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Chinsor Tech focuses on the manufacture of semiconductor precision components with high purity materials and micron tolerances, providing excellent corrosion resistance, high vacuum sealing and high temperature resistant core components for global wafer manufacturing and equipment upgrading. As a source‑manufacturing facility with an established foundation of proprietary technologies, Chinsor Tech boasts state‑of‑the‑art processing and inspection equipment. By eliminating all intermediary layers, we are able to offer global customers highly competitive ex‑factory pricing, efficient technical support, and faster lead times for mass production.
Semiconductor precision processing parts are mainly used in integrated circuit thin film chemical vapor deposition equipment, physical vapor deposition equipment, plasma etching machine and high vacuum chamber sealed drive system.
product processing tolerance is strictly controlled within plus or minus 0.005mm, ensuring the mechanical alignment accuracy of etching machine and thin film deposition equipment under high-speed operation, improving the uniformity of wafer edge processing by 35%, and effectively reducing the wafer scrap rate caused by mechanical deviation.
optimized diamond tools and ultrasonic processing technology are adopted to carry out precision micro-hole processing for brittle ceramic materials such as alumina and silicon carbide, which completely solves the problems of edge collapse angle and micro-cracks, and prolongs the service life of components by 1 times in high vacuum plasma environment.
through chemical mechanical polishing and precision grinding, the surface roughness of the workpiece can reach 0.1 microns, significantly reducing the attachment of physical by-products in the plasma etching process, extending the cavity maintenance cycle, and reducing the defect rate of the equipment wafer by 50%.
all vacuum chambers and connectors are strictly tested by helium mass spectrometer leak detector, and the overall leak rate is lower than the special critical value of the industry standard. in conjunction with the ultrasonic multi-channel cleaning process of the 10,000-grade clean room, the factory will reach the semiconductor-grade installation standard.
from high-purity quartz, ceramics to titanium alloys, tungsten, molybdenum and other refractory metals, to meet the semiconductor equipment internal different process cavity for high temperature resistance, strong acid and alkali corrosion and thermal expansion coefficient matching of the strict physical performance requirements.
relying on rich experience in the renovation and modification of spare parts of international mainstream platform equipment, it can carry out 1: 1 high-precision reverse engineering and performance optimization according to the drawings or actual samples provided by customers, greatly reducing the high cost of original parts procurement and operation and maintenance of enterprises.
Semiconductor precision machined parts produced by Chinsor Tech have significant advantages in material purity control and processing stress relief. Through the introduction of multi-axis linkage CNC machining center and advanced surface treatment technology, the product can withstand the bombardment of strong corrosive gas and high-power RF plasma for a long time without deformation and particle shedding. Compared with ordinary processing plants, Chinsor Tech has a complete semiconductor-level quality management system and testing methods to ensure that the physical characteristics and dimensional characteristics of each factory component are highly matched with the original equipment.
In response to the industry pain points faced by fabs and equipment refurbishers of monopoly of original parts prices and long procurement cycles, we have solved the problems of high spare parts costs and long downtime waiting times.
In view of the extreme requirements of semiconductor manufacturing for the cleanliness of the production environment, we have solved the problem of ordinary processing parts releasing trace impurity ions in high temperature and strong acid environment, resulting in wafer batch scrapping.
in view of the micro-cracks and internal stress concentration pain points that often occur in the processing of hard brittle materials, we have solved the problem that parts are prone to burst during the thermal cycle of the equipment, thus polluting the whole equipment.
suitable for Fab plant daily consumables, spare parts procurement and cost control professionals, to meet their supplier quality management system certification, long-term stable delivery and significantly reduce the overall procurement costs of the stringent supply chain KPI requirements.
suitable for mainstream brand film deposition, etching and other equipment refurbishment, upgrading and maintenance of engineering and technology enterprises, to provide accurate adaptation of mechanical processing parts, vacuum chamber transformation models and customized metal and ceramic structural parts.
suitable for the design and development of new wafer manufacturing equipment technical team, to provide them from sample proofing, material selection evaluation to small batch trial production of one-stop precision processing technical support, accelerate the development of new equipment and mass production process.
suitable for technicians responsible for daily inspection, troubleshooting and capacity expansion of equipment in the plant, high-precision replacement parts can realize direct in-situ replacement without modifying equipment parameters, and shorten equipment maintenance downtime.
the product is packed with semiconductor-grade double-layer vacuum. Please unpack it in a 10,000-grade or 100-grade clean room that meets the cleanliness requirements, and carefully check the surface for scratches caused by transportation after removing the outer package.
When installing the processed parts to the vacuum chamber or heating plate of the equipment, special tooling must be used for alignment, and the torque key must be used for cross-symmetrical tightening in strict accordance with the recommended torque specified in the product specification.
after the components are installed and closed, the system vacuum pumping test shall be carried out first, and baking degassing shall be carried out at the specified temperature until the vacuum leakage rate of the system reaches the stable operation index specified by the original equipment.
during periodic maintenance of the equipment, the surface of the workpiece shall be wiped with high-purity isopropanol to observe whether there are abnormal etching traces caused by plasma bombardment, and the replacement cycle shall be evaluated according to the process wear.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
more than 99.99%
Material purity
plus or minus 0.005mm
Machining tolerance
0.1 µm
Surface roughness
Wuxi Zhanshuo