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AMAT CVD is a core piece of equipment in semiconductor wafer fabrication, specifically designed to achieve extremely high uniformity in thin-film deposition. Chinsor Tech is a tier-one manufacturer with 52 proprietary patents. Our core offerings focus on 8-inch CVD equipment and critical components. By eliminating intermediaries, we provide you with highly competitive factory-direct pricing and faster delivery times.
AMAT CVD is primarily used on semiconductor equipment such as the AMAT Centura 5200, Endura 5500, P5000, and Lam2300.
As a high-tech enterprise with 52 patents and 11 software copyrights, Chinsor Tech has independent technology in film deposition and vacuum chamber, ensuring a high degree of compatibility between the core algorithm of the equipment and the hardware.
We deeply cultivated the field of 8-inch integrated circuit CVD equipment, for SiN and SiO2 and other media layer deposition for depth optimization, film uniformity index reached the domestic leading level, significantly improve the chip yield.
the use of their own anodic oxidation, sandblasting and hard oxygen production process. These special processes make amat CVD cavity components extremely corrosion resistant and extend the service life of spare parts by more than 40%.
We not only provide equipment, but also have the ability to Centura the renovation and Retrofit transformation of 5200 and other platforms. Through core component upgrades, help customers achieve leapfrogging of process capabilities under existing budgets.
The use of self-developed vacuum chamber processing technology to strictly control the physical particle generation during the deposition process. The measured data show that the defect rate of the wafer surface can be reduced by 25%.
For the needs of different process nodes (e. g. 28nm to 14nm), Chinsor Tech provides the entire industry chain supply from metal processing parts to complex ceramic brittle material products, with a response speed far exceeding the industry average.
Chinsor Tech has a significant vertical integration advantage in amat CVD. Compared with traders, we rely on our own production bases (Wuxi and Taizhou factories) to realize one-stop service from metal parts processing, ceramic brittle material manufacturing to system integration, reducing the overall equipment procurement cost by 15%-30%.
In response to the problem of the shutdown or long delivery of AMAT’s old model machine parts, Chinsor Tech has solved the shutdown crisis caused by the shortage of spare parts in the customer’s production line by virtue of its source factory advantage.
By applying our unique hard oxygen and anodizing processes, Chinsor Tech solves the problem that traditional CVD chambers are prone to corrosion and spalling in high-intensity plasma environments.
In response to the problem of different standards for refurbished machines in the market, we have used our own 8-inch CVD technology accumulation to solve the potential stability problems of old platforms in large-scale mass production.
For engineers responsible for the maintenance of the 8-inch production line thin film deposition process, help them obtain high-quality chamber components and process package upgrade support.
for the pursuit of domestic replacement of spare parts and cost control of enterprise decision makers, to provide them with high-performance, fast delivery of the original factory-level quality alternatives.
suitable for integrators who need to carry out in-depth renovation or LoadLock transformation of AMAT Centura 5200 and other platforms, providing core technology module support.
for research units conducting ultra-thin film deposition research, providing customizable CVD experimental platforms and key vacuum environmental components.
Before starting deposition, it is necessary to confirm that the wafer heater reaches the set temperature through the control system and perform a leak rate test of the vacuum chamber.
according to the film type (such as SiN or SiO2) from the database to load preset parameters, adjust the RF power and gas flow control indicators.
confirm that the robot arm is accurately positioned, and automatically send the wafer into the reaction chamber through the LoadLock system to ensure no pollution in the whole process.
At the end of each shift, an in-situ plasma self-cleaning procedure is performed to remove accumulated by-products from the chamber walls and maintain process consistency.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
Centura 5200 Platform
Device Platform
8 inches and 12 inches
Wafer sizes
Hard Anodizing and Anodizing
Surface Treatment
Wuxi Zhanshuo