loading...
已经是到最后一篇内容了！
Semiconductor etching equipment is a key tool for wafer pattern transfer, which ensures the precise formation of submicron structures through high-precision plasma technology. As a source manufacturing plant for semiconductor equipment, Chinsor Tech has its own R & D laboratory and Taizhou production base, cutting off all intermediate trade links and providing you with highly competitive direct supply prices and long-term stable component guarantee.
Semiconductor etching equipment is mainly used in integrated circuit pattern transfer, MEMS manufacturing, compound semiconductor processing and through hole etching in the field of advanced packaging.
using dual-frequency RF coupling technology, the plasma density fluctuation is controlled within 1%, ensuring that the verticality of the etching profile reaches more than 89.5 degrees, greatly improving the yield of ultra-large-scale integrated circuits.
equipped with multi-stage molecular pump group, it can realize rapid switching from normal pressure to working vacuum within 10 seconds, and the vacuum stability deviation is controlled at 0.2 mTorr, which effectively reduces the edge effect in the process.
The core cavity components are made of alumina ceramics with a purity of 99.8 and special anodized aluminum materials, which improve the plasma etching resistance by 50% and extend the equipment overhaul period to more than 12 months.
Through multi-zone independent heating and helium back-cooling system, the wafer surface temperature control accuracy of ± 0.5 degrees Celsius is achieved, effectively solving the problem of photoresist scorching and deformation in the high-power etching process.
built-in high-sensitivity spectrum analyzer, can capture the signal changes of chemical groups in the etching process in real time, and the automatic stop error is less than 2 nanometers, which completely eliminates the over-etching damage to the lower stop layer.
supports flexible expansion from single cavity to 4 cavity, and the interface tolerance between cavities is only 0.05mm, which can rapidly increase production capacity according to the demand of production expansion, and the throughput of a single equipment can be increased by up to 30%.
The semiconductor etching equipment produced by Chinsor Tech performs well in key process steps. Compared with the common refurbishment machines or general-purpose equipment on the market, Chinsor Tech combines 52 patented technologies independently developed, especially in the anti-corrosion treatment of the materials inside the cavity and the response speed of the RF matching system. The depth optimization makes the equipment more stable when dealing with complex high aspect ratio etching.
in view of the problem of vacuum drift caused by aging of cavity sealing surface after long-term operation, Chinsor Tech has adopted self-developed precision sealing repair technology to ensure that the equipment still maintains extremely high vacuum integrity under high load operation.
By introducing the precision processing technology of ceramic brittle materials, we have solved the pain point of frequent replacement of traditional etching consumables and reduced the cost of single-chip processing by about 20%.
Chinsor Tech optimizes the tolerance of the microporous structure of the gas distribution plate, solves the problem of reduced etching rate at the edge of large-size wafers, and makes the distribution of electrical parameters of the entire wafer more uniform.
In view of the current global 200mm capacity shortage, the head of the mature process production line needs to be quickly deployed, and the capacity can be doubled in a short period of time through our equipment program.
technical supervisors engaged in the production of new power devices such as gallium nitride and silicon carbide, need high-hardness material etching solutions, and our high-power plasma system can perfectly match their process requirements.
The technical personnel responsible for improving the yield of the existing production line can realize the performance jump of the old machine at low cost by introducing the upgraded cavity components of Chinsor Tech.
Researchers who need deep silicon etching processes when developing sensors or actuators. Our equipment provides flexible parameter configuration to support a smooth transition from laboratory research and development to small batch production.
After starting the equipment, the cavity should be baked and vacuumed for at least 4 hours until the background vacuum reaches the set threshold to eliminate the moisture and impurities adsorbed on the inner wall of the cavity.
Run the standard tuning program before the formal process to ensure that the RF matcher can quickly lock the impedance under working pressure and control the reflected power below 1% of the total power.
select the preset process formula according to the type of material to be etched, and strictly check whether the set values of the flowmeter, pressure valve and temperature controller are completely consistent with the actual feedback values.
After each 5000 wafers are processed, the wear of the ceramic ring and shield inside the cavity should be checked, and the residual polymer on the inner wall should be cleaned with a special solvent to maintain a clean etching environment.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Wafer size
greater than 1 micron per minute
Etch rate
less than 3%
Uniformity
Wuxi Zhanshuo