Applied Materials semiconductor equipment | 0020-269738

As an original equipment manufacturer with a strong foundation in proprietary technology, Wuxi Chinsor Technology Co., Ltd. specializes in providing high-precision chamber upgrades, wafer‑heating plates (such as the 0020‑23350 RF heater shield), and custom-designed, refurbished precision ceramic and metal spare parts for applied materials semiconductor equipment. By eliminating all intermediary layers, we leverage our full‑scale manufacturing capabilities to offer you highly competitive ex‑factory pricing, faster delivery times, and superior localized technical support.

AMAT Centura 5200 and Endura series Applicable equipment platform
8-inch integrated circuit thin film CVD and PVD cavity components Core component process
PVD Wafer Heater independent heating technology Wafer heating technology
DPS POLY Lower Chamber cavity replacement Key modification of cavity
CO-TI Magnet magnetron sputtering target area modification Magnetron sputtering upgrade
ENDURA LoadLock upgrade Lock chamber retrofit
high purity semiconductor grade metal and precision brittle ceramic material Manufacturing material type
Applied Materials semiconductor equipment

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Independent research and development of core cavity technology, perfect adaptation AMAT platform

we have independent technology accumulation, for applied materials semiconductor equipment to provide high-precision cavity (such as CVD, PVD, vacuum cavity) manufacturing and transformation. Its process indicators are completely standard factory, ensuring excellent process compatibility and stability in high-demand environments such as thin film deposition and vapor deposition, and greatly reducing the offline time of your equipment.

gear

Wafer heating plate uniformity control, temperature control accuracy of ± 1°C

for PVD and CVD wafer heating system to carry out technical research, optimize the internal micro-thermal conduction structure of the heating plate. Under the high vacuum working environment of 350 ° C. to 450 ° C., the wafer surface temperature uniformity is improved to an excellent state, the wafer warpage caused by local thermal stress is effectively avoided, and the uniformity of the film deposition thickness is significantly improved.

gear

The cavity is replaced under DPS etching, and the anti-plasma corrosion life is doubled

the combined process of high-specification semiconductor-grade metal and special ceramic coating is adopted, which is specially designed to provide replacement manufacturing for plasma etching equipment (DPS POLY Lower Chamber). As a trusted supplier of CVD parts supplier and etching components, we provide products with excellent resistance to high-energy ion bombardment, so that the overall service life of the components is 1 times longer than conventional retrofit parts.

gear

High-performance LoadLock lock chamber system modification to improve vacuum transmission stability

Precision mechanism reconstruction and gas path optimization are implemented for the classic Endura platform lock chamber, significantly reducing the generation of particulate matter during high and low pressure switching. Its advanced shaft sealing and lifting mechanism improved design, the vacuum pumping speed and recovery stability are greatly improved, eliminating the hidden danger of process interruption caused by air leakage in the lock chamber.

gear

Precision ceramic brittle material processing, micron tolerance control and particle protection

We have advanced porcelain making and ultra-precision grinding capabilities, customized manufacturing including ceramic shower head (Showerhead), ceramic insulating ring, ceramic electrostatic chuck, etc. While ensuring the micron-level dimensional tolerance, the surface roughness reaches the nanometer level, which eliminate the particulate (Particle) pollution caused by the peeling of the dielectric material from the source.

gear

ISO 9001 has strict quality management and a high proportion of invention patents

as a high-tech enterprise with 52 patents (including a high proportion of invention patents) and 11 software copyrights, the company implements ISO 9001 quality certification standards in raw material procurement, precision machining, clean room assembly and ex-factory inspection, providing you with alternative grade parts with stable quality and 100 traceability.

Parameter CategoryTechnical SpecificationApplicable AMAT Chamber / SystemTechnical and Material Characteristics
Part Number0020-269738 — Shield RF Heater / Applied MaterialsCentura 5200 / EnduraSupports OEM part-number verification and seamless replacement of critical components such as RF heater shields.
Process Compatibility8-Inch (200 mm) Thin-Film CVD / PVD ProcessesCentura 5200 / EnduraDesigned for mainstream mature-node semiconductor production lines and specialized process applications.
Vacuum Chamber MaterialHigh-Purity Semiconductor-Grade Aluminum Alloy / Stainless Steel / TitaniumCVD, PVD & Etch ChambersProvides excellent vacuum sealing performance and an extremely low outgassing rate.
Heating Temperature ControlMaximum Operating Temperature: 450°C; Control Accuracy: ±1°CWafer Heater / Chamber LidDelivers highly uniform thermal distribution under high-vacuum conditions to ensure consistent process results.
Surface Coating ProcessHigh-Density Y₂O₃ Spray Coating / Specialized AnodizingLower Chamber / ShieldOffers exceptional resistance to plasma erosion while minimizing process contamination caused by impurities.
Ceramic Physical PropertiesAl₂O₃ Purity: >99.7% / AlN CeramicCeramic Showerhead & InsulatorProvides excellent high-frequency electrical insulation, thermal-shock resistance, and extremely low dielectric loss.
Mechanical Manufacturing ToleranceCritical Contact and Mating Surface Tolerance: ≤ ±0.005 mmMechanical Parts & Gate ValvesHigh-precision machining ensures seamless component integration and superior vacuum-tight performance.

Chinsor Tech’s applied materials semiconductor equipment refurbishment and spare parts replacement program completely solves the passive situation of fabs and equipment refurbishers facing the high cost of original spare parts and the lead time of many months. As a professional semiconductor equipment parts manufacturer, we provide 100 percent precision replacement parts that match the original PN code (such as 0020-23350 RF heater shield). Relying on the deep technical accumulation in the field of precision processing and 8-inch CVD equipment, the cavity replacement parts and wafer heaters we manufacture are not only fully compatible with the original factory in size, but also reach the industry-leading level in many core process performances. In addition, as a source factory, Chinsor Tech has a high-specification manufacturing system integrating R & D, production and testing. We not only provide equivalent replacement of basic components, but also carry out customized structural transformation (Retrofit & Modification) according to the process bottlenecks actually encountered in the customer’s production line. In the process of providing high-quality PVD chamber parts upgrade and manufacturing, we upgrade the traditional fragile metal parts to ceramic brittle materials with better performance, so that the working life of the system in strong corrosion, high-power RF environment has been a qualitative leap.

Applied Materials semiconductor equipment
solution

Production and Supply of Original Key Spare Parts and High Purchase Cost

Chinsor Tech provides cost-effective 1:1 precision spare parts and cavity renovation and replacement services for applied materials semiconductor equipment classic platform, perfectly solves the maintenance problems after production of original equipment (EOL), and saves customers more than 40% of spare parts purchase expenses.

solution

The uneven heat distribution of the traditional heating plate leads to poor film forming quality

Chinsor Tech, as an experienced CVD parts supplier, optimizes the developed wafer heater (Wafer Heater) and adopts advanced three-dimensional heat conduction structure and precision resistor arrangement to solve the problem of poor CVD film thickness and in-chip uniformity caused by large temperature difference on the surface of the heating plate, thus significantly improving the yield.

solution

The etching process cavity is corroded by high-energy plasma, resulting in high-frequency shutdown and maintenance

the lower cavity replacement developed by Chinsor Tech solves the problem of fast consumption of metal parts in high-corrosion plasma environment by using high-purity ceramic brittle materials and patented anti-etching coatings in key areas, and prolongs the cavity maintenance cycle by more than 1 times.

Purchasing Director of Medium and Large Wafer Factories (Foundry)

Suitable for mature 8-inch and 12-inch wafer production lines facing the pressure of cost reduction and efficiency enhancement and high operation and maintenance costs of production line equipment. By purchasing our high-quality replacement parts and retrofit services, fixed maintenance expenses are significantly reduced while maintaining the original production process window.

applied materials semiconductor equipment Applicable Crowd

Semiconductor Used Equipment Refurbishers and Service Providers (Refurbisher)

Applicable to global equipment service providers specializing in the renovation and sales of AMAT classic platforms (such as Centura 5200, Endura). We provide a complete and stable set of chambers, valves, heaters and transmission mechanisms, and are your reliable supply chain partner for the rapid delivery of high-quality refurbished equipment.

applied materials semiconductor equipment Applicable Crowd

Fab Thin Film (CVD/PVD) and Etching (Etch) process engineers

For first-line technologists working to remove bottlenecks in production lines and improve equipment stability (Uptime). We offer local chamber technology upgrades and wafer heater improvements that directly improve film uniformity and reduce dust (Particle) generation to meet stringent process specifications.

applied materials semiconductor equipment Applicable Crowd

Procurement Supervisor of Semiconductor Research Institute and University Micro-nano Manufacturing Center

Applicable to scientific research and academic units equipped with AMAT research and trial production equipment. Our professional customized development and low MOQ limit can efficiently meet the diversified and customized hardware configuration requirements of laboratory equipment transformation, special gas process cavity upgrade and experimental device development.

applied materials semiconductor equipment Applicable Crowd
011

After unpacking, the operator must carefully check the size parameters, hole distribution and seal groove size against the factory certificate (CoC) attached to the component to ensure that the spare part model completely matches the equipment cavity specification semiconductor the applied materials to be replaced.

022

the parts should be unpacked in a dust-free room of Class 100 and above, and the surface should be pre-wiped with semiconductor-grade high-purity isopropyl alcohol (IPA), and purged with high-purity nitrogen gun to remove particles, so as to avoid introducing dust pollution into the vacuum chamber during installation.

033

During the replacement of the cavity or Heater, a high-specification perfluoroether (FFKM) vacuum O-ring must be used. Bolt fastening shall strictly follow the principle of symmetrical and multi-step tightening (using torque wrench) to prevent vacuum leakage due to slight deformation of the sealing surface caused by uneven force.

044

after the installation is completed, the system is vacuumed and baked (Bake-out) for exhaust, and the helium mass spectrometer leak detector is used for overall air tightness test (the leak rate reaches the standard). Subsequently, the process is carried out to check the uniformity of film growth thickness and the level of particles in the film, and the production can only be connected to the grid after each index is qualified.

certificate

6 1

Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.

Q1: Can the spare parts provided by Chinsor Tech completely replace the original parts of Applied Materials?
A1: Yes. As a professional semiconductor equipment parts manufacturer, our spare parts are applied to the original technical specifications of the materials semiconductor equipment during the design and development stage. We have carried out extreme process optimization in vacuum sealing, temperature resistance and high frequency electrical characteristics, which can be directly replaced on Centura 5200, Endura and other platforms.
Q2: What are your success stories in refurbishing and manufacturing AMAT equipment cavity parts?
A2: We have accumulated rich project experience in this field. For example, from 2024 to 2025, we successfully implemented the CO-TI Magnet magnetron sputtering transformation, ENDURA LoadLock upgrade and 6A ETCH DPS POLY Lower Chamber replacement manufacturing project in Wuxi’s large local fab, which were well received by the industry.
Q3: As your CVD parts supplier, how does your wafer heater (Wafer Heater) solve the temperature uniformity problem?
A3: We optimized the internal heating wire (resistor) arrangement and heat transfer medium structure through three-dimensional numerical thermal field simulation. This allows the surface temperature difference of the Heater to be controlled within an extremely excellent range when operating in high vacuum above 350°C, thus ensuring the uniformity of the CVD deposited film.
Q4: After replacing your PVD chamber parts, will the process window (Process Window) of the equipment be affected?
A4: Basically not. We in the processing accuracy, material purity and surface characteristics (roughness, anti-corrosion layer) control, are used with the original factory extremely consistent process standards. After the installation and running film debugging are completed, the equipment process window can remain stable, without the need for process engineers to adjust the original parameters on a large scale.
Q5: As the source factory, how do you guarantee the quality control and traceability of the delivered spare parts (such as 0020-23350 RF heater shield)?
A5: The company fully implements the ISO 9001 quality management system. All materials are provided with material certification, the processing process after strict three-coordinate measurement. Parts are subjected to a full range of visual, dimensional and vacuum leak tests before leaving the factory, and each precision spare part is assigned a unique serial number to ensure full life cycle traceability.
Q6: How long does it usually take from inquiry to delivery?
A6: As the source factory, Chinsor Tech has a more efficient supply chain and production flexibility than the original factory’s delivery time of 6 to 9 months. For conventional cavity spare parts (such as 0020-23350, etc.) and wafer heaters, we can usually complete the manufacturing, inspection and shipment within 4 to 8 weeks after receiving the confirmation order and technical drawings.
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Applied Materials semiconductor equipment | 0020-269738

As an original equipment manufacturer with a strong foundation in proprietary technology, Wuxi Chinsor Technology Co., Ltd. specializes in providing high-precision chamber upgrades, wafer‑heating plates (such as the 0020‑23350 RF heater shield), and custom-designed, refurbished precision ceramic and metal spare parts for applied materials semiconductor equipment. By eliminating all intermediary layers, we leverage our full‑scale manufacturing capabilities to offer you highly competitive ex‑factory pricing, faster delivery times, and superior localized technical support.

Applied Materials semiconductor equipment

gear

we have independent technology accumulation, for applied materials semiconductor equipment to provide high-precision cavity (such as CVD, PVD, vacuum cavity) manufacturing and transformation. Its process indicators are completely standard factory, ensuring excellent process compatibility and stability in high-demand environments such as thin film deposition and vapor deposition, and greatly reducing the offline time of your equipment.

gear

for PVD and CVD wafer heating system to carry out technical research, optimize the internal micro-thermal conduction structure of the heating plate. Under the high vacuum working environment of 350 ° C. to 450 ° C., the wafer surface temperature uniformity is improved to an excellent state, the wafer warpage caused by local thermal stress is effectively avoided, and the uniformity of the film deposition thickness is significantly improved.

gear

the combined process of high-specification semiconductor-grade metal and special ceramic coating is adopted, which is specially designed to provide replacement manufacturing for plasma etching equipment (DPS POLY Lower Chamber). As a trusted supplier of CVD parts supplier and etching components, we provide products with excellent resistance to high-energy ion bombardment, so that the overall service life of the components is 1 times longer than conventional retrofit parts.

gear

Precision mechanism reconstruction and gas path optimization are implemented for the classic Endura platform lock chamber, significantly reducing the generation of particulate matter during high and low pressure switching. Its advanced shaft sealing and lifting mechanism improved design, the vacuum pumping speed and recovery stability are greatly improved, eliminating the hidden danger of process interruption caused by air leakage in the lock chamber.

gear

We have advanced porcelain making and ultra-precision grinding capabilities, customized manufacturing including ceramic shower head (Showerhead), ceramic insulating ring, ceramic electrostatic chuck, etc. While ensuring the micron-level dimensional tolerance, the surface roughness reaches the nanometer level, which eliminate the particulate (Particle) pollution caused by the peeling of the dielectric material from the source.

gear

as a high-tech enterprise with 52 patents (including a high proportion of invention patents) and 11 software copyrights, the company implements ISO 9001 quality certification standards in raw material procurement, precision machining, clean room assembly and ex-factory inspection, providing you with alternative grade parts with stable quality and 100 traceability.

Parameter CategoryTechnical SpecificationApplicable AMAT Chamber / SystemTechnical and Material Characteristics
Part Number0020-23350 — Shield RF Heater / Applied MaterialsCentura 5200 / EnduraSupports OEM part-number verification and seamless replacement of critical components such as RF heater shields.
Process Compatibility8-Inch (200 mm) Thin-Film CVD / PVD ProcessesCentura 5200 / EnduraDesigned for mainstream mature-node semiconductor production lines and specialized process applications.
Vacuum Chamber MaterialHigh-Purity Semiconductor-Grade Aluminum Alloy / Stainless Steel / TitaniumCVD, PVD & Etch ChambersProvides excellent vacuum sealing performance and an extremely low outgassing rate.
Heating Temperature ControlMaximum Operating Temperature: 450°C; Control Accuracy: ±1°CWafer Heater / Chamber LidDelivers highly uniform thermal distribution under high-vacuum conditions to ensure consistent process results.
Surface Coating ProcessHigh-Density Y₂O₃ Spray Coating / Specialized AnodizingLower Chamber / ShieldOffers exceptional resistance to plasma erosion while minimizing process contamination caused by impurities.
Ceramic Physical PropertiesAl₂O₃ Purity: >99.7% / AlN CeramicCeramic Showerhead & InsulatorProvides excellent high-frequency electrical insulation, thermal-shock resistance, and extremely low dielectric loss.
Mechanical Manufacturing ToleranceCritical Contact and Mating Surface Tolerance: ≤ ±0.005 mmMechanical Parts & Gate ValvesHigh-precision machining ensures seamless component integration and superior vacuum-tight performance.

applied materials semiconductor equipment contrast point

Applied Materials semiconductor equipment
solution
Production and Supply of Original Key Spare Parts and High Purchase Cost

Chinsor Tech provides cost-effective 1:1 precision spare parts and cavity renovation and replacement services for applied materials semiconductor equipment classic platform, perfectly solves the maintenance problems after production of original equipment (EOL), and saves customers more than 40% of spare parts purchase expenses.

solution
The uneven heat distribution of the traditional heating plate leads to poor film forming quality

Chinsor Tech, as an experienced CVD parts supplier, optimizes the developed wafer heater (Wafer Heater) and adopts advanced three-dimensional heat conduction structure and precision resistor arrangement to solve the problem of poor CVD film thickness and in-chip uniformity caused by large temperature difference on the surface of the heating plate, thus significantly improving the yield.

solution
The etching process cavity is corroded by high-energy plasma, resulting in high-frequency shutdown and maintenance

the lower cavity replacement developed by Chinsor Tech solves the problem of fast consumption of metal parts in high-corrosion plasma environment by using high-purity ceramic brittle materials and patented anti-etching coatings in key areas, and prolongs the cavity maintenance cycle by more than 1 times.

Purchasing Director of Medium and Large Wafer Factories (Foundry)

Suitable for mature 8-inch and 12-inch wafer production lines facing the pressure of cost reduction and efficiency enhancement and high operation and maintenance costs of production line equipment. By purchasing our high-quality replacement parts and retrofit services, fixed maintenance expenses are significantly reduced while maintaining the original production process window.

applied materials semiconductor equipment Applicable Crowd

Semiconductor Used Equipment Refurbishers and Service Providers (Refurbisher)

Applicable to global equipment service providers specializing in the renovation and sales of AMAT classic platforms (such as Centura 5200, Endura). We provide a complete and stable set of chambers, valves, heaters and transmission mechanisms, and are your reliable supply chain partner for the rapid delivery of high-quality refurbished equipment.

applied materials semiconductor equipment Applicable Crowd

Fab Thin Film (CVD/PVD) and Etching (Etch) process engineers

For first-line technologists working to remove bottlenecks in production lines and improve equipment stability (Uptime). We offer local chamber technology upgrades and wafer heater improvements that directly improve film uniformity and reduce dust (Particle) generation to meet stringent process specifications.

applied materials semiconductor equipment Applicable Crowd

Procurement Supervisor of Semiconductor Research Institute and University Micro-nano Manufacturing Center

Applicable to scientific research and academic units equipped with AMAT research and trial production equipment. Our professional customized development and low MOQ limit can efficiently meet the diversified and customized hardware configuration requirements of laboratory equipment transformation, special gas process cavity upgrade and experimental device development.

applied materials semiconductor equipment Applicable Crowd
011

After unpacking, the operator must carefully check the size parameters, hole distribution and seal groove size against the factory certificate (CoC) attached to the component to ensure that the spare part model completely matches the equipment cavity specification semiconductor the applied materials to be replaced.

022

the parts should be unpacked in a dust-free room of Class 100 and above, and the surface should be pre-wiped with semiconductor-grade high-purity isopropyl alcohol (IPA), and purged with high-purity nitrogen gun to remove particles, so as to avoid introducing dust pollution into the vacuum chamber during installation.

033

During the replacement of the cavity or Heater, a high-specification perfluoroether (FFKM) vacuum O-ring must be used. Bolt fastening shall strictly follow the principle of symmetrical and multi-step tightening (using torque wrench) to prevent vacuum leakage due to slight deformation of the sealing surface caused by uneven force.

044

after the installation is completed, the system is vacuumed and baked (Bake-out) for exhaust, and the helium mass spectrometer leak detector is used for overall air tightness test (the leak rate reaches the standard). Subsequently, the process is carried out to check the uniformity of film growth thickness and the level of particles in the film, and the production can only be connected to the grid after each index is qualified.

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FAQ

FAQ

Q1: Can the spare parts provided by Chinsor Tech completely replace the original parts of Applied Materials?
A1: Yes. As a professional semiconductor equipment parts manufacturer, our spare parts are applied to the original technical specifications of the materials semiconductor equipment during the design and development stage. We have carried out extreme process optimization in vacuum sealing, temperature resistance and high frequency electrical characteristics, which can be directly replaced on Centura 5200, Endura and other platforms.
Q2: What are your success stories in refurbishing and manufacturing AMAT equipment cavity parts?
A2: We have accumulated rich project experience in this field. For example, from 2024 to 2025, we successfully implemented the CO-TI Magnet magnetron sputtering transformation, ENDURA LoadLock upgrade and 6A ETCH DPS POLY Lower Chamber replacement manufacturing project in Wuxi’s large local fab, which were well received by the industry.
Q3: As your CVD parts supplier, how does your wafer heater (Wafer Heater) solve the temperature uniformity problem?
A3: We optimized the internal heating wire (resistor) arrangement and heat transfer medium structure through three-dimensional numerical thermal field simulation. This allows the surface temperature difference of the Heater to be controlled within an extremely excellent range when operating in high vacuum above 350°C, thus ensuring the uniformity of the CVD deposited film.
Q4: After replacing your PVD chamber parts, will the process window (Process Window) of the equipment be affected?
A4: Basically not. We in the processing accuracy, material purity and surface characteristics (roughness, anti-corrosion layer) control, are used with the original factory extremely consistent process standards. After the installation and running film debugging are completed, the equipment process window can remain stable, without the need for process engineers to adjust the original parameters on a large scale.
Q5: As the source factory, how do you guarantee the quality control and traceability of the delivered spare parts (such as 0020-23350 RF heater shield)?
A5: The company fully implements the ISO 9001 quality management system. All materials are provided with material certification, the processing process after strict three-coordinate measurement. Parts are subjected to a full range of visual, dimensional and vacuum leak tests before leaving the factory, and each precision spare part is assigned a unique serial number to ensure full life cycle traceability.
Q6: How long does it usually take from inquiry to delivery?
A6: As the source factory, Chinsor Tech has a more efficient supply chain and production flexibility than the original factory’s delivery time of 6 to 9 months. For conventional cavity spare parts (such as 0020-23350, etc.) and wafer heaters, we can usually complete the manufacturing, inspection and shipment within 4 to 8 weeks after receiving the confirmation order and technical drawings.
certificate