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Chinsor Tech focuses on the research and development and manufacturing of high-precision semiconductor spare parts and materials. Through independent intellectual property rights and advanced processing technology, it provides core components of 8-inch thin film deposition, physical vapor deposition and etching equipment that are fully compatible with mainstream platforms. As a source manufacturer with independent research and development capabilities, we eliminate all intermediaries and directly provide global customers with mass customization services, highly competitive ex-factory prices, and safer and more controllable delivery cycles.
Semiconductor parts and materials are mainly used in integrated circuit thin film deposition equipment, physical vapor deposition wafer heating systems, vacuum chamber components, and semiconductor high-precision etching machine core units.
the use of ultra-high purity ceramics and special metal materials, the overall impurity content is controlled at a very low level, in the high temperature, high vacuum complex semiconductor process environment will not release volatile impurities, significantly improve the yield of wafer processing.
the processing tolerance of key components is controlled within plus or minus 5 microns, which is perfectly suitable for mainstream semiconductor equipment platforms. Engineers can directly carry out seamless replacement and upgrade, thus greatly shortening the power-off maintenance time.
brittle ceramic materials developed for etching and deposition environments have extremely high plasma erosion resistance and corrosion resistance, and their service life is more than twice that of ordinary alternatives.
wafer heating heating plate and cavity lining components can be in ultra-high temperature environment for long-term continuous and stable operation, thermal expansion coefficient is extremely low, to ensure the uniformity and reproducibility of the film deposition process.
all core spare parts are manufactured in strict accordance with international quality management system standards, and each product has undergone high vacuum leak detection and precision three-coordinate inspection before leaving the factory to ensure zero defects in delivery quality.
with dozens of independent research and development patents and software copyrights, from the source design to the final product manufacturing completely independent, for the global semiconductor buyers to effectively avoid the risk of geopolitical and intellectual property disputes.
Relying on deep technology accumulation, Chinsor Tech has achieved in-depth optimization of processing technology in the field of semiconductor high-precision spare parts. By improving the sintering and precision grinding technology of ceramic brittle materials, we have made the wafer heating plate and vacuum chamber components perform well in terms of thermal shock resistance and plasma etching resistance, and the comprehensive service life and stability have reached the same level of international first-line brands, while the procurement cost has been significantly reduced. Another 1 significant advantage is the ability to quickly respond to customized refurbishments. Chinsor Tech not only provides standardized components, but also can carry out in-depth technical upgrades such as cavity replacement and magnetron modification for customers’ existing mainstream thin film deposition platforms. Relying on a complete source manufacturing chain, the delivery cycle of customized projects is nearly half shorter than that of traditional multinational factories.
In view of the problem of frequent downtime and replacement due to non-wear and non-corrosion of spare parts in the semiconductor process, the Chinsor of Tech high-wear ceramic spare parts can extend the continuous operation cycle of a single equipment and greatly reduce the downtime maintenance cost of the fab.
in view of the long international logistics cycle, large factory spare parts supply and high delivery time pain points, we as the source factory to provide stable localization manufacturing and efficient export channels to ensure the safety and flexibility of the fab supply chain.
Chinsor Tech adopts high-precision three-coordinate mapping and micron-level processing to completely solve the hidden danger of assembly leakage and mismatch.
Suitable for procurement decision makers of mature IC manufacturing enterprises who are looking for high-quality, cost-effective core process equipment spare parts, and urgently need to reduce comprehensive procurement costs and establish a diversified supply chain to avoid the risk of supply interruption.
For engineering service companies specializing in mainstream film deposition, physical vapor deposition equipment upgrades and refurbishment, to provide high-precision cavity, heating plate and other key large pieces of customization and replacement support.
For technical experts in the production line responsible for improving equipment uptime, solving wear and tear of key cavity components and making process improvements, providing engineering-level solutions that meet technical standards.
suitable for the need to outsource precision metal parts processing or special brittle ceramic structural parts of the original equipment manufacturers, to provide them with industry-standard micron-level precision parts OEM and bulk supply.
Product packaging must be unpacked in a semiconductor clean room of 10,000 or higher standards. Operators should wear dust-free gloves and carefully check the surface of components for scratches, micro-cracks or contamination during transportation.
align the spare parts with the cavity interface according to the technical drawings of the original equipment. Use special tools to handle gently, especially ceramic brittle material parts, avoid excessive force to ensure that the positioning pin and the mounting hole are perfectly reset.
According to the specified torque standard, the tightening bolts are gradually tightened in a diagonal sequence. After the installation is completed, a helium mass spectrometer leak detector must be connected to test the leakage rate of the vacuum chamber or interface to ensure that the vacuum seal meets the standard.
Before the process gas is formally introduced, the heating plate or chamber components shall be gradually heated and preheated to release the surface stress. Subsequently, no-load operation test is carried out to confirm that all electrical parameters and temperature feedback are normal before mass production.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
100.00%
Material purity
0.005mm
Machining tolerance
0.1 µm
Surface roughness
Wuxi Zhanshuo