loading...
已经是到最后一篇内容了！
The AMAT P5000 CVD system is the standard choice for dielectric deposition in 8-inch wafer fabrication due to its multi-cavity parallel processing capabilities and excellent film uniformity. As a source manufacturer deeply engaged in the semiconductor field, Wuxi Chinsor Technology Co., Ltd. has an independent production workshop and a senior technical team. It can directly provide you with one-stop factory services from core component manufacturing to complete machine refurbishment, ensuring a shorter delivery cycle.
The AMAT P5000 CVD is mainly used in logic chip manufacturing, analog integrated circuit production, micro-electromechanical system processing, and thin film deposition processes for power devices.
Each cavity is equipped with an independent heating balance module to ensure that the temperature difference between the sheets is controlled within 2 degrees Celsius, greatly improving the thermal stability of film growth.
Through a high-precision automatic matching network, the RF energy conversion efficiency is increased by 15%, effectively reducing plasma instability caused by power fluctuations.
It uses a high-sensitivity negative electrode column temperature sensor to monitor the surface temperature of the plate in real time to avoid wafer stress damage caused by local overheating.
special surface passivation treatment is used inside the cavity to reduce the release of impurities in the cleaning cycle and extend the shutdown maintenance cycle by more than 20%.
The vacuum manipulator’s repeated positioning accuracy reaches 0.05 mm, and it can still maintain smooth transmission with zero scratches in high-capacity mode.
supports precision control of multiple gas flows, with airflow balance error less than one percent, ensuring excellent step coverage in complex tank structures.
The AMAT P5000 CVD refurbished machine provided by Wuxi Chinsor Technology Co., Ltd has been fully upgraded in the control system. Compared with similar old devices, we have used solid-state memory to replace the original floppy disk drive, which increases data reading speed by 5 times and completely solves the common system crash risk of old machines. As the source factory, Wuxi Chinsor Technology Co., Ltd’s own cavity consumables and core spare parts have reduced procurement costs by 30% while maintaining consistency with the original materials. This allows us to give our customers a very high cost-effectiveness advantage while providing equivalent process performance.
For parts that the original manufacturer has stopped supporting, Wuxi Chinsor Technology Co., Ltd. ensures that the production line can obtain a continuous supply of high-quality consumables through precision reverse engineering and manufacturing.
By optimizing the mechanical tolerance of the gas nozzle and plate spacing to 0.02 mm, the process difficulty of film peeling under high stress conditions is solved.
The pre-diagnostic maintenance system established by Wuxi Chinsor Technology Co., Ltd , combined with the rapid response of spare parts inventory, has shortened the original maintenance cycle of up to two weeks to less than 48 hours.
Suitable for logic, storage and power semiconductor mass production lines that need to expand production capacity or replace old CVD equipment.
meet the scientific research needs of universities or research institutions for equipment flexibility and high accuracy in new material deposition experiments.
For the thick film deposition requirements unique to micro-electromechanical systems, we provide a stable process environment and a highly consistent film layer structure.
Provide industrially proven mature deposition solutions for the production of analog circuits pursuing extremely high reliability and cost-effectiveness.
After starting the equipment, you need to run the system preheating program for at least 30 minutes and check whether the vacuum level of each cavity meets the set standards.
Select the corresponding process formula at the control interface according to the film type, and confirm that the gas flow rate and RF power settings are correct before clicking to operate.
Place the wafer box accurately at the loading station to ensure that the wafers are flat and free of damage. Start the transfer after starting the vacuum extraction procedure.
Regularly check the deposition of quartz and ceramic parts in the cavity, and use special cleaning agents for preventive maintenance according to standard procedures.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200 mm
Applicable wafer size
1 to 4
Number of configured cavities
less than three percent
Film uniformity
Wuxi Zhanshuo