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Chinsor Tech provides a full range of AMAT Endura 5500 platform refurbishment, configuration upgrades and core precision component manufacturing, focusing on the efficient delivery of 8-inch wafer PVD processes. As the source factory in the field of deep-cultivated semiconductor equipment, we realize the whole process control from spare parts processing to whole machine debugging with our own production line, saving you the middleman price difference and shortening the delivery cycle by more than 30%.
AMAT Endura 5500 is mainly used in 8-inch wafer metal wiring, diffusion barrier layer deposition, silicide formation and back-end packaging sputtering process.
supports free combinations of up to 7 process chambers, covering pre-cleaning, degassing and multiple metal sputtering. This flexible configuration enables the AMAT Endura 5500 to complete the continuous deposition of multilayer thin films on a single platform, reducing the risk of wafer oxidation.
Using a precision-calibrated magnetohydrodynamic sealed transmission structure, the repeated positioning accuracy is maintained within 0.1 mm. This ensures stability in wafer grasping over long periods of operation, reducing the fragmentation rate to less than one part per ten thousand.
The AMAT Endura 5500’s system leakage rate is below 1e-9 liters per second through a self-produced, high-precision sealing flange and a controlled chamber polishing process. The extremely high vacuum degree ensures high purity of film formation and significantly improves the device yield.
For heating plates and shielding parts, we use high-purity ceramics and special coating processes. Its corrosion resistance and thermal uniformity match the original factory standard exactly, but while guaranteeing performance, it reduces the cost of subsequent consumables replacement by 40%.
The control software and sensing interface were updated during the renovation process to support more accurate flow control and pressure feedback. This solves the problem of communication delays in older machines and increases the process repeatability of the AMAT Endura 5500 by 15%.
All delivered AMAT Endura 5500 components are assembled in a 10,000-grade cleanroom and undergo ultrasonic multi-stage cleaning. This ensures that the machine quickly reaches process pressure after installation, shortening the commissioning cycle at the customer site.
Chinsor Tech’s refurbished AMAT Endura 5500 offers significant advantages in hardware stability. We have carried out a special electrochemical polishing treatment on the inner wall of the vacuum chamber to make the surface roughness reach the sub-micron level, thus greatly reducing the adhesion and detachment of by-products during the sputtering process. In addition, Chinsor Tech has optimized the electromagnetic field distribution for the magnetron system of the machine. By accurately calculating the target consumption path, our solution not only improves the step coverage of the film, but also increases the utilization rate of the target by more than 10%.
For models that OEMs are gradually discontinuing support, Chinsor Tech has established a complete 5500 spare parts library to solve the problem of permanent scrapping of machines due to the inability of customers to buy key sensors or motors.
Through the self-developed high-uniformity heating plate, we solved the problem that the edge of AMAT Endura 5500 is easy to crack during thick aluminum deposition, and increased the utilization rate of wafer edge by 5%.
relying on the rapid renovation capacity of the source factory, we can deliver the whole machine 2 months ahead of the average trader in the market, helping customers to seize the fluctuation of the semiconductor market expansion window.
need to find high-quality machine sources for resale. The AMAT Endura 5500 provided by Chinsor Tech is fully tested and certified for performance, making it the first choice for building reliable inventory.
is facing the existing production line expansion pressure. They need PVD equipment that is cost-effective and can be quickly put into production to meet the market demand for power management chips or MEMS.
responsible for finding core components for end customers. Compatible chamber spare parts produced by Chinsor Tech can help them solve the bottleneck of the original factory parts shortage during the repair process.
conducting new material deposition experiments. They needed AMAT Endura to 5500 this stable, multi-chamber switching platform to ensure consistency of experimental data across batches.
after the equipment is turned on, the vacuum cycle shall be run for 4 hours to ensure that the background vacuum of the chamber reaches more than 1e-8 torr. Verify that all sealing interfaces remain intact after thermal expansion by monitoring the leak rate.
Before putting in the formal wafer, the path must be calibrated through a special teaching chip. Make sure that the robot is offset less than 0.05mm in the center of each process chamber to prevent scratching of the wafer.
after replacing the new target, the plasma burning machine needs to be carried out at low power. The oxide layer on the target surface was removed by pre-sputtering from 10 to 20 kW until a stable deposition rate was monitored.
replace the shield in strict accordance with the counter prompts. It is recommended to open the chamber to check for particle accumulation after each 5000 wafer deposition and use a special vacuum cleaner to remove residual metal particles.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Wafer size
up to 7
Number of chambers
aluminum titanium tantalum nitrogen
Typical process
Wuxi Zhanshuo