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Zhanshuo Technology provides high-precision core components and system renovation services for amat ETCH series etching equipment... providing you with highly competitive direct supply prices and efficient technical support.
AMAT ETCH core components are mainly used in 8-inch wafer etching process, power device manufacturing, MEMS processing and compound semiconductor production.
plasma spraying process is used to form a dense protective layer inside the amat ETCH cavity… reduce the particle level of the component by more than 45%.
For DPS etching cavity, we lock the processing tolerance of key parts within plus or minus 0.01mm to ensure perfect air tightness of the cavity in high vacuum environment and avoid process fluctuation.
The thermal conductivity of the optimized wafer heating component is increased by 25%, and the temperature difference in the cavity is kept less than 3 degrees Celsius under the high temperature process of 200 degrees Celsius, which directly improves the uniformity of wafer etching.
high-purity aluminum and hard anodic oxidation treatment on the surface can effectively resist the long-term bombardment… extend the replacement cycle of core consumables by about 40%.
all spare parts developed for amat ETCH platform have undergone 1-to -1 reverse modeling and real machine verification, and the installation hole position and interface realize zero deviation docking, greatly reducing the difficulty of equipment maintenance.
The control system of Zhanshuo Technology can be deeply compatible with the existing equipment protocol… ensuring that the old equipment is full of new machines.
Through years of deep cultivation in the semiconductor field and deep accumulation of patented technology, Chinsor Tech has made our amat ETCH retrofit parts superior to the common third-party accessories in vacuum stability and coating life, ensuring that the equipment can still maintain extremely high process repeatability under long-term continuous operation.
In view of the problem that corrosive gas damages the cavity wall during etching, the composite ceramic layer developed by Chinsor Tech enhances the chemical stability and solves the production loss caused by frequent shutdown to clean the cavity.
In view of the industry problem of uneven etching rate, we redesigned the amat ETCH cavity flow field structure to solve the problem of low yield caused by inconsistent etching depth between wafer edge and center.
In view of the aging and slow response of the early model control devices, Chinsor Tech provides an upgraded version of the control components to solve the hidden danger of process parameter drift caused by signal delay.
responsible for the stable operation of the 8-inch production line, there is an urgent need for high-quality, low-cost spare parts solutions to replace expensive original parts and shorten the procurement cycle.
specializing in secondary equipment trade and machine repair, looking for production strength of the source factory for long-term cooperation to ensure the quality of refurbished equipment reliable.
in the scientific research or small batch trial production environment, the cavity configuration of amat ETCH needs to be adjusted according to the specific process, and there are higher requirements for customized components.
are committed to looking for quality system certification, with large-scale success stories of local quality suppliers, in order to optimize the overall supply chain security and cost.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
5200 series
Applicable platform
Polymer Etching
Cavity Type
0.02mm
Machining accuracy
plasma spraying process is used to form a dense protective layer inside the amat ETCH cavity... reduce the particle level of the component by more than 45%.
high-purity aluminum and hard anodic oxidation treatment on the surface can effectively resist the long-term bombardment... extend the replacement cycle of core consumables by about 40%.
The control system of Zhanshuo Technology can be deeply compatible with the existing equipment protocol... ensuring that the old equipment is full of new machines.
before installing amat ETCH spare parts, you must ensure that the inside of the cavity is thoroughly purified, wipe the interface with a dust-free cloth, and confirm that the sealing ring is free of any tiny scratches.
After the components are installed, a 24-hour static pressure holding test is required to ensure that the leakage rate meets the process requirements and prevent atmospheric molecules from entering and affecting the etching purity.
After replacing the power components, the calibration program provided by the system should be run to make the impedance matcher and the cavity achieve the best resonance and avoid damage to the hardware due to excessive reflected power.
In daily production, it is recommended to record the cavity pressure value and reflected power every 1,000 wafers, and predict the replacement timing of consumables in advance through trend analysis.