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Chinsor Tech specializes in producing precision semiconductor components with tolerances as low as plus or minus 0.005mm, with high vacuum sealing and corrosion resistance. As a source manufacturing facility, we eliminate the middleman link and provide direct volume procurement services to provide you with highly competitive ex-factory prices and faster delivery response.
This series of precision semiconductor components are mainly used in sub-micron thin film deposition equipment, dry etching reaction chamber, physical vapor deposition system and high clean wafer transfer vacuum valve body and other key process links.
With high-precision five-axis linkage CNC machining equipment and real-time online laser measurement system, product dimensional tolerances are strictly controlled within plus or minus 0.005mm. The high-precision fit can effectively reduce the assembly gap of the reaction chamber, improve the uniformity of the gas flow field, and shorten the equipment assembly and debugging time by 30%.
the surface of the parts is polished and special chemical treatment, and the surface roughness reaches Ra 0.1 micron. The ultra-smooth surface can significantly reduce particle adhesion and outgassing in the semiconductor process, and reduce the risk of wafer outgassing contamination by more than 60%.
using high purity aluminum with dense anodic oxidation process, the coating thickness is stable at 25 to 35 microns, and the breakdown voltage is more than 500 volts. Even in a highly corrosive plasma environment, the anti-spalling life of the parts can be extended by 40%.
the key seal and connection interface undergo strict three-dimensional CMM measurement and helium mass spectrum leak detection, and the vacuum leak rate is less than 1 × 10-9 mbar l/s, which fully meets the air tightness standards of high vacuum and ultra-high vacuum semiconductor process cavities and reduces the number of unplanned shutdowns.
before leaving the factory, the products are cleaned in 100-level clean environment by ultrasonic multi-level deionized water, and after drying, double-layer anti-static vacuum packaging is adopted. The product can be installed directly in the semiconductor production line without secondary cleaning, reducing procurement management costs.
as high-quality secondary source components, fully compatible with the original equipment size and process standards, the delivery cycle is shortened by more than 50% compared with the original factory, greatly reducing the pressure on spare parts inventory and downtime waiting costs in semiconductor fabs.
Chinsor Tech’s precision semiconductor parts show significant horizontal advantages in manufacturing process and material stability. Compared with ordinary third-party replacement parts in the market, Chinsor Tech selects and processes materials in strict accordance with semiconductor-grade industrial standards. It not only achieves extremely high accuracy of plus or minus 0.005mm in dimensional tolerance, but also endows the parts with extremely strong plasma etching resistance and low outgassing characteristics through its own high clean cleaning and dense anodic oxidation treatment. At the same time, Chinsor Tech has established a traceable quality control system for core components such as PVD chamber parts and etch chamber components that have been exposed to high corrosion and high temperature for a long time. From spectral analysis of raw materials to mass spectrometry leak detection of final inspection, it ensures that every 1 components delivered to customers can directly and seamlessly replace original accessories, helping buyers reduce the cost of operating spare parts by more than 30% while ensuring a high opening rate of equipment.
Common replacement parts are easy to cause lax sealing of the interface due to insufficient processing accuracy. Chinsor Tech precision semiconductor parts adopts full numerical control high precision machining to control the tolerance of the sealing surface within plus or minus 0.005mm, thus completely solving the problem of slight air leakage in the vacuum chamber.
In order to solve the problem of insufficient density of anodized layer on conventional parts, Chinsor Tech provides a highly uniform and dense oxide layer, which significantly enhances corrosion resistance, effectively prevents particle contamination caused by coating peeling, and improves wafer yield.
Semiconductor fabs often face months-long lead times for original spare parts. Chinsor Tech, as the source manufacturing plant, maintains a normal material preparation and rapid response mechanism, shortens the delivery cycle to less than a few weeks, and ensures the stable operation of the production line.
For purchasing managers focused on reducing equipment maintenance costs and supply chain risk. The precision parts provided by Chinsor Tech combine the original quality with better prices, have a complete qualification system and fast delivery capabilities, and are a high-quality choice for building a stable and diversified supply chain.
For technicians responsible for equipment startup and process yield. PVD chamber parts and etch chamber components with high precision and ultra-low outgassing rate can accurately match the existing equipment cavity and shorten the debugging waiting time after equipment replacement.
For manufacturing companies focused on refurbishing and upgrading 8-inch and 12-inch equipment. Chinsor Tech can provide a full set of precision replacement parts and modification parts, including PN 0021-02395 RE V. B INSERT RING,ALUMINUM DxZ SACVD 2nd Source New and other key structural parts, significantly reducing the renovation cost.
For research teams engaged in advanced process development and new thin film deposition process experiments. Support the processing of structural parts with small batch customization and high tolerance requirements, help the scientific research team to quickly verify the experimental scheme and realize the iteration of equipment components.
The product has been packaged with high cleanliness before leaving the factory. Please disassemble the outer anti-static vacuum bag in the 100-level or 1000-level clean room environment, and carefully check the surface of the parts for bumps or scratches during transportation before installation.
Please check the product model and number before installation, such as 0021-02395 RE V. B INSERT RING,ALUMINUM DxZ SACVD 2nd Source New. Make sure that the surface of the part and the base of the equipment cavity is clean and free of dust, align the locating pin holes and then put them in smoothly.
If bolt fixing is involved, please use a calibrated torque wrench and tighten it evenly in a diagonal alternating manner to avoid small deformation of high-precision aluminum ring or vacuum sealing surface caused by excessive force at a single point.
During the maintenance period of the reaction chamber, if high-temperature baking is required for gas extraction, please gradually raise the temperature according to the process specification. It is recommended to regularly check the status of the anodized layer on the surface of the component, and replace it in time if it is severely worn.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
± 0.005mm
Machining tolerance
Ra 0.1 microns
Surface roughness
high purity aluminum alloy and anodized aluminum
Applicable materials
Wuxi Zhanshuo