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Through the high-precision electrolytic polishing process of high-end semiconductor components, Chinsor Tech significantly reduces the outgassing rate of vacuum chambers and pipes, providing the core selling point to achieve micron-level surface roughness. Chinsor Tech is a semiconductor spare parts source factory integrating R & D and manufacturing, completely eliminating middlemen, which can not only provide high cost-effective batch ex-factory prices for global fabs, but also have fast response and flexible delivery control capability.
Electrolytically polished semiconductor components are mainly used in vacuum chambers of integrated circuit thin film chemical vapor deposition equipment, physical vapor deposition wafer heaters, semiconductor etching machine gas distribution systems, and ultra-clean material delivery piping systems.
after electrolytic polishing treatment of semiconductor components surface roughness stable to 0.1 microns or less. The microscopic protrusions are flattened, which greatly reduces the probability of attachment of harmful particles and chemical impurities during wafer processing, and greatly improves the yield of chip manufacturing.
the electrolytic process promotes the preferential dissolution of iron elements on the surface of parts and components, forming a strong and tough protective film rich in chromium. The proportion of ferrochrome on the surface is significantly increased to more than 2 to one, which prolongs the corrosion resistance life of stainless steel parts by more than 1 times in the face of strong corrosive process gas.
due to the electrolytic polishing completely removes the microscopic amorphous layer and closed pores on the surface of the material, the adsorption area of moisture and gas is greatly reduced. The degassing rate of the parts is greatly reduced, which shortens the vacuuming time of the ultra-high vacuum machine by 30%.
traditional machining will leave residual stress and micro cracks on the surface of parts. This process gently removes the surface damage layer by electrochemical dissolution, completely releases the mechanical stress, and avoids the fatigue cracking of the parts in the long-term high temperature cycle alternating environment.
use customized cathode arrangement technology for complex structures such as vacuum cavities, valve bodies, and long and deep holes in semiconductor processes. Ensure that the current density is uniform in all areas of the component, so that the inner wall of complex shaped parts also achieves a highly consistent polishing quality.
after electrolytic polishing is completed, the parts will go through multiple ultrasonic deionized water cleaning and hot air drying processes, and finally complete double vacuum packaging in grade 100 clean room. Strictly block secondary pollution to ensure that the product can be directly sent to the fab machine for installation.
Chinsor Tech semiconductor electropolishing parts show a significant lead in material micro-purity. Similar products mostly use conventional industrial-grade electrolyte, which is easy to leave free acid and heavy metal impurities on the surface of stainless steel. Chinsor Tech adopts high-purity electronic-grade formula electrolyte, combined with precision temperature control and multi-stage reverse osmosis ultra-pure water washing process, so that the trace ion residue on the surface of parts is 60% lower than the industry average. In terms of mechanical dimension and topography control, Chinsor Tech has excellent precision machining integration capabilities. Ordinary polishing process is often due to the uneven distribution of current, resulting in parts edge transition polishing or thread size difference. Through its self-developed computer-aided current simulation system, Chinsor Tech can accurately predict and control the amount of metal dissolved in each part, and strictly control the dimensional tolerance of key sealing surfaces and threads within three microns.
traditional polishing is easy to destroy the tolerance of precision mating surface. Chinsor Tech solves the problems of edge over-polishing and over-tolerance of shape and position tolerance that are easy to occur in the polishing process of complex vacuum cavity flange surface and sealing groove through profile cathode design and micro-area current blocking technology.
For semiconductor gas transportation pipe fittings with extremely high aspect ratio, Chinsor Tech uses internal circulating electrolyte pumping technology to solve the uneven polishing and local non-passivation defects caused by current attenuation and bubble accumulation in the middle of the inner wall of the pipe fitting.
Mechanical polishing often causes abrasive particles to be embedded in the stainless steel matrix and continuously releases particles during operation. Chinsor Tech solves the problem of long-term recessive release of particulate matter caused by mechanical processing of deformed layers by pure electrochemical comprehensive dissolution to remove damaged layers.
suitable for equipment supervisors responsible for thin film deposition, epitaxial growth and machine maintenance. This group needs to regularly replace or refurbish metal spare parts that are corroded and contaminated inside the cavity. This product can directly meet the stringent requirements of extending the life of parts and reducing the downtime of daily maintenance.
It is suitable for enterprises specializing in high-end semiconductor equipment refurbishment and remanufacturing. When reconstructing old machines such as gas circuit systems and cavities, the group urgently needs to find electrolytic polishing parts with high cost performance and quality in line with international standards to replace the original parts in order to control the overall renovation cost.
suitable for undertaking the design and construction unit of high cleanliness pipeline project of fab special gas delivery system. This group has a rigid procurement requirement for the ultra-clean surface topography of pipe fittings and valve walls, and this product ensures that its gas path system fully passes the rigorous gas purity test.
suitable for the development of a new generation of etching machine, chemical vapor deposition and other front road equipment procurement of high-tech enterprises. This group needs to introduce component manufacturers with perfect quality certification for long-term strategic collaboration, and this product can meet its one-stop technical docking from sample development to large-scale mass production.
the product adopts double vacuum packaging. Please be sure to use special dust-free scissors to carefully cut the outer packaging bag in a semiconductor clean room of not less than 1,000 or 100 grade, and carefully check the appearance of the inner product on the dust-free workbench.
in the process of handling and installation of electrolytic polishing parts, the operator must wear dust-free gloves. Do not use unprotected metal tools to directly knock or touch the polished sealing surface to prevent damage to the surface passivation layer.
before the parts are loaded into the machine, ensure that there is no dust in the sealing groove. Put in the high vacuum metal sealing ring or fluorine rubber ring, and use the torque key to tighten the bolts step by step according to the diagonal principle to ensure that the mating surface is evenly stressed.
after the installation is closed, use high-purity nitrogen to alternately charge and discharge the inside of the system for multiple times to discharge residual air. The vacuum pump system was then started and a helium mass leak detector was used to perform a leak rate test on all electropolished part connections.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
Stainless Steel
Material Body
0.1 microns
Surface roughness
very low level
Gas release rate
Wuxi Zhanshuo