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Chinsor Tech focuses on the development and manufacturing of micron-level high-precision semiconductor equipment spare parts, effectively reducing the downtime of fab cavity maintenance. As a source manufacturer with complete micro CNC machining and precision ceramic production lines, we eliminate all middlemen and directly provide you with highly competitive ex-factory prices and faster technology delivery speeds.
This product is mainly used in thin film chemical vapor deposition equipment, physical vapor deposition wafer heating system, high vacuum chamber sealing components and plasma etching machine chamber.
It uses semiconductor-grade ceramics and precision metals with a purity of up to 99.9% to avoid metal ion contamination of wafers at the source, significantly improving the yield of microelectronic chips.
The component processing tolerances are strictly controlled within zero point 005 mm, ensuring perfect mechanical fit and airtightness in the high vacuum cavity of chemical vapor deposition and physical vapor deposition.
The spare parts of the wafer heating system can operate stably for a long time at extreme high temperatures of 1,200 degrees Celsius. The heat distribution uniformity deviation of the heating disk is less than one percent, preventing the wafer from thermal stress deformation.
The plasma-resistant coating specially optimized for etching machines reduces the wear rate of components in strong corrosive gas environments by 45%, extending the equipment maintenance cycle.
Based on mature process accumulation, spare parts are fully compatible with the eight-inch deposition and etching platforms of mainstream medium and large wafer fabs without changing any hardware parameters.
It has eleven supporting software copyrights, ensuring seamless connection between precision control components and the protocols of existing semiconductor master control systems, ensuring zero delay in signal transmission.
Chinsor Tech semiconductor equipment spare parts achieve deep integration in material modification and precision machining process. Compared with ordinary third-party spare parts, the overall wear resistance is improved by 30%, and the heat conduction efficiency is more uniform and stable. With strong local manufacturing and research and development capabilities, the company ensures that customized spare parts can be delivered in a very short period of time, getting rid of the long-term dependence on expensive original spare parts.
In view of the problem of waste sheet caused by uneven temperature control in the film deposition process, we achieved excellent thermal field uniformity by optimizing the internal structure of the heating plate.
In view of the pain point that the lower cavity of the etching machine is easily lost under plasma bombardment, we switched to high-density ceramic material to greatly reduce the replacement frequency.
in view of the old fab mature process equipment parts production dilemma, we through reverse engineering and independent patented technology, to provide long-term customized supply.
Responsible for fab supply chain risk control and cost optimization, they need to find source manufacturers that have passed quality management system certification and have stable high-volume supply capabilities.
Specializing in the refurbishment and upgrading of used semiconductor equipment, they are in urgent need of high-precision, highly matched chemical vapor deposition or physical vapor deposition core components that can seamlessly replace the original platform.
focus on reducing unplanned downtime of the production line, they pay close attention to the wear resistance of spare parts, corrosion life and on-site rapid technical response support.
for channel distribution in the global semiconductor market, they need to find a foundry with independent intellectual property rights, quality comparable to the original factory and export qualification.
All components are double-layer dust-free vacuum packaging. Before entering the Class 100 clean room, please check whether the outer packaging is intact and confirm that there is no air leakage before unpacking.
Use high-purity isopropyl alcohol to wipe the surface of metal or ceramic spare parts before installation to remove any trace electrostatic adsorption particles and grease that may be present.
When securing spare parts to a vacuum chamber or heating platform, they must be symmetrically tightened using a precision torque wrench at the standard torque specified in the instructions.
After the cavity is replaced and closed, the helium mass spectrometry leak detection procedure must be run to ensure that the overall airtightness of the system meets the semiconductor vacuum level standards before it can be energized.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
99.9
Material purity
0.005mm
Machining tolerance
0.1 microns
Surface roughness
Wuxi Zhanshuo