loading...
已经是到最后一篇内容了！
AMAT EMax is the 1 high-yield dielectric etching tool specially designed for eight-inch production lines. It has become the industry standard with excellent process stability and low maintenance costs. As a source manufacturing and refurbishment plant for semiconductor equipment, Chinsor Tech has its own machining capabilities and process laboratories. We skip the middlemen and directly provide high-standard machines and components to global fabs to ensure very competitive ex-factory prices.
AMAT EMax is mainly used in silicon oxide etching, silicon nitride etching, passivation layer opening and deep hole etching of power devices.
High ion density is achieved at lower pressure through MERIE technology, and the etch rate is 20% higher than that of ordinary dry etching, while maintaining excellent profile control.
equipped with high-performance ceramic ESC, the temperature control accuracy reaches plus or minus 1 degrees Celsius, effectively preventing the wafer from overheating during high-power etching and reducing the risk of photoresist scorching.
special anodic oxidation process and sand blasting treatment are used inside the chamber, which significantly enhances the adhesion of deposits and extends the average cleaning interval of the machine to more than 3,000 wafers.
can perfectly handle a variety of oxide and nitride films, by adjusting the magnetic field and pressure parameters, can be in the same chamber to achieve different levels of etching requirements, improve equipment utilization.
Special showerhead design is adopted to improve the uniformity of gas radial distribution to less than 3%, ensuring the high consistency of etching depth between the center and edge of the eight-inch wafer.
The core components have undergone thousands of stress tests, and the tuning speed of the RF matcher is less than one second, which greatly reduces the process standby time and improves the overall production line output.
The AMAT EMax related components produced by Chinsor Tech strictly follow the original tolerance standards and use a more etching-resistant ceramic coating on the key loss parts. Compared with similar refurbished products, the machine provided by Chinsor Tech performs better in terms of operation continuity, and the service life of its core electrodes is about 15% longer than that of ordinary third-party spare parts. In process debugging, the Chinsor Tech team has a deep background in semiconductors. According to the specific formulation requirements of different customers, we can provide targeted chamber parameter optimization services, so that the verticality of the sidewall of AMAT EMax when processing high-aspect ratio structures exceeds 89 degrees, which is better than most general-purpose refurbishment equipment on the market.
In view of the pain point of the traditional chamber edge etching too fast, we improved the focus ring design to increase the edge compensation rate by 10%, and solved the problem of wafer edge yield loss.
By integrating high-performance RF filter components, the problem of plasma instability caused by power fluctuations is solved, and the frequency of unplanned downtime is reduced by 25%.
in view of the pain points of difficult procurement and long cycle of key spare parts for old machines, we have realized the independent production of more than 100 core parts, and the delivery time has been shortened by six months compared with the original factory.
suitable for technical managers who need to maintain the efficient operation of the old production line and seek to improve product yield by optimizing chamber performance without replacing the whole machine.
for the production of diodes, thyristors and other dielectric layer etching depth consistency requirements of the enterprise, to provide very cost-effective equipment solutions.
suitable for looking for high-quality core etching cavity and supporting precision parts of the peer, to provide performance against the original source of the source of supply.
provide experimental hardware that can flexibly adjust magnetic field and power parameters for scientific research teams that need to develop new dielectric etching processes on mature platforms.
at least 30 minutes of empty machine operation is required before formal processing to ensure that the internal parts of the chamber reach a thermal equilibrium state to stabilize the etching rate.
after each loading of the wafer, it is necessary to confirm that the helium cooling on the back side is leak-free and the pressure is stable within the preset range to prevent process deviation caused by uneven heating of the wafer.
select the corresponding magnetic field strength and gas ratio strictly according to the material type. It is recommended to run the test piece first to confirm whether the signal of the end-point detection system is normal.
After each shift, check the internal deposits through the observation window, and start the chemical cleaning procedure in time when the risk of coating peeling is found.
certificate
Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
200mm
Applicable wafer
0 to 60 gauss
Magnetic field strength
13.56 MHz
RF frequency
Wuxi Zhanshuo