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Listed Unit: Centura II DPS · E10-0015 · DRP1P3
This Applied Materials Etch listing is a used, deinstalled 200 mm Centura II DPS system for buyers matching an existing DPS equipment configuration by tool ID, serial number, chamber and wafer size. The listed legacy DPS tool differs from newer selective etch systems, whose published capabilities cannot be transferred to this unit. Plasma etch removes exposed wafer film while the mask protects the intended circuit pattern.
Applied Materials etch includes distinct Centura, Producer and Centris systems, so their product names do not describe interchangeable hardware.
The equipment record points to the 200 mm Centura II DPS tool, not to a Producer or Centris mainframe. DPS names a plasma-source family; a chamber name and hardware record identify the process configuration more precisely than the platform brand alone.
A matching request can cite listing code E10-0015, tool ID DRP1P3 and serial number 9532 alongside the fab's existing chamber configuration. These identifiers distinguish this used unit from another Centura generation or etch process family.
This 200 mm Centura II DPS listing belongs on a DPS replacement search rather than a search for Producer or Centris equipment.
Recent Applied Materials etch announcements include selective processes built around different removal mechanisms from the listed Centura II DPS.
Applied Materials describes Producer Selectra as a radical-based selective-etch system. Its target-film selectivity and advanced-patterning use belong to that separate product, rather than to every Applied Materials etch chamber.
The Centura II DPS listing is a used, as-is 200 mm system. Its acquisition case rests on the actual installed chambers and condition of the listed unit, not on performance claims from newer product announcements.
Producer Selectra's radical-based, highly selective removal should not be treated as a capability of this deinstalled DPS tool.
Plasma etching removes exposed wafer film while a patterned mask protects material that must remain.
In dry etch, an etch-resistant mask covers the wafer areas that must remain while plasma reacts with and removes exposed material. The process can target different conductor or dielectric films when the chamber and recipe support that film.
DPS separates plasma generation from the wafer-bias setting, giving process engineers different controls over reactive species and ion energy. The installed source, gas chemistry and hardware version determine the actual recipe envelope of a particular used tool.
For a DPS chamber, gas chemistry, source power and wafer bias shape the removal process, so a named tool does not by itself fix an etch recipe.
The listing identifies one used Centura II DPS system; these fields describe the specific unit rather than every Centura configuration.
One used equipment unit is quoted on a per-tool basis with a defined packing and dispatch route.
Chinsortech handles this used-tool enquiry from Wuxi and also works in semiconductor parts and equipment after-sales service.
Wu Xi Chinsor Technology Co., Ltd. supplies semiconductor equipment parts and supports related equipment after sales. Its parts business includes development and manufacturing of precision components; Applied Materials remains the original equipment maker of the Centura II DPS tool.
The certificate names Wuxi Zhanshuo Science and Technology Co., Ltd. as its holder. Its ISO 9001:2015 scope covers semiconductor precision mechanical parts production through October 2027; it does not document the operating condition of this used Centura II DPS tool.
Quote requests for the Centura II DPS can identify tool ID DRP1P3, the required configuration and the delivery destination.
Your details are used to respond to this equipment enquiry.
These separate product listings serve their own tool configurations; they are not presented as interchangeable Centura II DPS parts.
An Endura-family TiN chamber assembly, listed separately from this DPS tool.
An Endura-family IMP chamber assembly, listed separately from this DPS tool.
A transfer robot product with its own tool fit and part identity.
A transfer robot product for a different equipment configuration.
Wuxi Zhanshuo