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This guide provides comprehensive operation, maintenance and troubleshooting instructions for the Endura 5500 PVD system to ensure high vacuum stability and process consistency during semiconductor thin film deposition. As the source manufacturing plant for precision components of semiconductor equipment, Chinsor Tech skips the middle of the road and supplies to customers around the world, ensuring you get competitive factory direct sales prices and efficient technical response.
Endura 5500 systems are primarily used in 150mm and 200mm wafer fabrication, metallization interconnect processes, diffusion barrier deposition, and physical vapor deposition experiments.
the use of customized grade fluorine rubber sealing ring and precision sealing surface processing technology, so that the chamber vacuum degree is stably maintained at a very low pressure, reduce impurity pollution, the film defect rate is reduced by 15%.
detailed recording of the robot calibration parameters and chip path optimization instructions, effectively reduce the silicon chip in the transfer process of vibration, so that the wafer scratch and debris risk reduction 30%.
provide standardized troubleshooting lists for common error codes of load lock chambers and process chambers, shorten unplanned downtime, and increase average equipment utilization by more than 10%.
covering sputtering power curves and deposition rate reference values of different metal targets, helping engineers to quickly restore process standards after target replacement and reducing waste of debugging consumables.
defines the precise time interval between cryopump recovery and cathode maintenance, and extends the service life of key consumables by at least six months through preventive maintenance guidance.
strictly follow the semiconductor industry safety standards, provide detailed electrical isolation and chemical protection instructions, to ensure that the field operators in the high pressure and toxic gas environment zero accident.
The technical support plan provided by Chinsor Tech is more targeted than the general manual. We have digitally reconstructed the old system components of the Endura 5500 platform to ensure that all circuit diagrams are compatible with modern service tools. Compared with similar products, Chinsor Tech’s document content is more detailed in the description of parts interchangeability, which greatly improves the success rate of second-hand equipment restart.
For false error reporting caused by sensor aging, Chinsor Tech provides a deep voltage ratio scheme to help repairers accurately identify fault points and avoid wrong replacement of expensive controller modules.
Through accurate heating cycle and cooling water flow recommendations, we solve the problem of high standby power consumption of old equipment and help semiconductor factories reduce single-chip operating costs.
In response to the needs of multi-species and small batch production, Chinsor Tech summarized the guidelines for rapid chamber cleaning and preheating, and solved the problem of long vacuum recovery time after target replacement.
responsible for routine inspection and preventive maintenance of equipment in the fab, quickly obtain calibration data and disassembly steps through this manual to ensure uninterrupted operation of the production line.
When conducting new metal film deposition experiments, you need to refer to the power and gas flow parameters in the manual to establish a stable process window and optimize the film quality.
responsible for refurbishing and reselling semiconductor equipment, using the manual’s complete technical specifications and component lists to perform functional restoration and performance evaluation of old machines.
it is necessary to formulate equipment operation procedures and emergency treatment plans, refer to the safety standards and production throughput data in the manual, and plan the overall capacity allocation of the workshop.
confirm whether the cooling water pressure and power load meet the standards according to the requirements of the manual, and ensure that the external supply parameters are within the safe range before the equipment enters the preheating state.
start the mechanical pump and molecular pump, observe the vacuum drop curve, compare the standard pumping speed table in the manual, and confirm that there is no risk of atmospheric leakage at each sealed interface.
Use the teaching pendant to adjust the robot’s grasping position, and make fine adjustments according to the coordinate parameters provided in the document to ensure that the center offset of the wafer transfer between the chambers is within the allowable range.
observe the real-time current and voltage feedback when running the deposition program, record the fluctuation against the parameter manual, find the process abnormality in time and take interruption measures.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
5e-9 Torr
Vacuum pressure
200mm
Wafer size
4 to 6
Number of chambers
Wuxi Zhanshuo