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The Endura 5500 PVD system is the core choice for metallization processes in 200mm wafer fabrication with superior thin film deposition uniformity and chamber stability. As the source production plant for key components of semiconductor equipment, Chinsor Tech has its own technology accumulation and manufacturing workshop, which significantly reduces procurement costs and delivery time through the direct supply model.
Endura 5500 PVD is mainly used for aluminum connection line deposition of 8-inch wafers, titanium and titanium nitride barrier layer preparation, silicide formation and metal gate process of logic devices.
Through precision-designed PVD sputtering target spacing and electromagnetic field distribution, thin film deposition with a thickness deviation of less than 2% is achieved to ensure consistent electrical performance of semiconductor devices across the wafer.
ultra-high purity ceramic shielding and optimized air flow design are used inside the chamber, so that the number of particles above 0.1 microns is controlled below 10 per chip, significantly improving chip yield.
ceramic heating plate with high thermal conductivity is used, the heating rate reaches 50 degrees Celsius per minute, and the temperature difference between the plate surface is controlled within 3 degrees Celsius, effectively preventing wafer warping caused by film stress.
The key metal parts are made of special alloys that are resistant to high temperature corrosion, and hard anodized on the surface to extend the replacement cycle of spare parts by more than 30% and reduce maintenance frequency.
with the efficient LoadLock pre-pumping chamber, the single transfer cycle is shortened to 45 seconds, which greatly improves the production line output rate of the machine while ensuring the stability of the vacuum degree.
All replacement parts strictly follow OEM mechanical standards, and the tolerance is controlled within 0.02mm, realizing seamless connection with the existing 5500 PVD platform without secondary debugging.
The Endura 5500 PVD core components provided by Chinsor Tech are benchmarked against the industry’s top standards in material purity and processing accuracy. Compared with the general-purpose refurbished parts on the market, we pay more attention to the thermal stability test under the high temperature process to ensure that each part can maintain the physical size under the production pressure of 24 hours without slight deviation.
Chinsor Tech’s chamber shield for 5500 PVD solves the pain point of large film resistance in the edge area and improves the electrical pass rate by improving the ion path.
We use the enhanced ceramic packaging technology to solve the problem that the traditional heater is prone to micro-cracks under frequent hot and cold cycles, and the service life of the component is extended by more than 2 years.
Through ultrasonic vacuum degreasing and high-temperature vacuum baking process, Chinsor Tech has completely solved the problem of slow vacuum recovery caused by trace residues on the surface of spare parts.
responsible for improving the film quality of the Endura 5500 PVD process node, they need high-quality shield and target adapter components to optimize deposition parameters.
responsible for high-frequency troubleshooting and regular maintenance of 8-inch PVD equipment, looking for source manufacturers that can provide quick technical guidance and adapt parts.
Faced with the pressure of high cost and long lead time of original spare parts, seek reliable alternatives with ISO certification and independent manufacturing capabilities to reduce costs and increase efficiency.
companies engaged in the overall renovation of Endura platforms or the trading of used equipment need a stable supply chain to ensure that the vacuum performance and process of the refurbished machines meet the standards.
before installation, spare parts should be unpacked in a clean room environment, and secondary ion purging should be carried out to ensure that the installation surface is free of particles and avoid affecting the vacuum recovery of the chamber.
When installing the target, it is necessary to strictly calibrate the center alignment to ensure that it is horizontally parallel to the wafer position to prevent uneven distribution of film thickness due to angular tilt.
After replacing large-size metal parts, it is recommended to perform 12 hours of vacuum baking at 150 degrees Celsius to fully remove water molecules and volatiles adsorbed on the surface of the material.
During the operation of PVD deposition, the pressure change of the cooling gas on the back side needs to be monitored in real time to ensure efficient and stable heat conduction between the wafer and the hot plate.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Wafer size
0.5 to 10 mTorr
Process pressure
maximum 500 degrees Celsius
Substrate temperature
Wuxi Zhanshuo