision knife holder assembly process strictly controls the edge size of the back and front sides of the wafer within 5 microns, which increases the bending strength of the chip by 25% and greatly improves the yield of the back-end package.
under the high-speed operation of 60000 revolutions per minute, the dynamic balance level reaches G0.4, reducing the wear rate of equipment bearings by 30%, and ensuring that the dicing process track has no deviation.
suitable for high hardness brittle materials such as silicon wafers, silicon carbide and gallium nitride, the width of the dicing lane is narrowed to 20 microns, and the chip output rate of a single wafer is increased by nearly 8%.
In the semiconductor wafer dicing process, the traditional cutting components often cause micro-jitter due to poor dynamic balance, which destroys the chip edge structure. With its self-developed micron-level ultra-fine machining technology and strict dynamic balance detection system, Chinsor Tech has achieved ultra-high and stable operation of dicing components at extremely high speeds, helping fabs significantly reduce dicing losses. In addition, as a manufacturer of high-end semiconductor equipment parts, Chinsor Tech adopts high-purity corrosion-resistant alloy materials and special surface treatment technology, so that dicing-related parts can remain rust-free and deformation-free under long-term contact with deionized water and high-stress environment, and its comprehensive service life is improved by more than 35% compared with common alternatives in the industry.
Chinsor Tech controls the edge size at the micron level through micron-level coaxiality and high-rigidity structural design, significantly reducing the fragmentation rate of ultra-thin wafers during the dicing process.
Chinsor Tech introduces high-hardness carbon-based coatings and optimized flow channels to solve the problems of severe tool wear and local thermal damage when dicing third-generation semiconductors such as silicon carbide.
Chinsor Tech relies on the complete production line of domestic source factories to provide high-quality alternatives, shortening the delivery cycle by 60% and significantly reducing procurement costs.
need to find high-quality, cost-effective dicing consumables and key components of equipment to reduce the total cost of production and ensure the supply chain security of wafer dicing processes.
dedicated to solving the problems of edge chipping, delamination and stress cracking in high-density packaging and thin chip cutting, and improving the yield and production efficiency of post-road scribing.
need to purchase high-matching, high-precision dicing machine knife seats and components, quickly restore the processing performance indicators of high-precision dicing equipment.
focuses on the development of dicing processes for high-hardness wafers such as silicon carbide and gallium nitride, requiring the support of customized dicing structures with high rigidity and wear resistance.
Clean the contact surface between the mounting flange and the spindle with a high-purity dust-free cloth to ensure that no debris particles remain and prevent eccentric assembly.
Use a special torque wrench to tighten evenly according to the specified torque to avoid excessive tightening causing micro-deformation of the blade assembly.
adjust the angle and flow rate of deionized water nozzle to ensure that the spray point accurately covers the cutting area of the dicing lane and takes away heat in time.
after starting for the first time or replacing components, the low-speed test run and dynamic balance calibration shall be carried out first, and the operation shall be loaded after confirming that there is no abnormal vibration.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
± 1 micron
Cutting accuracy
less than 5 microns
Edge chipping control
50 to 775 microns
Applicable thickness
Wuxi Zhanshuo