etch applied materials

Start With the Etch Process, Then the Platform

Semiconductor etch removes selected material from a wafer so that a circuit pattern or subsequent material layer can be formed. Dry plasma etch is commonly used for circuit-defining steps, while the target film and required profile determine which etch technology and chamber configuration belong in the evaluation.

“Applied Materials etch” describes a manufacturer and process category, not one interchangeable machine. Applied Materials offers systems for silicon, metal, and dielectric etch, and a platform name such as Centura can support different process products and hardware generations. A suitable used tool must match the process task and the installed configuration.

Match the Exact Configuration Before You Buy

Start with the process application and narrow the equipment identity in a fixed order. This prevents a familiar platform name from being treated as proof that the installed chamber, wafer handling, controls, and process kit will fit your line.

1. Define the process. State the material to be etched, wafer size, mask, profile requirement, and the process results that must be qualified.
2. Identify the mainframe generation. Record the full platform name rather than relying on “AMAT” or “Centura.”
3. Identify every process chamber. Capture the chamber family, chamber version, installed process kit, and chamber count.
4. Confirm wafer handling. Verify load locks, robot configuration, wafer orientation, end effectors, and cassette or carrier requirements.
5. Record hardware and controls. Request serial numbers, revisions, software versions, options, power supplies, RF components, pumps, and endpoint hardware where applicable.
6. Define the supply boundary. List installed modules, loose accessories, manuals, spare parts, facilities hardware, packaging, and any services that must appear in the quotation.

Use photographs of nameplates, chamber labels, cabinets, interfaces, and loose items to reconcile the written configuration. For a modified legacy tool, the installed hardware and current configuration records carry more decision value than the original family name alone.

Used Applied Materials Etch Equipment Listed Here

The listing below presents the specific used etch tool covered on this page.

Listing image for Applied Materials Centura II DPS, S/N 9532, Tool ID DRP1P3.

E10-0015_DRP1P3-AMAT_Centura II DPS

This 8-inch Applied Materials Centura II DPS is identified as used, as-is, and deinstalled.

• EquipmentApplied Materials Centura II DPS
• Wafer size8-inch
• ConditionUsed – As Is / Deinstalled
• Serial number9532
• Tool IDDRP1P3
• Listing referenceE10-0015_DRP1P3

Ask About This ToolView Equipment Details

Inspect a Used Etch Tool as a System

A used etch tool review should connect identity, physical condition, installed configuration, and functional evidence. An “as-is / deinstalled” description establishes the sale condition; it does not by itself describe test coverage or production readiness.

Specify in the purchase documents which checks must occur before shipment, which will occur after installation, who is responsible, and what evidence records completion. If live testing is unavailable, identify that constraint in the purchase plan and allocate the related recommissioning risk.

Plan Site Reinstallation Before Shipment

Reinstallation planning should begin with the exact configuration documents for the offered unit. Facility loads and interfaces cannot be inferred safely from the Centura name or from another tool in the same family.

Site-readiness inputs

• Final equipment footprint, service clearances, floor loading, rigging path, and access restrictions
• Electrical service, grounding, emergency power behavior, and local code requirements
• Process gases, inert gas, compressed air, cooling water, vacuum, exhaust, abatement, and drain connections required by the installed configuration
• Environmental, cleanroom, seismic, and safety requirements for the destination site
• Host communication, factory interface, recipe management, and data-retention requirements

Responsibility matrix to agree before shipment

The quotation and contract should identify whether each activity is available and name the responsible party. The published listing does not assign these services.

Confirm manuals, schematics, software media or backups, passwords or access arrangements, calibration records, and service contacts before the tool leaves its current location. Missing technical records can change the schedule even when the hardware arrives without damage.

Build a Comparable Quote and Budget

A useful used-tool quotation ties price to an identified configuration and a written supply boundary. Ask every supplier to separate included equipment, optional work, third-party services, logistics, and destination costs so that competing offers can be compared on the same basis.

The acquisition budget should also account for rigging, freight, utilities work, missing subsystems, replacement parts, technical labor, consumables, software recovery, chamber cleaning, and process qualification. These costs depend on the unit’s actual condition and the destination fab, so they should be estimated from the inspection findings and site plan.

For a technical inquiry, send the required process, wafer size, destination, target schedule, requested supply boundary, and the equipment reference E10-0015_DRP1P3. Include the acceptance evidence your organization requires.