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Chinsor Tech provides high-precision semiconductor core components suitable for amat Semiconductor series equipment, supporting thin film deposition and etching processes in 5nm and 7nm advanced processes. As a source manufacturer, Chinsor Tech has a complete design and production chain, eliminating intermediate trade links, providing you with highly competitive ex-factory prices and faster delivery response speed.
amat Semiconductor components are mainly used in chemical vapor deposition, physical vapor deposition, plasma etching and chemical mechanical planarization devices.
achieves a machining tolerance of 0.005mm through high-precision CNC machine tools, effectively reducing mechanical friction in the semiconductor process, reducing the fit clearance of key components by 50%, and significantly improving the repeatability and consistency of wafer processing.
are selected from special ceramic and alloy materials with a purity of up to 99.99, which can withstand strong acids, alkalis and plasma bombardment, reducing the risk of wafer metal contamination by 60% and ensuring the ultra-clean requirements of the semiconductor production environment.
Using aluminum nitride material with extremely high thermal conductivity, it can maintain structural stability in extreme high temperature environments up to 1,200 degrees Celsius, and the thermal expansion coefficient fluctuates very little, extending the thermal cycle life by about 18 months.
surface is treated by special anodic oxidation or coating, which has strong chemical inertness for fluorine-based or chlorine-based gas in the etching process, avoiding particle pollution caused by peeling off the surface of the component, and the yield improvement effect is remarkable.
is fully developed with reference to the original physical size of amat Semiconductor, ensuring seamless matching with the existing cavity and transmission system, reducing the risk of vacuum leakage due to installation errors and shortening the installation time by 30%.
For the specific process pain points of different fabs, Chinsor Tech provides customized optimization of gas path channels and heat distribution runners to solve the problem of local overheating or uneven gas distribution and improve the uniformity of film formation by 20%.
The amat Semiconductor adapter components produced by Chinsor Tech have core advantages in the field of material science. We have introduced nano-powder sintering technology to increase the compactness of ceramic components by 15% compared with the industry average. This means that in a strong plasma bombardment environment, the amount of particle shedding from the part is greatly reduced. In addition, Chinsor Tech has established a strict supply chain vertical integration system, which shortens the production cycle by 40% compared with other manufacturers and can provide customers with more efficient inventory turnover guarantee.
In view of the common metal ion contamination in semiconductor production, Chinsor Tech solves the problem of wafer batch scrap caused by insufficient material purity of key components, and stabilizes the yield at a very high level.
In view of the common multi-month delivery pain points in cross-border trade, Chinsor Tech has solved the huge loss of output value caused by downtime and parts, and achieved rapid delivery through localized mass production.
For high temperature and strong corrosion environment, we have solved the problem of frequent replacement of common compatible parts, significantly reducing the operating cost of each wafer in the semiconductor factory.
maintain 300mm or 200mm production lines, working to improve the yield and stability of CVD or etch processes. Engineers who see this section will understand that the component can directly solve the technical problems of uneven thickness or particle pollution.
is responsible for the daily maintenance and spare parts procurement planning of the machine. This group is more concerned about the durability and installation compatibility of spare parts, Chinsor the components provided by Tech can significantly extend the maintenance cycle and reduce the average repair time of the equipment.
are specialized in the refurbishment and performance improvement of amat Semiconductor machines. This product provides this group with high-quality component support to help it provide end users with a more cost-effective solution without sacrificing performance.
need high-precision and customizable experimental chamber components in the advanced process development stage. Chinsor Tech’s flexible customization capabilities can meet the rigorous experimental needs of researchers for special gas path or thermal field design.
Open the vacuum package in the clean room to check the surface of the component for minor scratches or damage. Make sure that the components have reached the environmental balance of the cavity before installation to avoid condensation pollution caused by temperature difference.
are accurately aligned according to the positioning holes in the equipment manual. Use a special torque wrench to tighten the bolts according to the specified value to ensure uniform force and prevent cracking of ceramic parts due to local stress concentration.
vacuum pumping test shall be carried out to observe whether the leakage rate meets the standard. Before the start of the formal process, the gradual heating and preheating are carried out to release the internal thermal stress of the component and ensure the stability of the process.
Periodic in-place cleaning is performed based on production hours. Use non-contact measuring tools to check the wear of key parts. If abnormal surface roughness is found, it should be evaluated and replaced in time to prevent pollution risks.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
high purity alumina ceramic
Material
99.99
Purity
0.02 microns
Surface roughness