Endura 5500 Pvd | 0010-20753 | 0010-00889

Chinsor Tech provides high-quality Endura 5500 Pvd core process cavity spare parts and complete machine renovation and upgrading services for semiconductor manufacturing, perfectly matching the needs of high vacuum and uniform wafer heating. As a source manufacturing plant with independent intellectual property rights and a number of patents, we eliminate all middlemen and directly provide global fabs with highly competitive ex-factory prices, mass customization services and faster delivery.

8 inches Applicable wafer size
physical vapor deposition chamber Process chamber type
10 to the negative 8 torr Ultimate vacuum degree
30 to 450 degrees Celsius Heating temperature range
plus or minus 1.5 percent Temperature uniformity
maximum 10 kW RF power
high purity aluminum and special ceramics Cavity material
plus or minus 1 percent Air flow control accuracy
Endura 5500 Pvd
gear

Original factory-level process compatibility

The spare parts are completely designed based on the physical characteristics of the original factory machinery, and the geometric tolerance is controlled within 0.02mm to ensure seamless matching with the existing equipment cavity and avoid wafer scratches or vacuum leakage caused by dimensional deviations.

gear

Excellent temperature control uniformity

The advanced wafer heater structure design is adopted to control the surface temperature difference of the whole wafer within plus or minus 1.5 at an operating temperature of 450 degrees Celsius, which significantly improves the thickness uniformity and repeatability of thin film deposition.

gear

High-purity materials extend the service life

high-purity special ceramics and densified metal materials are selected to significantly reduce the physical bombardment wear in a strong plasma environment, and extend the replacement cycle of core wearing parts by more than 35%.

gear

Optimized vacuum sealing and low outgassing rate

vacuum chamber spare parts undergo strict surface treatment and degassing process, and the ultimate vacuum degree can reach 10 negative 8 torr, effectively reducing impurity defects in the process and improving chip yield.

gear

Full set of machine change and system renovation support

not only provide parts, but also have the overall upgrade and transformation capability for key parts such as load lock and lower cavity, so as to restore and improve the system stability of the old platform.

gear

Strict quality compliance certification

The entire manufacturing process strictly implements international quality management system standards, and each product passes high vacuum and pressure resistance tests before leaving the factory to ensure high reliability on the mass production line.

Parameter ItemsTechnical Specifications and Indicators
Wafer processing specifications200 mm (8 inch) wafer
Typical deposition processAluminum, titanium, titanium nitride, barrier layer and seed layer deposition
heater materialHigh thermal conductivity aluminum nitride ceramics or special alloys
Ultimate Background VacuumLess than 9 × 10^-8 Torr
Process gas controlSupports high-precision proton flow meter configurations (such as argon and nitrogen).
Leakage rate standardLess than 1×10^-9 atm cc/sec
Mechanical operational stabilityThe mean time between failures (MTBF) is greater than 100,000 wafers.
Surface roughnessIn a specific region inside the cavity, Ra is less than 0.4 micrometers.

The Endura 5500 Pvd spare parts and machine modification service provided by Chinsor Tech, relying on mature manufacturing technology and rich project site experience, has achieved mechanical performance comparable to that of the original factory and greatly shortened the procurement cycle. Compared with the traditional expensive original factory support, we can provide flexible customized improvement for the specific production line process needs of customers, and achieve higher cost performance and supply chain autonomy.

Endura 5500 Pvd
solution

Production line downtime due to the shutdown of original parts:

Chinsor Tech provides a full set of self-developed process spare parts, which solves the risk of equipment downtime in mature process fabs caused by the shutdown of technical support by the original factory or the shutdown of parts.

solution

Poor film uniformity of conventional third-party spare parts:

Chinsor Tech optimizes the heating wire wiring and material density inside the heater, solving the problem of excessive temperature gradient during heating of common replacement parts, resulting in substandard film deposition uniformity.

solution

The cavity body modification cycle is long and lacks technical cooperation:

Chinsor Tech has a professional engineering team to assist in the modification of the machine, which solves the problem that the fab cannot find a source factory with technical accumulation when carrying out the lower cavity replacement or load lock modification.

Mature process fab hardware engineer

suitable for engineers responsible for the maintenance of production line equipment such as analog chips, power devices and micro-electromechanical systems to help them solve the problems of core cavity wear and wafer heater aging.

Endura 5500 Pvd for people

Semiconductor equipment refurbishment and upgrade service providers

suitable for independent third-party enterprises specializing in second-hand semiconductor machine refurbishment, machine modification and second-hand trade, to provide stable, high-quality source component supply chain support.

Endura 5500 Pvd for people

Wafer Procurement and Supply Chain Management Manager

Suitable for procurement decision makers who are facing the pressure of high maintenance costs in the original factory and urgently need to find quality component replacement suppliers with quality system certification and stable delivery capabilities.

Endura 5500 Pvd for people

Semiconductor research institutes and pilot line operators

suitable for universities and scientific research platform technical teams that run special process development, need to customize the local structure of physical vapor deposition chambers or upgrade the function of the machine.

Endura 5500 Pvd for people
011

efore replacing the core spare parts, the sealing surface of the chamber must be thoroughly cleaned to ensure that there are no residual particles, and special tools are used to symmetrically tighten the bolts to ensure high vacuum sealing effect.

022

After installing the new wafer heater, multi-point temperature gradient test shall be carried out in vacuum state, and the temperature shall be gradually raised to the process temperature to ensure that the temperature uniformity meets the requirements of the production line.

033

When the spare parts are put into use for the first time, it is recommended that the hardware engineer gradually increase the radio frequency power, observe the reflected power of the cavity and the plasma glow state, and ensure that the electrical connection matches.

044

According to the cumulative number of wafers processed, the surface particles of the inner wall of the cavity and the ceramic shield are cleaned regularly to avoid the surface contamination of the wafer caused by the peeling of deposits.

certificate

6 1

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

Q: Can the spare parts of Endura 5500 Pvd you provide directly replace the original parts?
A: Yes. Our products are designed and manufactured in strict accordance with the mechanical interface and electrical parameters of the original equipment, with extremely small dimensional tolerances and direct in-situ replacement.
Q: What is the effect on the uniformity of film deposition after replacing your heater?
A: Our heater adopts an optimized heat conduction design, which can maintain excellent wafer surface temperature difference control at operating temperature, which is beneficial to maintain or improve the thickness uniformity of the film.
Q: Do you have the ability to change and upgrade the whole machine platform for this equipment?
A: Yes. We not only supply parts, but also participate in many large-scale projects such as load lock transformation and lower cavity replacement, and have rich experience in system-level renovation and upgrade.
Q: What quality tests will be carried out before the products leave the factory to ensure the vacuum performance?
A: All vacuum chambers and key components must pass the strict helium mass spectrometer leak detector test before leaving the factory to ensure that the leak rate meets the strict standards of the semiconductor production line.
Q: Do you have relevant experience in export and international transportation of spare parts?
A: We have stable export experience in overseas markets, and our products have been exported to many countries such as the United States, Singapore, Japan, South Korea and Malaysia, and the delivery process is mature.
Q: How long does it take to purchase your spare parts in bulk?
A: As a source manufacturing plant, we have our own production line and standing inventory. The specific delivery period will be determined according to the order volume, but the overall significantly faster than the original purchase cycle.
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Endura 5500 Pvd | 0010-20753 | 0010-00889

Chinsor Tech provides high-quality Endura 5500 Pvd core process cavity spare parts and complete machine renovation and upgrading services for semiconductor manufacturing, perfectly matching the needs of high vacuum and uniform wafer heating. As a source manufacturing plant with independent intellectual property rights and a number of patents, we eliminate all middlemen and directly provide global fabs with highly competitive ex-factory prices, mass customization services and faster delivery.

Endura 5500 Pvd

gear

The spare parts are completely designed based on the physical characteristics of the original factory machinery, and the geometric tolerance is controlled within 0.02mm to ensure seamless matching with the existing equipment cavity and avoid wafer scratches or vacuum leakage caused by dimensional deviations.

gear

The advanced wafer heater structure design is adopted to control the surface temperature difference of the whole wafer within plus or minus 1.5 at an operating temperature of 450 degrees Celsius, which significantly improves the thickness uniformity and repeatability of thin film deposition.

gear

high-purity special ceramics and densified metal materials are selected to significantly reduce the physical bombardment wear in a strong plasma environment, and extend the replacement cycle of core wearing parts by more than 35%.

gear

vacuum chamber spare parts undergo strict surface treatment and degassing process, and the ultimate vacuum degree can reach 10 negative 8 torr, effectively reducing impurity defects in the process and improving chip yield.

gear

not only provide parts, but also have the overall upgrade and transformation capability for key parts such as load lock and lower cavity, so as to restore and improve the system stability of the old platform.

gear

The entire manufacturing process strictly implements international quality management system standards, and each product passes high vacuum and pressure resistance tests before leaving the factory to ensure high reliability on the mass production line.

Parameter ItemsTechnical Specifications and Indicators
Wafer processing specifications200 mm (8 inch) wafer
Typical deposition processAluminum, titanium, titanium nitride, barrier layer and seed layer deposition
heater materialHigh thermal conductivity aluminum nitride ceramics or special alloys
Ultimate Background VacuumLess than 9 × 10^-8 Torr
Process gas controlSupports high-precision proton flow meter configurations (such as argon and nitrogen).
Leakage rate standardLess than 1×10^-9 atm cc/sec
Mechanical operational stabilityThe mean time between failures (MTBF) is greater than 100,000 wafers.
Surface roughnessIn a specific region inside the cavity, Ra is less than 0.4 micrometers.

Endura 5500 Pvd Comparison Points

Endura 5500 Pvd
solution
Production line downtime due to the shutdown of original parts:

Chinsor Tech provides a full set of self-developed process spare parts, which solves the risk of equipment downtime in mature process fabs caused by the shutdown of technical support by the original factory or the shutdown of parts.

solution
Poor film uniformity of conventional third-party spare parts:

Chinsor Tech optimizes the heating wire wiring and material density inside the heater, solving the problem of excessive temperature gradient during heating of common replacement parts, resulting in substandard film deposition uniformity.

solution
The cavity body modification cycle is long and lacks technical cooperation:

Chinsor Tech has a professional engineering team to assist in the modification of the machine, which solves the problem that the fab cannot find a source factory with technical accumulation when carrying out the lower cavity replacement or load lock modification.

Mature process fab hardware engineer

suitable for engineers responsible for the maintenance of production line equipment such as analog chips, power devices and micro-electromechanical systems to help them solve the problems of core cavity wear and wafer heater aging.

Endura 5500 Pvd for people

Semiconductor equipment refurbishment and upgrade service providers

suitable for independent third-party enterprises specializing in second-hand semiconductor machine refurbishment, machine modification and second-hand trade, to provide stable, high-quality source component supply chain support.

Endura 5500 Pvd for people

Wafer Procurement and Supply Chain Management Manager

Suitable for procurement decision makers who are facing the pressure of high maintenance costs in the original factory and urgently need to find quality component replacement suppliers with quality system certification and stable delivery capabilities.

Endura 5500 Pvd for people

Semiconductor research institutes and pilot line operators

suitable for universities and scientific research platform technical teams that run special process development, need to customize the local structure of physical vapor deposition chambers or upgrade the function of the machine.

Endura 5500 Pvd for people
011

efore replacing the core spare parts, the sealing surface of the chamber must be thoroughly cleaned to ensure that there are no residual particles, and special tools are used to symmetrically tighten the bolts to ensure high vacuum sealing effect.

022

After installing the new wafer heater, multi-point temperature gradient test shall be carried out in vacuum state, and the temperature shall be gradually raised to the process temperature to ensure that the temperature uniformity meets the requirements of the production line.

033

When the spare parts are put into use for the first time, it is recommended that the hardware engineer gradually increase the radio frequency power, observe the reflected power of the cavity and the plasma glow state, and ensure that the electrical connection matches.

044

According to the cumulative number of wafers processed, the surface particles of the inner wall of the cavity and the ceramic shield are cleaned regularly to avoid the surface contamination of the wafer caused by the peeling of deposits.

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Success!
Submission failed! Please try again later!
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FAQ

FAQ

Q: Can the spare parts of Endura 5500 Pvd you provide directly replace the original parts?
A: Yes. Our products are designed and manufactured in strict accordance with the mechanical interface and electrical parameters of the original equipment, with extremely small dimensional tolerances and direct in-situ replacement.
Q: What is the effect on the uniformity of film deposition after replacing your heater?
A: Our heater adopts an optimized heat conduction design, which can maintain excellent wafer surface temperature difference control at operating temperature, which is beneficial to maintain or improve the thickness uniformity of the film.
Q: Do you have the ability to change and upgrade the whole machine platform for this equipment?
A: Yes. We not only supply parts, but also participate in many large-scale projects such as load lock transformation and lower cavity replacement, and have rich experience in system-level renovation and upgrade.
Q: What quality tests will be carried out before the products leave the factory to ensure the vacuum performance?
A: All vacuum chambers and key components must pass the strict helium mass spectrometer leak detector test before leaving the factory to ensure that the leak rate meets the strict standards of the semiconductor production line.
Q: Do you have relevant experience in export and international transportation of spare parts?
A: We have stable export experience in overseas markets, and our products have been exported to many countries such as the United States, Singapore, Japan, South Korea and Malaysia, and the delivery process is mature.
Q: How long does it take to purchase your spare parts in bulk?
A: As a source manufacturing plant, we have our own production line and standing inventory. The specific delivery period will be determined according to the order volume, but the overall significantly faster than the original purchase cycle.
certificate