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Centura Emax is the 1 dielectric etching reaction chamber specially designed for ultra-large scale integrated circuit manufacturing. With excellent plasma uniformity and high aspect ratio etching capability, it has become the core component of 8-inch wafer processing. Wuxi Zhanshuo Technology Co., Ltd., as a source manufacturer with many years of industry accumulation, skips all intermediate links and provides mass customization and original standard spare parts with its own Taizhou factory to ensure that it provides you with highly competitive ex-factory prices and fast delivery cycles.
The Centura Emax is mainly applied to oxide etching, nitride etching, hard mask etching, and self-aligned contact hole etching.
by 0.5 Gaussian level of electromagnetic field adjustment accuracy, effectively improve the distribution of plasma on the wafer surface, so that the etching uniformity deviation is reduced to less than 3%, significantly improve the yield.
alumina ceramic materials with a purity of up to 99.7 are used to enhance the resistance by 40% in a fluorine-based plasma environment, extending the part replacement cycle from 500 hours to more than 800 hours.
The showerhead aperture tolerance is controlled at 0.02mm to ensure the uniform diffusion of the reaction gas inside the cavity and completely eliminate the quality risk of insufficient or over-etching of local etching.
equipped with high-performance electrostatic chuck, with ± 1 degrees Celsius surface temperature control capability, in continuous high-power operation can quickly dissipate heat, to prevent the photoresist due to local overheating and scorching deformation.
the inner wall of the cavity adopts ultra-thick dense alumina coating, and the hardness is increased to above 500 Vickers hardness, which effectively reduces the generation of fine particles and increases the cleaning and maintenance interval of the cavity by 2 times.
fully compatible with Centura 5200 platform standards, all interface position tolerances are controlled within 0.1mm, ensuring zero adjustment during the installation process, and reducing equipment downtime and installation time by 50%.
Compared with similar products in the market, the Centura Emax series components provided by Chinsor Tech have higher material purity and processing accuracy. Chinsor Tech has introduced ultra-precision CNC machine tools in the manufacturing process to ensure that the geometric tolerances of each 1 of key components far exceed the industry average standard, which can effectively extend the continuous and stable operation time of the equipment in a high-load production environment.
In view of the pain point of capacity loss caused by frequent replacement of ceramic rings, the ultra-corrosion-resistant ceramic parts developed by Chinsor Tech extend the single service life and reduce the number of unplanned maintenance throughout the year.
By optimizing the RF matcher and electrode structure, we have solved the problem of unstable etching rate in the later stage of traditional equipment operation, and ensured the process consistency from the first wafer to the 100th wafer.
In view of the pain point that cavities that have been used for many years are prone to micro-leakage, Chinsor Tech provides customized precision repair services for sealing surfaces to completely restore the original vacuum level of the equipment.
For companies specializing in the second-hand renovation and sale of Centura 5200 series equipment, Chinsor Tech provides complete core cavity and internal spare parts support to help them quickly repair equipment and return to production.
Engineers working in an 8-inch IDM or foundry are under pressure from the high price of original spare parts and can significantly reduce production line operating costs by adopting our high-performance replacement parts.
long-term supply of integrated circuit key consumables dealers, can rely on Chinsor Tech’s strong source factory capacity and patent endorsement, to obtain more competitive profit margins and supply security.
laboratories and pilot institutes engaged in the development of sensors and microfluidic chips need a stable medium etching environment for small batch trial production, and our cavity upgrade scheme can meet its diversified process research and development needs.
hoist the Emax cavity onto the 5200 platform, and adjust the flatness of the base with a precision level to ensure that the height error with the transmission plane of the manipulator does not exceed the specified range.
apply a very small amount of high vacuum silicone grease on the surface of fluorine rubber ring of all vacuum interfaces to ensure that the sealing surface is free of fiber foreign matter and then tighten it to prevent the cavity leakage from affecting the vacuum degree.
nitrogen and argon are introduced according to the equipment software interface, the response speed and accuracy of the mass flow meter are checked, and the gas transmission system is free of residual moisture or oxygen pollution.
turn on the RF in a low power state, confirm that the reflected power is reduced to a minimum by observing the capacitive action of the automatic matcher, and then perform standard wafer test etching to verify the process parameters.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Wafer size applicable
13.56 MHz
RF power frequency
0 to 60 gauss
Magnetic field strength range
Wuxi Zhanshuo