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The Applied Materials Endura 5500 is the global benchmark equipment for physical vapor deposition processes in 200mm wafer manufacturing, ensuring high output with its excellent film uniformity and system stability. As the source production plant for core components of semiconductor equipment, Chinsor Tech can provide you with original standard precision parts manufacturing and system upgrade services to ensure faster stocking response while reducing procurement costs.
Integrated circuit metallization, barrier layer deposition, wafer backside metallization processing, and seed layer preparation in advanced packaging.
By precisely controlling the magnetic field distribution and the target spacing, the film thickness non-uniformity is controlled within 2%, and the electrical performance consistency of the terminal chip is significantly improved.
the use of double-arm magnetic drive manipulator, the average number of trouble-free cycles more than 1 million times, effectively reducing the cassette transmission failure caused by unexpected downtime.
Equipped with multi-stage cryogenic pump system, it can achieve extremely high vacuum in a short time, reduce the oxygen content in the cavity to a minimum, and ensure the high purity and adhesion of the metal film.
Supports the integration of pre-cleaning, degassing and multiple metal deposition chambers on the same platform, enabling continuous in-situ processing to avoid wafer oxidation during transport.
The temperature fluctuation range of the heating plate is controlled between the poles to ensure that the wafer is heated evenly during the complex deposition process and to prevent wafer warping or cracking caused by thermal stress.
The optimized gas path system and shield structure reduce the accumulation of by-products in the process, and the level of particle control reaches the world’s leading level, directly improving wafer yield.
Chinsor Tech’s strength lies in its deep understanding of the Applied Materials Endura 5500 core consumables. As the source factory, we control the processing tolerance of ceramic heating plate and robot parts at micron level, which makes our components fully reach the original factory level in terms of adaptability, and shorten the procurement cycle by about 40%. Chinsor Tech offers cathode structures optimized for the performance degradation of older equipment. By improving the magnetic field path, we have increased the utilization rate of the target material by 15%, while minimizing the process drift for thousands of hours, making the old equipment glow close to the production efficiency of the new machine.
Chinsor Tech through the local factory spot reserve and flexible manufacturing, to solve the procurement decision-makers in the face of production line downtime in the urgent need of key consumables urgency.
the source price system we provide solves the fab’s financial goal of reducing operating expenses and increasing profit margins while ensuring process quality.
For the messy third-party parts on the market, Chinsor Tech solves the problem of vacuum leakage and particle increase caused by engineers due to substandard installation tolerances.
Seeking high-quality, cost-effective alternatives to PVD equipment spare parts to optimize the supply chain cost structure and ensure the safety of material supply.
Responsible for maintaining high uptime of the machine, requiring the support of precision mechanical components that meet technical standards and deliver quickly.
When developing a new metallization process, a cluster deposition platform with stable performance and a wide range of adjustable parameters is required as the basis for experiments and mass production.
When carrying out machine renovation and export business, they need a reliable source factory to assist them in restoring the technical indicators of the equipment to the factory state.
Before starting the extraction sequence, it must be confirmed that the sealing ring is free of foreign matter, and after the vacuum degree reaches the preset value, a degassing cycle of at least two hours must be carried out.
When replacing the target, a special centering tool is required to ensure that the magnetron trajectory is parallel to the target surface to obtain the ideal sputtering distribution.
Regularly check the actual surface temperature through the multi-point thermocouple tester and enter the compensation offset in the control system to ensure process consistency.
In manual mode, confirm the placement center point of the wafer in each chamber one by one, and repeatedly verify the repeated positioning accuracy before saving the coordinates.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Wafer size
up to 7 sites
Number of cavities
5.0 E-9 Torr
Ultimate pressure
Wuxi Zhanshuo