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Chinsor Tech focuses on providing micron-grade precision semiconductor equipment spare parts, covering the core high-loss parts of the previous process to ensure the continuous stability of the equipment in high vacuum and plasma environments. As a source production plant with independent R & D and mass manufacturing capabilities, the company bypasses all intermediate traders and directly provides global customers with competitively priced ex-factory spare parts and faster customized delivery response.
This product is mainly used in chemical vapor deposition film growth, physical vapor deposition wafer heat transfer, plasma etching chamber protection, and daily maintenance and renovation of high vacuum sealing systems.
Made of semiconductor-grade special ceramics and alloys with a purity of up to 99.9%, it eliminates the release of metal ions in pre-processes such as chemical vapor deposition and reduces the wafer fouling rate to an extremely low level.
The processing tolerances for key dimensions of core spare parts are controlled within 0.005 mm, ensuring seamless mechanical cooperation with the original machine in physical vapor deposition and high vacuum cavities, and airtightness meets standards.
High-energy-consuming spare parts such as wafer heating modules can operate stably and continuously for a long time at high temperatures of 1,200 degrees Celsius. The temperature difference on the heating disk surface is controlled within one percent, effectively preventing thermal stress stratification of the wafer.
The plasma-resistant coating optimized for the etching process reduces the wear rate of spare parts in fluorine-based or chlorine-based strong corrosion gases by 45%, significantly extending the continuous operation time of the production line machine.
Own eleven supporting software copyrights to ensure seamless compatibility of precision electronics and control spare parts with existing semiconductor master control system protocols, zero delay in signal feedback, and avoid false alarms and downtime.
With 52 core patents, all components have independent intellectual property rights, providing a compliant and stable third-party alternative supply chain for medium and large wafer fabs and equipment refurbishers around the world.
Chinsor Tech semiconductor equipment spare parts have achieved deep integration at the level of macro-material modification and micro-ultra-precision machining. Compared with common third-party spare parts on the market, the overall physical wear resistance is improved by 30%, and the vacuum heat conduction efficiency is more stable. At the same time, with its local integrated manufacturing workshop, the company ensures that all kinds of customized or out-of-print spare parts are sampled and delivered in a very short period of time, helping customers get rid of their long-term dependence on expensive original spare parts.
In view of the problem of wafer edge deposition failure due to uneven thermal field of the heating plate, we achieved excellent temperature control uniformity by improving the internal heating wire arrangement structure.
in view of the pain point that the cavity parts under the etching machine are easy to crack and lose in strong corrosive environment, we switch to high-density anti-breakdown ceramics, reducing the replacement frequency.
We use mature reverse engineering and technology accumulation to provide long-term customized supply for the procurement of discontinued spare parts faced by mature process fabs.
responsible for the previous process consumable parts risk control and cost reduction efficiency, need to find through the international quality system certification, stable large-volume supply of source spare parts manufacturing plant.
specializing in the refurbishment, upgrading and remanufacturing of second-hand semiconductor machines, there is an urgent need for high-precision, high-matching and seamless replacement of the original platform deposition or etching core spare parts.
focuses on improving the rate of machine movement and reducing unplanned downtime, paying close attention to the wear-resistant life of various key components and the rapid technical response support provided by the factory.
For distribution in the world’s major semiconductor mature and advanced process markets, we need to find foundries with independent intellectual property rights, excellent quality and export qualifications.
all parts are packed with high-standard double-layer vacuum and dust-free. Before entering the designated area of the clean room, it is necessary to confirm that the outer package is free of damage and air leakage, and then the package can be unpacked under the specified environment.
Before formal installation in the cavity, use high-purity isopropyl alcohol to perform directional wiping on the metal or ceramic surface of the spare part to ensure complete removal of electrostatically adsorbed trace particles.
When fixing the spare parts on the high vacuum chamber or wafer transfer platform, a calibrated torque wrench must be used for symmetrical tightening according to the standard torque specified in the technical manual.
after the replacement of spare parts is completed and the reaction chamber is closed, the standard helium mass spectrometry leak detection process must be started, and the power can be applied only after confirming that the air tightness reaches the semiconductor vacuum level standard.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
99.90%
Material purity
0.005mm
Machining tolerance
0.1 micrometer
Surface roughness
Wuxi Zhanshuo