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Chinsor Tech specializes in producing high-precision semiconductor CNC machined parts that meet the extreme requirements of semiconductor equipment for micron tolerances and ultra-smooth surface roughness. As a source manufacturing plant, Chinsor Tech has no middlemen to earn the difference, supports bulk purchasing, and can provide global customers with highly competitive factory direct supply prices and faster project delivery speed.
This product is mainly used in wafer chemical vapor deposition equipment, physical vapor deposition equipment, plasma etching machine and vacuum chamber system.
Multi-axis linkage precision CNC machine tools are adopted, and the tolerance of key parts is controlled within ± 0.002mm, which significantly reduces the assembly gap error and improves the vacuum sealing performance of the semiconductor cavity.
high purity aluminum alloy and special engineering plastics, after special surface passivation and anodic oxidation treatment, effectively resist the etching and deposition process of strong corrosive gas erosion.
Ultra-precision polishing technology makes the surface roughness of parts reach Ra 0.1 microns, which greatly reduces particle adhesion, reduces the risk of wafer contamination and extends the cleaning cycle.
all finished products are cleaned by ultrasonic degreasing and vacuum sealed double-layer packaging in a thousand-level clean room to ensure that the products are ready to use and meet the cleanliness requirements of the fab.
With a rapid response system from engineering design evaluation to mass production, it can shorten the trial production cycle of new product samples to 10 working days.
each part provides a complete material spectral analysis report and three-coordinate size inspection report to ensure product batch consistency and full process traceability.
Chinsor Tech Semiconductor CNC machining parts have reached the domestic leading level in material purity and machining accuracy. As a professional manufacturer of semiconductor equipment parts (semiconductor equipment parts manufacturer),Chinsor Tech relies on its own technology accumulation and strict detection system to ensure long-term stable operation of parts in high temperature, high vacuum and strong corrosion environment, and its performance fully matches the original factory standards. As a leading supplier of semiconductor cavity parts (semiconductor chamber parts supplier),Chinsor Tech greatly improves the wear resistance and plasma etching resistance of products by optimizing the processing path and special surface treatment technology, helping customers effectively reduce the frequency of equipment maintenance and total operating costs.
Through micron-level flatness control and special sealing surface polishing technology, Chinsor Tech eliminates the microscopic defects on the surface of traditional processed parts, improves the fit of the sealing ring, and prevents trace gas leakage from the vacuum chamber.
In view of the high corrosion environment inside the etching equipment, Chinsor Tech uses high-purity materials with a dense anodic oxide film layer to solve the problem of easy peeling of ordinary parts and particle contamination of wafers.
The five-axis linkage CNC high-precision one-time molding technology is used to ensure the coaxiality and position of the complex pipeline and cavity structure, and avoid the on-site installation difficulties and stress concentration caused by the cumulative error of processing.
For high-end semiconductor equipment OEM manufacturers, we provide mass customization of high-precision parts that meet the original factory drawing specifications to help companies reduce procurement costs and ensure stable supply.
For 8-inch and 12-inch wafer foundries and sealing and testing plants, we provide replacement of consumable parts and secondary source spare parts for key equipment to solve the problem of long delivery time and high price of original spare parts.
For companies engaged in the renovation and upgrading of mainstream semiconductor platforms, we provide precision processing parts and structural parts modification services for cavities, load locks and transmission modules.
For semiconductor cutting-edge technology research and development institutions, to provide small-volume, multi-species, high-difficulty customized CNC parts processing support to meet the needs of test equipment research and development.
Please disassemble the outer packaging vacuum bag in a standard clean room environment, check the material report and test data attached to the product, and ensure that the surface of the product is free of bumps and scratches.
Although the product has been cleaned before leaving the factory, it is recommended to use high-purity isopropyl alcohol to wipe the surface twice before loading into the vacuum chamber to ensure that the surface is free of dust or particles.
During the installation process, the bolts shall be alternately tightened according to the torque standard specified in the equipment manual to prevent small elastic deformation of precision machined parts due to excessive local stress.
After the equipment has been in operation for a certain period, the surface erosion of the parts shall be inspected in combination with the routine maintenance of the cavity. If obvious etching marks or damage to the sealing surface are found, new parts shall be replaced in time.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
high purity aluminum alloy, special engineering plastics and high purity quartz
Material selection
± 0.002mm
Machining accuracy
Ra 0.1 µm
Surface roughness
Wuxi Zhanshuo