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Chinsor Tech specializes in producing high-precision semiconductor etching precision parts, with micron-level tolerances and zero-stress edge control, perfectly matching the mainstream front-line process requirements. We are a source manufacturer with independent R & D patents, refusing middlemen to increase prices, providing you with highly competitive ex-factory prices, efficient sample response and fast batch delivery services.
Etched precision parts for semiconductor are mainly used in thin film chemical vapor deposition equipment, physical vapor deposition wafer heating systems, high vacuum chambers of etching machines, and lead frames and RF shielding components.
Through advanced photochemical etching technology, the processing tolerance can be stably controlled within ± 0.01mm. The high consistency reduces mechanical wear during precision assembly and reduces assembly failure of key conductive components of etching equipment by 65%.
The chemical etching process does not produce mechanical cutting forces or high-temperature heat-affected zones on metal materials, ensuring that the edges of the part meet the 100 percent burr-free standard. This avoids material deformation caused by microscopic stress, and makes the gas flow channel more uniform and stable in high vacuum environment.
selection of high purity semiconductor grade raw materials, combined with fine chemical stripping surface treatment process, so that in the harsh process environment such as strong acid, strong alkali and high concentration of fluorinated gas, the corrosion resistance of various parts life extended by more than 1.5 times.
supports the complex design of high-density micropores, micro-channels and ultra-thin metal sheets, and the processing cost does not increase with the increase of graphic complexity. One-button lithography mask technology can complete rapid proofing and technical solution verification within 24 hours.
product performance optimization is carried out for high-density plasma and high vacuum environment to ensure that the factory metal and brittle ceramic spare parts will not release metal ions into the cavity, effectively eliminating impurity particle pollution in the high vacuum cavity.
relying on the enterprise’s own 52 patented technology and 11 software copyrights, the wafer heating and deposition process technology accumulation directly applied to the manufacturing of parts, product technical parameters fully in line with high standards of process specifications.
Precision etched parts produced by Chinsor Tech achieve micron-level processing of metal and non-metal materials through precision masks and multi-stage chemical spray processes. Compared with traditional machined parts, Chinsor Tech has undergone rigorous surface passivation and cleanliness testing before leaving the factory. We ensure that the fine geometry of the surface of the part will not undergo thermal degradation or physical spalling when it is washed by high concentration reaction gas, which greatly extends the replacement cycle of spare parts in the previous process.
Chinsor Tech precision etching parts adopt non-contact chemical processing, which completely eliminates metal thermal deformation and edge flash caused by mechanical cutting, and avoids the risk of wafer scratches caused by tiny burrs falling off.
for the upgrade of spare parts for specific platforms, Chinsor Tech relies on strong technology accumulation to provide perfectly compatible customized replacement schemes, reducing the procurement cost by more than 30% and greatly shortening the delivery period.
the ceramic and metal etching process optimized by Chinsor Tech improves the thermal shock resistance of the material, and solves the mechanical cracking problem caused by uneven thermal expansion of complex parts under alternating high temperature and high vacuum environment.
For engineering companies that focus on refurbishing and upgrading classic equipment platforms such as AMAT. They need customized precision components and etch chamber components with high precision and quality compliance to replace the original aging spare parts and effectively reduce the overall renovation and commissioning costs.
applicable to the purchasing supervisor who manages the spare parts supply chain of 8-inch or 12-inch wafer fabs. Such groups urgently need to find source parts manufacturing plants that have passed ISO 9001 certification, have rich project bidding experience for mainstream models such as Centura AP Advantage G5, and have highly stable delivery time.
suitable for senior technicians who are responsible for the daily maintenance of high-frequency production lines and cavity upgrades in the factory. They are highly concerned about the physical life of various etch chamber components under strong corrosion and high temperature conditions, chemical stability, and technical compatibility with existing mainstream cavity systems.
suitable for the United States, Japan, South Korea, new and Southeast Asia and other overseas markets distribution of semiconductor supplies professional B2B trading enterprises. They need suppliers with perfect export qualification, strong invention patent endorsement and flexible small batch proofing ability.
open the sealed package in a dust-free room that meets the standard, and check whether the photoresist coating or passivation layer on the surface of the Centura AP Advantage G5 related components is intact. It is strictly prohibited to touch with bare hands during the whole process to avoid skin grease from contaminating the surface of high vacuum components.
according to the positioning pin hole instructions in the equipment technical manual, the customized etch chamber components is smoothly placed into the specified position of the cavity, and high-precision measuring tools are used to ensure micron-level alignment to prevent airflow disturbance caused by installation displacement.
special torque wrench shall be used to lock the fixing bolts in different times according to the principle of cross symmetry, and the locking torque shall be strictly controlled within the specification range to avoid micro plastic deformation of precision flow channel caused by excessive local force.
after the components are installed, the cavity shall be closed and pumped to the vacuum degree required by the process, and the pressure rise rate and leakage rate test shall be carried out for at least 24 hours to ensure that the system tightness is fully up to standard before ventilation operation.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
stainless steel, copper alloy, titanium, nickel alloy, special ceramic
Material range
0.01mm to 2.5mm
Material thickness
± 0.01mm to ± 0.025mm
Machining tolerance
Wuxi Zhanshuo