Semiconductor Spare Parts | 0020-70376

Chinsor Tech focuses on the R & D and manufacturing of key semiconductor equipment components, providing high-precision, long-life semiconductor spare parts that fully meet the original factory process standards for global fabs. Chinsor Tech is a source factory with independent intellectual property rights and advanced processing and manufacturing capabilities. There is no middleman to earn the difference, which can not only greatly reduce your purchase cost, but also ensure faster delivery and stable batch supply.

high purity alumina ceramic and special alloy Material:

0.005mm Machining accuracy:

0.1 microns Surface roughness:

1600 degrees Celsius Withstand temperature:

8 inches Applicable wafer size:

10 to the negative 9 power Air leakage rate:

10 ultra clean room cleaning Cleanliness standard:

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Our products

Semiconductor spare parts is mainly used in integrated circuit thin film chemical vapor deposition equipment, physical vapor deposition wafer heating system, high vacuum chamber sealing components and plasma etching machine reaction chamber.

semiconductor Spare parts Characteristics

High-purity materials avoid wafer contamination:

alumina and special high-purity metals with purity greater than 99.7 percent are used to prevent impurities from being released under high temperature and strong corrosive plasma environment, effectively avoiding wafer contamination by metal ions and improving chip yield.

Micron processing ensures perfect replacement:

the shape and position tolerance of key parts is controlled within 0.005mm, ensuring that the size of spare parts is fully compatible with the original equipment, realizing zero seamless assembly and reducing assembly wear caused by matching clearance.

Excellent corrosion resistance to extend the working life:

after special surface treatment and densification process, spare parts have strong corrosion resistance to fluorine-based and chlorine-based plasma, and the continuous operation cycle of the equipment is extended by more than 35%.

Optimized film deposition with high thermal uniformity:

The heating plate and the carrier parts have excellent thermal conductivity, and the temperature uniformity reaches plus or minus 1 degree Celsius in the working range of 300 to 500 degrees Celsius, ensuring uniform film deposition thickness.

Harsh ultra-clean cleaning realizes immediate disassembly and assembly:

all parts must be cleaned by high-pressure deionized water and ultrasonic dust removal before leaving the factory, and double-layer vacuum packaging must be completed in a 10-level ultra-clean environment, and buyers can directly install on the machine after receiving it.

Independent patented technology breaks the technical monopoly:

relying on 52 independent intellectual property rights, it has overcome the difficult problems of brittle material processing and precision cavity welding, providing a cost-effective domestic alternative, and the procurement cost is reduced by 40% compared with the original factory.

Detailed structural parameters of semiconductor spare parts

Parameter name	Specifications and Technical Specifications	Applicable Platforms
Main materials	High-purity ceramics (Al2O3 > 99.7%) / Anodized aluminum alloy / Fluororubber	AMAT Centura 5200 platform
Ultimate vacuum level	1.0e-7 Torr	PVD wafer heating system
Thermal Uniformity	≤ ±1°C (at an operating temperature of 450°C)	CVD thin film deposition equipment with 5000/5200 WXZ CHAMBER
Gas Distribution Component	High-precision micro-hole machining (hole diameter consistency ≤ ±0.01 mm)	Blocker Plate Dxz for specific reaction chambers
Core cavity structure (Chamber Structure)	Overall airtightness and resistance to plasma etching	High-density plasma Chamber Body Hdp-cvd
Particle control	≤ 5 (≥ 0.13 μm per wafer cycle)	8-inch integrated circuit production line

semiconductor spare parts comparison points

Chinsor Tech has a deep technical accumulation, and has reached the domestic leading level in the processing of ceramic brittle materials and metal cavity welding technology. Compared with ordinary spare parts, semiconductor spare parts produced by Chinsor Tech have higher wear resistance and thermal stability, can maintain structural integrity under continuous high-power plasma bombardment, and significantly reduce unplanned downtime caused by frequent component replacement in the fab. Combined with rich experience in batch export, Chinsor Tech has built a strict quality tracking system, and each product has passed ISO 9001 certification and full inspection of high-precision testing instruments. On the premise of maintaining the same or even higher service life as the original spare parts, our products have shortened the delivery cycle by nearly half, providing a strong guarantee of both capital and time for the customer’s supply chain security.

Cavity cross-contamination elimination:

For traditional third-party spare parts due to lack of purity caused by the inner wall of the cavity peeling, contamination of wafers, we have solved the parts material microstructure is not dense, easy to release tiny particles of the industry pain point.

Process window drift repair:

In view of the high temperature deformation of spare parts due to thermal expansion coefficient mismatch, which affects the uniformity of the film, we have solved the instability of process parameters and yield fluctuations caused by thermal deformation of parts.

Old platform cut-off rescue:

in view of many 8-inch fabs facing the original old equipment parts production, can not buy the original genuine problem, we solved the old platform core spare parts (such as specific models of airflow distribution board Blocker Plate Dxz) difficult to purchase, equipment facing the crisis of scrap.

semiconductor spare parts for people

Purchasing Manager of Large Semiconductor Wafer Manufacturing Plant:

Suitable for medium and large integrated circuit fabs that are looking to reduce the manufacturing cost per wafer, optimize the supply chain spare parts inventory, and require suppliers to have ISO 9001 certification and tax credit A- level qualifications.

Semiconductor refurbishment equipment manufacturers:

suitable for engineers who focus on the refurbishment and upgrade of mainstream platform equipment such as applied materials. They need non-standard customized metal and ceramic parts with high precision and perfect process matching (such as the matching upgrade components of 5000/5200 WXZ CHAMBER) to restore equipment performance.

Wafer fab area equipment maintenance engineer:

suitable for on-site engineering teams responsible for the daily maintenance of film deposition or etching machines and having extremely high technical requirements on the form and position tolerances of spare parts and material purity, providing high-reliability spare parts including Chamber Body Hdp-cvd lining components that can be directly replaced in situ.

Semiconductor spare parts overseas independent agents:

suitable for professional B2B trade service providers distributed in the United States, Singapore, Japan, South Korea, Malaysia and other overseas markets to help them expand their high-quality, high-profit third-party alternative spare parts product line.

Instructions for using semiconductor spare parts

Unpacking inspection:

the double-layer vacuum packaging of spare parts must be unpacked in a clean room of Grade 100 or Grade 10 that meets the standard, and dust-free gloves must be worn to check the appearance for transportation bumps.

Surface cleaning:

Before installation, use high-purity isopropyl alcohol to wipe the sealing point and mating surface of the spare part to ensure that there are no micro-particles left.

In-situ assembly:

in strict accordance with the torque requirements of the original equipment technical manual, use special tools to fix the spare parts at the corresponding position of the cavity to avoid uneven force.

Vacuum test:

after closing the cavity, vacuum and leak rate test shall be carried out for at least 24 hours, and ventilation and heating shall be started after confirming that all indicators meet the process requirements.

factory and certificate

certificate

FAQ And Contact Us

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

Q1: Can the semiconductor spare parts produced by Chinsor Tech completely replace the original parts?

A1: Yes. In the process of research and development and manufacturing, our products strictly refer to the original factory form and position tolerance and material specification, with a processing accuracy of 0.005mm, which can perfectly replace the 8-inch film deposition and etching equipment spare parts of mainstream platforms.

Q2: Can you provide specific refurbished parts for older machines such as the 5000/5200 WXZ CHAMBER?

A2: Yes. We have deep experience in equipment renovation of mainstream platforms, and have provided equipment renovation and key component supply services for core institutions such as Wuxi Internet of Things Innovation Promotion Center.

Q3: Why choose a source factory like Chinsor Tech instead of a trader?

A3: As a source manufacturing factory, we have our own production workshop, 52 patented technologies and independent supply chain. This means that we can eliminate middleman profits and directly provide you with competitive ex-factory prices and shorter lead times.

Q4: How do you ensure that the semiconductor spare parts shipped from the factory will not cause particle contamination to our wafers?

A4: Our parts are subjected to extremely strict ultrasonic deep cleaning before leaving the factory, and double-layer vacuum packaging is carried out in a Class 10 ultra-clean room. This ensures that the product has a very high level of cleanliness when it arrives at the site, allowing it to be dismantled and installed.

Q5: For advanced thin film processes, can you provide high precision airflow components such as Blocker Plate Dxz?

A5: Yes. We have a wealth of independent technology accumulation in thin film deposition, wafer heating and vacuum chamber processes, and can provide precision gas distribution and flow blocking components that meet the requirements of micron-level processing.

Q6: If we need some customized non-standard precision parts, do you support customization?

A6: Support. We have a strong engineering research and development team and precision processing equipment, which can carry out precision mapping and proofing according to the technical drawings or actual samples provided by customers, so as to quickly meet the customized upgrading needs of fabs.

Please feel free to contact us. We look forward to hearing from you.

Semiconductor Spare Parts | 0020-70376

Chinsor Tech focuses on the R & D and manufacturing of key semiconductor equipment components, providing high-precision, long-life semiconductor spare parts that fully meet the original factory process standards for global fabs. Chinsor Tech is a source factory with independent intellectual property rights and advanced processing and manufacturing capabilities. There is no middleman to earn the difference, which can not only greatly reduce your purchase cost, but also ensure faster delivery and stable batch supply.

high purity alumina ceramic and special alloy

Material:

0.005mm

Machining accuracy:

0.1 microns

Surface roughness:

Get a Quote

semiconductor Spare parts Characteristics

High-purity materials avoid wafer contamination:

alumina and special high-purity metals with purity greater than 99.7 percent are used to prevent impurities from being released under high temperature and strong corrosive plasma environment, effectively avoiding wafer contamination by metal ions and improving chip yield.

Micron processing ensures perfect replacement:

the shape and position tolerance of key parts is controlled within 0.005mm, ensuring that the size of spare parts is fully compatible with the original equipment, realizing zero seamless assembly and reducing assembly wear caused by matching clearance.

Excellent corrosion resistance to extend the working life:

after special surface treatment and densification process, spare parts have strong corrosion resistance to fluorine-based and chlorine-based plasma, and the continuous operation cycle of the equipment is extended by more than 35%.

Optimized film deposition with high thermal uniformity:

The heating plate and the carrier parts have excellent thermal conductivity, and the temperature uniformity reaches plus or minus 1 degree Celsius in the working range of 300 to 500 degrees Celsius, ensuring uniform film deposition thickness.

Harsh ultra-clean cleaning realizes immediate disassembly and assembly:

all parts must be cleaned by high-pressure deionized water and ultrasonic dust removal before leaving the factory, and double-layer vacuum packaging must be completed in a 10-level ultra-clean environment, and buyers can directly install on the machine after receiving it.

Independent patented technology breaks the technical monopoly:

relying on 52 independent intellectual property rights, it has overcome the difficult problems of brittle material processing and precision cavity welding, providing a cost-effective domestic alternative, and the procurement cost is reduced by 40% compared with the original factory.

Detailed structural parameters of semiconductor spare parts

Parameter name	Specifications and Technical Specifications	Applicable Platforms
Main materials	High-purity ceramics (Al2O3 > 99.7%) / Anodized aluminum alloy / Fluororubber	AMAT Centura 5200 platform
Ultimate vacuum level	1.0e-7 Torr	PVD wafer heating system
Thermal Uniformity	≤ ±1°C (at an operating temperature of 450°C)	CVD thin film deposition equipment with 5000/5200 WXZ CHAMBER
Gas Distribution Component	High-precision micro-hole machining (hole diameter consistency ≤ ±0.01 mm)	Blocker Plate Dxz for specific reaction chambers
Core cavity structure (Chamber Structure)	Overall airtightness and resistance to plasma etching	High-density plasma Chamber Body Hdp-cvd
Particle control	≤ 5 (≥ 0.13 μm per wafer cycle)	8-inch integrated circuit production line

semiconductor spare parts comparison points

Cavity cross-contamination elimination:

For traditional third-party spare parts due to lack of purity caused by the inner wall of the cavity peeling, contamination of wafers, we have solved the parts material microstructure is not dense, easy to release tiny particles of the industry pain point.

Process window drift repair:

In view of the high temperature deformation of spare parts due to thermal expansion coefficient mismatch, which affects the uniformity of the film, we have solved the instability of process parameters and yield fluctuations caused by thermal deformation of parts.

Old platform cut-off rescue:

in view of many 8-inch fabs facing the original old equipment parts production, can not buy the original genuine problem, we solved the old platform core spare parts (such as specific models of airflow distribution board Blocker Plate Dxz) difficult to purchase, equipment facing the crisis of scrap.

semiconductor spare parts for people

Purchasing Manager of Large Semiconductor Wafer Manufacturing Plant:

Suitable for medium and large integrated circuit fabs that are looking to reduce the manufacturing cost per wafer, optimize the supply chain spare parts inventory, and require suppliers to have ISO 9001 certification and tax credit A- level qualifications.

Semiconductor refurbishment equipment manufacturers:

suitable for engineers who focus on the refurbishment and upgrade of mainstream platform equipment such as applied materials. They need non-standard customized metal and ceramic parts with high precision and perfect process matching (such as the matching upgrade components of 5000/5200 WXZ CHAMBER) to restore equipment performance.

Wafer fab area equipment maintenance engineer:

suitable for on-site engineering teams responsible for the daily maintenance of film deposition or etching machines and having extremely high technical requirements on the form and position tolerances of spare parts and material purity, providing high-reliability spare parts including Chamber Body Hdp-cvd lining components that can be directly replaced in situ.

Semiconductor spare parts overseas independent agents:

suitable for professional B2B trade service providers distributed in the United States, Singapore, Japan, South Korea, Malaysia and other overseas markets to help them expand their high-quality, high-profit third-party alternative spare parts product line.

Instructions for using semiconductor spare parts

Unpacking inspection:

the double-layer vacuum packaging of spare parts must be unpacked in a clean room of Grade 100 or Grade 10 that meets the standard, and dust-free gloves must be worn to check the appearance for transportation bumps.

Surface cleaning:

Before installation, use high-purity isopropyl alcohol to wipe the sealing point and mating surface of the spare part to ensure that there are no micro-particles left.

In-situ assembly:

in strict accordance with the torque requirements of the original equipment technical manual, use special tools to fix the spare parts at the corresponding position of the cavity to avoid uneven force.

Vacuum test:

after closing the cavity, vacuum and leak rate test shall be carried out for at least 24 hours, and ventilation and heating shall be started after confirming that all indicators meet the process requirements.

Know Us and Contact Us

Get a Free Quote Today.

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