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The high-precision semiconductor vacuum parts produced by Chinsor Tech has ultra-low outgassing rate and sub-micron sealing surface accuracy, which can significantly improve the vacuum stability of the front process cavity. As a source manufacturer with its own core technology, Chinsor Tech cuts all trader premiums, provides direct ex-factory prices, and enables faster global response delivery for mass customization needs.
Semiconductor vacuum parts are mainly used in the reaction chamber connection of integrated circuit thin film deposition system, the wafer heating stage sealing of physical vapor deposition process, the vacuum shielding of the lower chamber of etching equipment, and the vacuum isolation locking device of the inlet and outlet chamber.
select high-purity oxygen-free copper and special dense ceramic substrates, vacuum high-temperature baking down the outgassing rate reduced by 85%, prevent volatiles from polluting the cavity, to ensure the wafer film process of high purity environment.
the sealing surface is polished by nanoscale chemical mechanical polishing, and the flatness of the mating surface is controlled within 0.003mm, thus completely eliminating the risk of vacuum leakage and improving the pumping efficiency of the pump valve system in the fab by 30%.
The core structure can withstand severe temperature changes of 200 degrees Celsius per minute without microcracking, preventing the vacuum collapse of the component due to thermal fatigue in the continuous high temperature deposition process.
through five-axis micron-level precision numerical control grinding, the micro-stress concentration of ceramic edges is eliminated, and the overall fracture toughness of spare parts is increased by 45%, which greatly prolongs the continuous operation cycle of the equipment.
The surface is treated with special hardened coating, which improves the anti-corrosion plasma bombardment capacity by 2 times, avoids wafer cross-contamination caused by metal particle peeling, and improves the production line yield of the front-end process.
before leaving the factory, it has undergone rigorous full-load pressure maintenance test and helium mass spectrometry full-volume leak detection to ensure that every fastening and sealing component delivered to the site meets the industry’s high standard of zero defect requirements.
Relying on the independent technology accumulation in the field of semiconductor special ceramics and metal processing, Chinsor Tech has successfully overcome the industry problem that high vacuum components are easy to deform under long-term alternating thermal stress. The semiconductor vacuum parts produced by us not only have the size completely in line with the elevation standard, but also reduce the air resistance of the contact surface to a very low level by optimizing the internal flow channel and shunt sealing structure, and the overall vacuum retention performance is obviously better than that of ordinary machined parts lacking previous process understanding. In addition, since Chinsor Tech has a complete production line from raw material finishing to post-surface modification, we can make highly flexible and customized changes to the specific cavity modifications (e. g. in-out chamber modifications, cavity replacement) of fabs and refurbishers. This allows the product to have a high degree of flexibility in the adaptation, while shortening the customer procurement cycle, can make the overall sealing system life more than 1 times.
Chinsor Tech high-precision vacuum spare parts solve the micro-leakage phenomenon caused by the micro-waviness of the mating surface of traditional spare parts through ultra-precision grinding technology.
Chinsor Tech precision ceramic parts through vacuum degassing and high purity control, to solve the problem of ordinary parts at high temperature release of trace impurity gas, thereby destroying the film quality.
Chinsor Tech wear-resistant vacuum parts adopt surface hardening and low friction coefficient technology, which solves the problem that stainless steel and other materials are prone to cold welding under high vacuum temperature and cause parts to lock.
Suitable for technicians responsible for on-site operation and maintenance of CVD, PVD and etching workshops. The product can directly replace the original high-loss vacuum consumables, to meet the factory for high vacuum stability and low air pollution of the rigid process requirements.
suitable for professional teams engaged in the upgrading of old platform equipment and cavity renovation. Chinsor Tech provides high-precision replacement parts for inlet and outlet chambers and vacuum chambers to assist refurbishers in efficiently restoring the air tightness index of the whole machine.
Suitable for professional manufacturers who design complete vacuum exhaust systems and precision valve sets. The supply of high-performance components can improve the technical competitiveness of its complete system and help it obtain large orders.
applicable to all types of semiconductor pilot process test lines and research institutes. Meet its custom needs for non-standard, high-specification vacuum components in the development of a new generation of vacuum film deposition and special gas degradation processes.
Multi-layer vacuum packaging must be opened in the ten thousand or hundred dust-free purification workshop. Wear dust-free gloves and wipe the metal and ceramic surfaces with high purity isopropyl alcohol. It is forbidden to touch the sealing surface with bare hands to prevent grease contamination.
Carefully place the vacuum assembly into the predetermined flange slot of the reaction chamber or tubing. Use a special positioning pin for axial and flatness alignment to ensure that the sealing ring or metal gasket is evenly stressed around to prevent excessive pressure on one side.
Using a precision torque wrench, apply the torque in multiple steps in a star diagonal sequence. It is strictly forbidden to lock a single bolt at one time. It is necessary to ensure that the flange surface is parallel and closed to avoid excessive local stress from damaging the micron flatness of the component.
After installation, vacuum the system and start heating baking stage to accelerate the removal of gas adsorbed on the surface. At the same time, helium mass spectrometer leak detector is used to spray helium on all connection ports to confirm that the leak rate reaches the process index.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
10 negative 10 times per second
Limit leakage rate:
0.1 microns
Surface roughness:
3.95 grams per cubic centimeter
Material density:
Wuxi Zhanshuo