Applied Materials Chamber

Chinsortech can evaluate and manufacture six chamber assemblies: two CVD process chambers for film deposition, a P5000 etch chamber body for material removal, an Endura transfer chamber for wafer movement, a Centura multi-slot cooldown chamber for post-process cooling and staging, and an Endura degas chamber for wafer preparation before PVD. Each second-source-new or made-to-order assembly is assessed against its listed part number and approved configuration; platform names or similar appearance do not establish interchangeability.

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P5000 Unibody Etch Chamber 0040-09723-C
Transfer Chamber 0040-49834-003 for Endura 5500 PVD

Six Chambers in Two Product Groups

Product List

Process chambers act directly on the wafer. The DXZ SiN Chamber Assy is the SiN CVD option for its listed Centura 5200 DCVD configuration. The separate Process Chamber, PN 215-00042-000-A05, is another CVD chamber tied to that individual part number. The Unibody Etch Chamber, PN 0040-09723-C, is the one-piece etch body for its confirmed P5000 build.

Support chambers move or condition wafers around those process steps. The Transfer Chamber, PN 0040-49834-003, moves wafers within the confirmed Endura 5500 PVD configuration. The Cooldown Chamber Multi Slot Assy, PN 0010-37264, cools and temporarily stages multiple wafers after processing in its listed Centura build. The Degas Chamber, PN 0020-70376, removes moisture and volatile residues before PVD processing in its listed Endura build; it is not a PVD deposition chamber.

Product groupChamberPrimary purpose
Process—CVDDXZ SiN Chamber AssySiN film deposition in the identified Centura 5200 DCVD configuration
Process—CVDProcess ChamberCVD processing for PN 215-00042-000-A05
Process—etchUnibody Etch ChamberMaterial-removal chamber body for PN 0040-09723-C and its identified P5000 build
Support—transferTransfer ChamberWafer movement in the confirmed Endura 5500 PVD configuration
Support—cooldownCooldown Chamber Multi Slot AssyPost-process wafer cooling and temporary staging
Support—degasDegas ChamberWafer preparation before PVD, not PVD deposition

Selection Boundaries for Each Chamber Type

Product List

CVD chambers: distinguish the required film process, complete part number, chamber revision and installed wafer size. The DXZ SiN assembly is tied to its listed Centura 5200 DCVD configuration, while PN 215-00042-000-A05 is a separate CVD chamber and not a generic Applied Materials process chamber.

Etch chamber: match PN 0040-09723-C, including its suffix, to the confirmed P5000 build, process type, wafer size, pumping, gas-feed, electrode and cooling arrangement. Other P5000 etch bodies are outside that identification.

Transfer chamber: confirm the Endura 5500 PVD configuration, robot envelope, connected-port layout, slit-valve geometry and wafer-transfer height. A common transfer function does not make chambers interchangeable across platforms.

Cooldown chamber: confirm the listed Centura build, wafer size, slot count, slot spacing, transfer height and cooling connections. It is a post-process support module, not a process chamber or a universal multi-slot chamber.

Degas chamber: confirm the Endura 5500 PVD build, wafer format, heater arrangement, vacuum interfaces and chamber revision. It prepares wafers before PVD and does not perform deposition.

For quotation and technical confirmation, provide the complete part number and revision, platform and chamber name, process, wafer size, quantity, equipment configuration, and any approved drawing, chamber-label photograph, critical dimensions or physical sample. Final installation fit and process performance depend on the customer's actual tool configuration and the technical requirements approved by both parties.

Manufacture and Inspection to Approved Requirements

Product List

After the part number, revision, approved drawing or physical sample establishes the product definition, Chinsortech can evaluate and manufacture the chamber to the agreed material, surface and interface requirements. Inspection scope—such as identity, critical dimensions, sealing and locating surfaces, passages, connections, cleanliness or function-related checks—is selected and executed according to the requirements approved by both parties; it is not a fixed package for every chamber.

Six Applied Materials Chamber Assemblies

Chinsortech supplies a focused range of chamber assemblies for CVD, PVD support, wafer transfer, cooldown, degas, and etch service. Each item is identified by its own part number and platform or process context. These second-source-new or made-to-order products are evaluated against the specified part number and confirmed equipment configuration. They do not imply standard inventory, cross-platform interchangeability or installation without technical verification.

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DXZ SiN Chamber Assy 0290-35673-01 for Centura 5200 DCVDSecond-source-new or made-to-order evaluation; quotation confirms supply condition, inspection scope and schedule.

DXZ SiN Chamber Assy — PN 0290-35673-01

A SiN CVD process chamber assembly evaluated for the listed Centura 5200 DCVD configuration. Wafer size must match that configuration; the DXZ name alone does not establish cross-size compatibility.

  • Application / fitSiN film-deposition chamber assembly for the identified Centura 5200 DCVD build
  • Selection boundaryWafer size, chamber revision and process build confirmed from the installed configuration
  • MaterialMachined aluminum-alloy chamber body; material, finish and process-contact surfaces to approved technical requirements
  • Interface basisAlternative-part geometry evaluated against PN 0290-35673-01 and approved technical data, including seal faces, gas/exhaust, cooling, lift and sensor interfaces
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Process Chamber 215-00042-000-A05 for semiconductor CVD equipmentSecond-source-new or made-to-order evaluation; quotation confirms supply condition, inspection scope and schedule.

Process Chamber — PN 215-00042-000-A05

A separate CVD process chamber evaluated specifically against PN 215-00042-000-A05. It does not represent or fit every Applied Materials process-chamber configuration.

  • Application / fitCVD process chamber for the identified part-number configuration
  • Selection boundaryExact tool, wafer size, chemistry and chamber revision confirmed during technical review
  • MaterialMachined aluminum alloy with sealing and process surfaces to approved technical requirements
  • Interface basisAlternative-part geometry evaluated against PN 215-00042-000-A05 and approved technical data, including slit-valve, mounting, gas, exhaust, cooling and electrical interfaces
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Cooldown Chamber Multi Slot Assy 0010-37264 for Centura 5200 DCVDSecond-source-new or made-to-order evaluation; quotation confirms supply condition, inspection scope and schedule.

Cooldown Chamber Multi Slot Assy — PN 0010-37264

A multi-slot post-process cooling and temporary staging assembly for the listed Centura 5200 DCVD configuration. It is a support chamber, not a process chamber or a universal multi-slot module.

  • Application / fitWafer cooling and staging after processing
  • Selection boundarySlot count, wafer size, transfer height and installed Centura build confirmed from approved references
  • MaterialAluminum-alloy structure with wafer supports and cooling features to approved technical requirements
  • Interface basisAlternative-part geometry evaluated against PN 0010-37264 and approved technical data, including slot spacing, vacuum seal, cooling and robot access
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Degas Chamber 0020-70376 for Endura 5500 PVDSecond-source-new or made-to-order evaluation; quotation confirms supply condition, inspection scope and schedule.

Degas Chamber — PN 0020-70376

An Endura 5500 PVD degas support chamber evaluated against PN 0020-70376. It prepares wafers before PVD processing; it is not a PVD deposition chamber.

  • Application / fitPre-process removal of moisture and volatile residues before PVD handling
  • Selection boundaryInstalled wafer format, heater arrangement, vacuum configuration and chamber revision confirmed before manufacture
  • MaterialMachined aluminum-alloy body with heat- and vacuum-related features to approved technical requirements
  • Interface basisAlternative-part geometry evaluated against PN 0020-70376 and approved technical data, including lid, heater, vacuum, transfer and sensor interfaces
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Transfer Chamber 0040-49834-003 for Endura 5500 PVDSecond-source-new or made-to-order evaluation; quotation confirms supply condition, inspection scope and schedule.

Transfer Chamber — PN 0040-49834-003

A wafer-transfer chamber evaluated for the confirmed Endura 5500 PVD configuration and PN 0040-49834-003. Its handling function does not imply interchangeability with transfer chambers on other platforms.

  • Application / fitVacuum wafer movement between modules in the identified Endura configuration
  • Selection boundaryRobot envelope, connected-port layout, transfer height and chamber revision confirmed from the installed tool
  • MaterialMachined aluminum-alloy vacuum chamber with port and sealing surfaces to approved technical requirements
  • Interface basisAlternative-part geometry evaluated against PN 0040-49834-003 and approved technical data, including ports, slit valves, robot datums, seal faces and utility penetrations
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Unibody Etch Chamber 0040-09723-C for P5000Second-source-new or made-to-order evaluation; quotation confirms supply condition, inspection scope and schedule.

Unibody Etch Chamber — PN 0040-09723-C

A one-piece etch chamber body evaluated only for PN 0040-09723-C and the confirmed P5000 configuration. It does not cover other P5000 etch chambers or revisions.

  • Application / fitEtch chamber body for the identified P5000 build
  • Selection boundaryPart-number suffix, process type, wafer size and installed chamber revision confirmed before manufacture
  • MaterialOne-piece machined aluminum-alloy body with process- and plasma-exposed surfaces to approved technical requirements
  • Interface basisAlternative-part geometry evaluated against PN 0040-09723-C and approved technical data, including seal faces, gas feed, pumping, electrode, cooling and slit-valve interfaces
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Production and Delivery

Supply condition, price basis, inspection scope and delivery terms are confirmed for the final chamber configuration.

Order Basis

MOQ starts at one chamber or assembly. Manufacture begins after the part number, revision and approved technical basis are confirmed.

Quotation and Schedule

Price, first-article approach, inspection documents and production lead time are confirmed for the final configuration, quantity, material, surface treatment and acceptance requirements.

Packing and Shipping

Protective packing, trade term, carrier, route and delivery schedule are stated in the quotation. For CIF evaluation, provide the destination port.

Technical Confirmation

Part number, revision, equipment configuration, process, wafer size, quantity and approved references are reviewed before final fit is accepted.

Inspection Scope

Identity, critical dimensions, sealing and locating surfaces, passages, connections, cleanliness or function-related checks are selected to the approved requirements.

Supply Condition

The six listings are evaluated as second-source-new or made-to-order; standard inventory is not represented without a confirmed quotation.

Custom Chamber Manufacturing

Send the part number, revision, quantity and available technical reference. A drawing, chamber-label photograph, critical dimensions or physical sample can support evaluation when the installed configuration is incomplete. Accepted upload types and size limits are shown in the form; final manufacturability, inspection scope and schedule are confirmed in the quotation.

Reference files are used to evaluate the requested chamber configuration; final file handling follows the quotation process.

FAQ

Direct answers for chamber identification, compatibility, supply condition and quotation inputs.

How do I identify the correct Applied Materials chamber?

Provide the complete part number and revision, platform and chamber name, process, wafer size and quantity. A chamber-label photograph, approved drawing, critical dimensions or physical sample can support technical confirmation when the equipment record is incomplete.

Are chambers from the same Applied Materials platform interchangeable?

No. CVD, etch, transfer, cooldown and degas chambers have different functions and interfaces. Final fit depends on the actual tool configuration, chamber revision, wafer size, seal and port geometry, utilities and requirements approved by both parties.

Is the listed degas chamber a PVD deposition chamber?

No. PN 0020-70376 is a degas support chamber for the identified Endura 5500 PVD configuration. It removes moisture and volatile residues before PVD processing; it does not deposit film.

Are these chambers in stock?

The listed chambers can be evaluated as second-source-new or made-to-order products against the stated part number or approved technical data. Supply condition, quantity, inspection scope, price and schedule are confirmed in the quotation; the page does not represent standard inventory.

What is needed for a quotation?

Send the part number and revision, equipment configuration, process, wafer size, quantity, required delivery location and technical or inspection requirements. For CIF evaluation, include the destination port.

Request a Chamber Quote

Send the chamber part number and revision, equipment configuration, process, wafer size and quantity. Add an approved drawing, chamber-label photograph, critical dimensions or sample information when available. Supply condition, manufacturing scope, inspection package, price and schedule are confirmed in the quotation.

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  • Email: [email protected]
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  • Address: No.29-1, Huibei Road, Liangxi District, Wuxi City, China.

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