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Our high-end parts and equipment refurbishment services significantly extend equipment life and directly reduce semiconductor wafer cost. Chinsor Tech is a source manufacturing plant with 52 patents. It refuses middlemen and provides you with competitive factory reserve price and on-time delivery guarantee.
Core components and refurbishment solutions are mainly used in core process scenarios such as thin film deposition, physical vapor deposition, vacuum chamber and wafer heating.
Made of high-purity ceramic brittle materials, the corrosion resistance is improved by 40%, the maintenance period is extended to six months, and the semiconductor wafer cost is directly reduced.
The temperature uniformity of the heating module is controlled within plus or minus one degree, eliminating wafer scrap caused by local overheating and reducing high semiconductor material loss costs.
the surface roughness of metal processing parts reaches nanoscale, greatly reducing the particle pollution of vacuum chamber, so that the yield of eight-inch wafer production is stable above 99% for a long time.
provide standardized lower chamber replacement module, install alignment accuracy of 10 microns, shorten equipment replacement time from 3 days to 12 hours, and improve production line operation rate.
as a leading manufacturer in China, we provide TIN Chamber Assy price with great advantages, which is 30% lower than the original cost under the same performance.
Through comprehensive physical vapor deposition equipment renovation services, the old machines that are about to be phased out are restored to factory operating accuracy, extending the service life of the equipment by 5 years.
Compared with the conventional third-party alternatives on the market, the semiconductor components provided by Chinsor Tech have reached the international leading level in material purity and processing accuracy. Relying on a large number of core patented technologies, we ensure that each ceramic or metal processing part can perfectly fit the eight-inch wafer process, which not only performs well in physical vapor deposition and other links, but also greatly reduces the overall energy consumption and daily depreciation of the equipment, thus systematically optimizing the semiconductor of wafer cost. Chinsor Tech’s equipment refurbishment service is not limited to simple one-to -1 replacement of parts, but goes deep into the optimization and upgrading of the bottom layer of the system. Relying on our deep technical accumulation in the field of thin film deposition and vacuum chambers, we can restore the production yield of aging machines to the best factory condition. Under the same transformation standard, our solution has a shorter delivery cycle and a higher pass rate for one test.
Chinsor Tech source direct supply mode to break the price barrier of original spare parts, provide you with generous GAS BOX EC WXZ price, and directly reduce the procurement budget by 30%.
Chinsor Tech nano-scale polishing process to eliminate the defects of particles that are easy to fall from ordinary replacement parts, ensure that the chamber is highly clean, and avoid the risk of wafer batch scrap.
Chinsor Tech’s full chamber transformation program to inject new kinetic energy into the old machine, avoid the high replacement cost of the whole machine phase-out, and maximize the production capacity of old assets.
Responsible for controlling the annual operating budget, by looking for cost-effective source manufacturers, comparing IMP Chamber ASSY price and other core material costs, greatly reducing equipment maintenance budget and semiconductor wafer cost.
Responsible for the daily maintenance and emergency troubleshooting of the equipment, and urgently need metal or ceramic spare parts with accurate size and high corrosion resistance to reduce the number of unplanned downtime and reduce the difficulty of high-intensity maintenance.
To undertake the renovation projects of old machines in major wafer manufacturing plants, it is necessary to find parts factories with independent software copyright and hardware technical support, so as to control material costs while ensuring quality.
It is committed to optimizing the mass production process of eight-inch wafers, requiring extremely high-precision wafer heating and film deposition core components to verify the stability of the new process and strictly control the cost of single-chip research and development.
Remove the vacuum package in a 100-level clean room environment, and use a high-power microscope to carefully check the surface of the parts to confirm that there are no scratches and particles attached.
Shut down the production equipment safely according to the regulations and fully cool down, and use a dust-free cloth dipped in high-purity isopropyl alcohol to thoroughly clean the internal installation base of the equipment.
Place the parts smoothly into the vacuum chamber with the help of the special positioning tooling, and use a precision torque wrench to evenly tighten all the fixing screws in a cross sequence.
After sealing the equipment, start the high-pressure vacuum pump to test the overall leakage rate, and then raise the temperature to the standard operating temperature step by step to verify the thermal stability.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
Thin film deposition
Process
precision ceramic
Material
micron level
Tolerance
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