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Chinsor Tech provides high-reliability AMAT Precision 5000 platform refurbishment, upgrades and core cavity spare parts support to fabs around the world, ensuring that machines are restored to original factory process standards and extending service life. As a source manufacturer with independent processing capabilities, we rely on the precision manufacturing advantages of our own factories to eliminate all intermediate trade links and provide you with transparent factory direct supply prices and faster spare parts response cycles.
p5000 amat is mainly used for chemical vapor deposition, plasma etching, tungsten silicide deposition and dielectric film growth of 8-inch wafers.
through high-precision numerical control machining and surface treatment process, the shape and position tolerance of key parts of the cavity is controlled within 0.01mm, effectively improving the uniformity of plasma distribution and improving the product yield by 5%.
using high-performance ceramic and metal composite materials, the thermal response speed is 15%, and has excellent corrosion resistance, the average replacement cycle of the heating plate is extended to 18 months.
Modernized module replacement for older RF power supplies, increased power output stability to 99.9%, significantly reducing the risk of film delamination due to power fluctuations.
The updated control interface supports finer process parameter monitoring and logging, shortening troubleshooting time by 40%, and significantly improving the overall operating efficiency of the production line.
through laser-assisted calibration technology, the repeated positioning accuracy of wafer transmission is increased to 0.05mm, completely eliminating the risk of dicing and chipping, and ensuring the safety of high-value wafers.
optimize the air flow dynamics structure in the cavity, reduce the accumulation of by-products in the process, reduce the frequency of downtime maintenance cycle by 20%, and ensure the high standard output in the clean room environment.
The p5000 amat refurbishment program provided by Chinsor Tech has been deeply optimized for the durability of core components. Compared with similar refurbished products, we not only strictly control the purity of raw materials through our own factory, but also iterate on cavity sealing technology, which reduces the wear rate of dynamic seals by 30% and greatly reduces the process interruption caused by vacuum leakage.
In view of the pain point that P5000 is prone to spalling particles after long-term operation, Chinsor Tech adopts unique surface ceramic treatment technology to solve the problems of poor adhesion of cavity wall film layer and easy wafer contamination.
In view of the pain point that the original factory has stopped supporting P5000 key electronic modules, we have developed an alternative circuit board with independent intellectual property rights, which solves the dilemma that customers face the scrap of the whole machine due to the damage of a board.
In view of the problem of process window reduction caused by old equipment over time, Chinsor Tech combines high-precision sensor feedback to solve the quality hidden trouble of subsequent lithography alignment caused by uneven deposition thickness.
suitable for manufacturing enterprises that need to expand the existing mature process capacity at low cost and have strict requirements on equipment stability.
suitable for research and development of new materials and new processes, and a laboratory environment that requires a highly customizable and flexible vacuum processing platform.
Suitable for global distributors looking for high-quality, fully refurbished, and warranty-backed, mature model equipment.
suitable for factory managers who are engaged in power semiconductor production and need long-term stable operation of P5000 equipment and reliable spare parts supply chain support.
turn on the power and warm up the system, enter the control software self-test program. Verify the robot transfer path with standard wafers to ensure that its positioning accuracy meets the coordinate parameters set in the process manual.
start the dry pump and molecular pump, monitor the reading of the vacuum gauge. When the pressure is reduced to the preset base vacuum value, the leak rate test is carried out to ensure that the system is intact.
all connected gas mass flow controllers are cleared and calibrated before the process starts. Ensure that the process gas mixing ratio is accurate under the set flow parameters.
According to the production cycle schedule, the in-situ cleaning process is regularly run to remove residual materials accumulated inside the chamber to prevent particulate matter from contaminating subsequently processed production wafers.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Wafer size
1 to 4
Number of cavities
10 to 100 Torr
Vacuum pressure
Wuxi Zhanshuo