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Chinsor Tech focuses on the precision manufacturing of key core components such as high-quality semiconductor thin film deposition, wafer heating of physical vapor deposition equipment and vacuum chambers. With its own patented technology and ISO 9001 stringent quality inspection, it provides one-stop semiconductor parts processing services that meet advanced process standards for global fabs. Chinsor Tech, as an entity source manufacturer, has its own production base and advanced processing center, refuses to increase prices at all levels by middlemen, and directly provides global buyers with highly competitive ex-factory prices, faster customized delivery and stable supply guarantee in large quantities.
Semiconductor component manufacturing is mainly used in integrated circuit wafer fab chemical vapor deposition equipment, physical vapor deposition etching machine, epitaxial growth equipment and vacuum interlocking drive chamber.
The advanced process CNC machining center is adopted, and the machining tolerance is precisely controlled within ± 0.001mm, which perfectly meets the strict requirements of chip manufacturing equipment for high repetitive positioning accuracy.
ceramic and aviation-grade aluminum alloys with a purity of up to 99.7 percent are selected to maintain excellent physical and chemical stability in strong acid, alkali and corrosive plasma bombardment environments.
the leakage rate of vacuum chamber parts is strictly controlled below 10 minus 9 millibar per second to ensure that key process links such as thin film deposition are stable in ultra-high vacuum environment.
Wafer heating plate technology with independent intellectual property rights, so that the wafer surface heating temperature non-uniformity of less than 0.5, greatly improve the thickness uniformity and yield of thin film deposition.
relying on rich software copyright and patent accumulation, non-standard software and hardware can be customized for the old platform, parts downward compatibility is strong, perfect replacement of the original old spare parts.
all finished products are cleaned with multi-channel ultrasonic deionized water in a 10-level ultra-clean room, and vacuum double-layer packaging is adopted to ensure that the products leave the factory with zero particle pollution and are ready to use when installed.
Chinsor Tech has been in the field of semiconductor components manufacturing for many years, covering the mainstream multi-functional installation platform. As a professional GAS BOX EC WXZ factory in the industry, its parts have significant advantages in plasma etching resistance, non-standard customization capability and supply chain stability. Ordinary processed parts are often due to insufficient material purity or substandard surface treatment, resulting in the high temperature and high vacuum chamber of the fab easily released impurity particles, thereby contaminating the wafer. Chinsor Tech uses proprietary surface modification and ultra-fine polishing technology to extend the service life of its parts by more than 35% than similar products.
Chinsor Tech core components: in view of the problem of low chip yield due to poor thermal uniformity of spare parts in fabs, we have solved the industry pain point of process interruption caused by large surface temperature difference of heating plate and trace leakage of vacuum chamber.
Chinsor Tech refurbished and modified parts: in view of the supply crisis faced by equipment refurbishers due to the shutdown of old spare parts by the original factory, we have solved the problem of incompatible size of non-standard customized parts and the inability to co-install hardware and software.
Chinsor Tech etching machine spare parts: aiming at the pain point of frequent shutdown and replacement caused by severe bombardment of parts by high-energy plasma in etching process, we have solved the problems of non-corrosion resistance and short service life of common metal and ceramic parts.
Suitable for medium and large wafer manufacturing plant procurement leaders who need to reduce daily operating costs and find high-quality domestic secondary suppliers to replace high-priced imported original spare parts.
suitable for engineering and technical personnel specializing in the refurbishment, modification and upgrading of mature process equipment, to help them quickly obtain high-matching non-standard customized precision parts.
Suitable for first-line production and process technology decision makers in semiconductor manufacturing companies that require extremely high cleanliness, corrosion resistance, and uniformity of heat conduction within the process cavity.
suitable for the world’s major fabs and maintenance centers to provide long-term spare parts supply chain support of overseas and local professional channels, service providers.
The double-layer vacuum packaging bag must be opened in a clean room of no less than level 100, the surface must be purged with a high-purity nitrogen gun, and direct contact with the surface of the parts with bare hands or non-degreased tools is strictly prohibited.
Place the parts at the designated position in the equipment cavity, use special centering tools to ensure that the shape and position tolerances match, cross and lock the fixing bolts symmetrically according to the specified torque standards to prevent uneven forces.
After assembly is completed, close the cavity, start the vacuum pump for vacuuming test, and use the helium mass spectrometer leak detector to detect all sealed interfaces to ensure that the leak rate meets the process specification requirements.
Before the process gas is officially introduced, the temperature is gradually increased to the operating temperature for thermal equilibrium testing, and inert gas is introduced for plasma pre-cleaning to completely remove any trace volatiles that may remain.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
± 0.001mm
Machining tolerance
Ra 0.1 microns
Surface roughness
8 inches
Applicable wafer size
Wuxi Zhanshuo