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By choosing the high-quality source channel buy semiconductor equipment parts, you can obtain precision parts with original factory-level process compatibility, greatly reducing the downtime of key machines. As a source factory integrating R & D and manufacturing, Chinsor Tech focuses on the localized manufacturing service of semiconductor core spare parts, eliminating the price increase of middlemen, and providing you with more advantageous direct supply price and controllable batch delivery cycle.
When the fab plans to buy semiconductor equipment parts, these high-precision parts are mainly used in integrated circuit thin film chemical vapor deposition equipment, physical vapor deposition heating plates, vacuum chamber sealing, and lower chamber modification of plasma etching equipment.
each 1 models for customers to buy semiconductor equipment parts options are processed by numerical control precision grinding, so that the tolerance of the core docking surface is controlled within 0.005mm. High-precision machining can reduce the mechanical stress during component assembly and reduce the mechanical wear rate by more than 65%.
the product is made of special alumina and silicon nitride ceramics with a purity of 99.9. In a high temperature or plasma process environment, the material has extremely high chemical stability, can block metal ion volatilization, and avoid batch scrapping caused by wafer contamination.
metal and cavity parts surface are advanced anti-corrosion coating technology, so that the parts in the face of fluorine-based or chlorine-based strong corrosive gas, its anti-corrosion ability than ordinary metal parts increased by 3 times, effectively reducing unplanned downtime.
The thermal conduction structure is optimized for the wafer hot plate assembly to maintain zero deformation in extreme operating environments at 1600 degrees Celsius. Excellent uniform temperature performance controls the wafer surface temperature difference in a small range to ensure the physical consistency of the deposited film.
parts used in vacuum environment pass strict helium mass spectrometer leak detection test before leaving the factory. The airtight leakage rate is much lower than the industry critical value, which can ensure the long-term stability of the internal process pressure of the machine and prevent the infiltration of external impurity gas.
products are precisely re-engineered according to the mechanical and structural characteristics of mainstream semiconductor equipment platforms. The size, hole position and electrical interface completely match the original specifications, and the purchaser can directly install and use the equipment parts after buy semiconductor.
When fab customers choose buy semiconductor to equipment parts channels, they Chinsor Tech to rely on mature precision ceramic brittle material processing and precision metal manufacturing technology to make the key semiconductor components delivered from the factory have extremely high geometric accuracy and physical and chemical stability. Through the strict comprehensive quality control system, the product performs well in dealing with extreme conditions such as high temperature and strong plasma etching, and its core wear resistance and corrosion resistance life has reached the industry-leading level.
In view of the dilemma faced by purchasing personnel of monopoly price and high budget of original factory parts, Chinsor Tech provides equivalent replacement spare parts with standard factory quality, which helps fabs to significantly reduce the purchase expenditure of core consumables while ensuring tolerance and material purity.
In order to solve the problem that equipment management personnel cannot buy some key tooling components on the market due to the shutdown of original equipment, Chinsor Tech assists customers in accurately remaking missing spare parts with its strong reverse mapping and precision processing capabilities.
In view of the pain point that process engineers face the lack of corrosion resistance of ordinary spare parts, which leads to frequent air leakage in the process cavity and contamination of wafers, Chinsor Tech adopts high-purity ceramics and protective coatings to solve the problem that metal parts are easily eroded by fluorine chlorine gas.
mainly for purchasing decision makers who need to buy semiconductor equipment parts regularly to maintain the normal operation of the wafer line. They need to strictly control the overall operating costs. The cost-effective and transparent and stable delivery cycle of this product can perfectly align its supply chain assessment indicators.
mainly for engineering and technology enterprises specializing in the recycling, renovation and transformation of old integrated circuit equipment. Such groups need to find reliable parts non-standard customized source factory. The original factory-level compatible specifications of this product can help it shorten the equipment modification and delivery cycle.
mainly for first-line engineers directly responsible for reducing abnormal machine downtime and improving process wafer yield. They are extremely sensitive to spare parts machining tolerances and material purity. The micron-level quality performance of this product can effectively meet their technical requirements for high stability of the equipment.
mainly for cross-border traders engaged in wholesale of precision tooling and consumable spare parts in the global semiconductor mature market. They need to find strong manufacturers with sound qualifications and sufficient production capacity. The first-hand ex-factory price provided by this factory can leave enough profit space for localization.
Unpacking the vacuum package in a standard clean room environment. Carefully check the appearance integrity of the spare parts and use measuring tools to check whether the tolerance of key installation holes meets the preset machine parameters.
Before installation, precision parts should be put into high-purity special cleaning agent for ultrasonic decontamination, thoroughly remove trace molecules that may be attached during transportation and storage, and enter the assembly line after complete drying.
Place the spare parts smoothly on the vacuum chamber or heating platform to ensure accurate reset of the positioning pin. Use a calibrated torque wrench to lock the bolts in a symmetrical sequence to avoid local stress.
close the cavity and start the vacuum system for helium mass spectrometry leak detection. After confirming that the overall leakage rate meets the ultra-high vacuum standard, gradually raise the temperature to the rated process temperature for running film testing to verify the thermal field stability of the components.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
0.005mm
Manufacturing tolerance
99.90%
Material purity
0.1 microns
Surface roughness
Wuxi Zhanshuo