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Chinsor Tech provides complete machine refurbishment and high-precision core components for AMAT PVD platforms, significantly improving wafer productivity and film uniformity through self-developed 8-inch thin film deposition technology and vacuum chamber optimization. As the source manufacturer of our own factories, we directly connect with global semiconductor customers, eliminate intermediate agency costs, and ensure that we provide you with very competitive original factory prices and faster delivery times.
AMAT PVD is mainly used in metallization wiring process, diffusion barrier layer deposition, under bump metallization manufacturing and new semiconductor thin film development.
through the use of high-purity aluminum nitride material, thermal conductivity of 180 watts per meter kelvin. Uniform heat distribution reduces thermal stress at the edge of the wafer and extends the service life of the component by 25% compared to ordinary parts.
The tolerance of the chamber interface is controlled within 0.02mm. This extremely high processing accuracy ensures the stability of the ultra-high vacuum environment and effectively prevents air impurities from penetrating into the film to affect the purity of the film.
aluminum or stainless steel shields with special surface roughening treatment greatly enhance the adhesion of sputtering by-products. This reduces the number of spalling particles in the chamber and extends the maintenance cycle by 30%.
precision calibration is carried out for the machine transmission system, and the repeated positioning accuracy reaches 0.1mm. This eliminates the risk of vibration and scratches during wafer transfer, ensuring the safety of expensive wafers.
The optimized power interface and cooling system support up to 20 kW sputtering power. The stable power output ensures a constant film deposition rate and improves the yield of the multi-layer metallization process.
provide customized consumables with a purity of up to 99.99%. Through strict chemical testing, it avoids any metal impurity pollution in the high temperature plasma environment and meets the needs of advanced process nodes.
Chinsor Tech’s refurbished AMAT PVD equipment performs well in film formation consistency. By adjusting the distance between the heating plate and the sputtering target in microns, we have achieved a film thickness deviation on 200mm wafers that is better than the original factory benchmark, effectively solving the industry problem of uneven resistance distribution in advanced processes. In addition, Chinsor Tech optimizes the shield replacement process. Our component design is more ergonomic, and with special disassembly tools, it can reduce chamber maintenance downtime by more than 15%.
For fabs that urgently need to replace core components, Chinsor Tech has established a standing inventory system to solve the problem of long machine shutdowns caused by long delivery of original spare parts.
By providing more wear-resistant high-precision metal spare parts, we have extended the frequency of consumable replacement. This directly solves the pain point faced by operation and maintenance decision makers who have been overspending on spare parts procurement budgets for years.
in view of the problem that the old machine can not meet the needs of the new process, Chinsor Tech provides customized chamber upgrade scheme, so that the old equipment has the ability to produce new composite film.
mainly responsible for the daily maintenance and troubleshooting of the machine. Standardized, high-precision spare parts from Chinsor Tech enable engineers to resume production after replacement without complex adjustments.
Responsible for controlling plant operating costs. These decision makers can work with source factories like Chinsor Tech to obtain transparent wholesale prices and greatly optimize annual purchasing expenses.
Need a stable and high-quality OEM replacement to restructure the machine. Chinsor Tech’s complete set of PVD solutions can help them deliver equipment with performance equivalent to new machines.
development of thin film materials in laboratory environment. They needed highly reliable and customizable sputtering chamber components to support reliable data under precise experimental conditions.
Before installing new spare parts, it must be ensured that the inner wall of the chamber has been cleaned without dust. Wipe the surface with special isopropyl alcohol and let it dry completely before placing the precision ceramic or metal components.
after replacing the wafer carrier, it is necessary to start the teaching mode to reset the position to zero. Confirm the coincidence of the claw hand and the center of the heating plate through the laser alignment instrument to prevent collision during transmission.
After installing the heater, it should slowly heat up at a rate of 10 degrees Celsius per minute. Observe whether the current feedback is stable, and hold for 30 minutes after reaching the preset temperature to eliminate the risk of thermal stress.
low power test run after process gas is introduced. Observe the color and stability of the glow discharge, and confirm that the shield is installed firmly and no abnormal arc is generated before entering the mass production mode.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
Endura series
Applicable platform
200mm
Wafer size
1e-9 Torr
Ultimate vacuum
Wuxi Zhanshuo