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Endura 5500 is the 1 high-performance physical vapor deposition platform designed for 200mm wafer fabrication, ensuring superior semiconductor process consistency through precise vacuum control and thin film deposition techniques. Wuxi Zhanshuo Technology Co., Ltd. (Chinsor Tech), as a source factory with independent production capacity, relies on profound process accumulation to eliminate intermediate links, providing customers around the world with highly competitive original quality components and rapid technical response.
Endura 5500 is mainly used in 8-inch integrated circuit manufacturing, power device production, micro-electro-mechanical system processing and advanced semiconductor packaging technology.
The optimized heater structure design is adopted, and the temperature deviation is controlled within plus or minus 1%, which effectively improves the step coverage of thin film deposition and significantly reduces the risk of wafer warpage.
The key chamber seals are certified by ultra-high vacuum standards, and the leakage rate is less than 10 to the minus 9 power, ensuring a highly pure deposition environment and extending the equipment maintenance cycle.
The independently developed ceramic brittle material components have a hardness of up to 2000 Vickers hardness, which greatly reduces the particle pollution in the mechanical transmission process.
the improved pre-pumping chamber design improves the vacuum pumping efficiency by 20%, directly increases the wafer throughput per unit hour of the equipment, and improves the production efficiency.
the tolerance of key metal parts is controlled at 0.01mm level, ensuring 100 perfect fit with the original machine, reducing downtime caused by matching position error.
The improved shield design can achieve more uniform ion bombardment, make the resistivity distribution of the metal film more uniform, and improve the yield of the final chip.
Chinsor Tech provides Endura 5500-related components and services that are manufactured in strict compliance with first-class semiconductor industry standards. Compared with similar general-purpose parts in the market, our products have passed more stringent vacuum outgassing rate tests and thermal cycle stress tests to ensure that no deformation or performance degradation occurs in continuous production environments.
Chinsor Tech’s redesigned heating plate structure, through simulation of fluid heat conduction optimization, solves the pain point of inconsistent film thickness caused by too fast heat dissipation at the edge of the old component.
For the long-term loss of the vacuum chamber connection, we provide customized precision sealing surface treatment technology, so that the seal reliability is increased by 1 times and unplanned downtime is reduced.
the brittle spare parts made of high-purity reinforced alumina material have improved toughness by 15%, effectively solving the debris pollution caused by ceramic damage during high-speed transportation.
Responsible for the daily operation of 8-inch production line equipment, they need Endura 5500 spare parts solutions that can be replaced quickly, with stable performance and high cost performance.
companies committed to the trade and transformation of used equipment need to find partners with source manufacturing capabilities and the ability to provide customized upgrades and precision chamber maintenance services.
When developing new metal film deposition processes, hardware optimization of the existing Endura platform is required to meet the requirements of higher precision film physical parameters.
looking for a source factory that can provide ISO 9001 quality certification, stable supply capacity and international export experience to serve its global end customers.
Before installing Endura 5500 components, please confirm that the clean room environment is up to standard, and use high-purity isopropyl alcohol to thoroughly clean all sealing surfaces to ensure that there is no dust residue.
After the components are installed, a segmented vacuum test is required to observe whether the pressure rise rate meets the standard, and the heating program can be started after confirming that the system has no static leakage.
After replacing the new heating assembly, the temperature must be calibrated by the temperature measurement wafer, and the PID parameters must be adjusted to ensure that the actual operating temperature exactly matches the system set value.
It is recommended to check the shield and robot displacement after each 10000 wafers are processed, clean up the deposited carbon, and prevent the accumulation of particulate matter from affecting the film quality.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Applicable wafer size
10 minus 9 torr
Ultimate vacuum degree
plus or minus 1 degrees Celsius
Heater temperature accuracy
Wuxi Zhanshuo