amat centura etch

CENTURA ETCH CONFIGURATION REVIEW

Separate the host platform from the installed etch technology before comparing a used tool. Review the process family, chamber name, wafer size, hardware record, and current condition against one identified Centura II DPS asset.

The listed asset is an 8-inch Applied Materials Centura II DPS in Used – As Is / Deinstalled condition. Its installed chamber inventory and operating status require confirmation from equipment records and inspection evidence.

Review the Centura II DPSSend Configuration Details
Applied Materials Centura II DPS equipment for AMAT Centura Etch configuration review

AMAT Centura Etch Names Describe Different Configuration Levels

Applied Materials, commonly shortened to AMAT, identifies the manufacturer. Centura identifies a single-wafer, multi-chamber platform family. Etch identifies the material-removal process category. None of these terms alone specifies the installed chambers or the process capability of an individual tool.

A complete equipment identity connects the host generation to the process product, chamber version, wafer size, and installed hardware. This hierarchy keeps a Centura II host, a DPS-family chamber, and a specific used asset from being treated as interchangeable descriptions.

IdentifierWhat it identifiesWhat still needs confirmation
Applied Materials / AMATEquipment manufacturerPlatform, process product, and installed configuration
Centura, Centura II, or Centura APHost platform family or generationWafer-handling architecture, interfaces, and chamber set
EtchMaterial-removal process categorySilicon, metal, dielectric, or another specific etch application
DPS, DPS Plus, eMax, or Super eProcess product, chamber technology, or product generationFull process prefix, chamber version, wafer size, and hardware revision
150 mm, 200 mm, or 300 mmWafer-size configurationMatching robot, load locks, chambers, kits, and interfaces
Serial number and Tool IDIndividual asset recordInstalled modules, modifications, completeness, and current condition

Match the Etch Family Before You Review the Hardware

Silicon, metal, and dielectric etch place different demands on plasma generation, gas delivery, temperature control, chamber materials, exhaust handling, and process kits. A Centura host can support different process products, so the material family must be established before chamber or tool fit can be assessed.

Etch familyProduct names or context you may encounterConfiguration evidence to verifyWhy it changes the decision
Silicon EtchSilicon Etch DPS or DPS Plus contextComplete chamber name, wafer size, source and bias hardware, process kit, and current chamber configurationSilicon applications cannot be inferred from the Centura or DPS name alone.
Metal EtchMetal Etch DPS or DPS Plus contextComplete chamber name, conductor application, wafer size, chamber materials, gas and exhaust configuration, and installed kitA DPS-family name may occur in both silicon and metal etch records; the process prefix and hardware record separate them.
Dielectric EtcheMax, Super e, or other dielectric-etch contextFull product name, wafer size, chamber generation, RF configuration, process kit, and target film/applicationDielectric chamber families and their hardware must be identified independently from DPS-family configurations.

Available Centura II DPS Asset for Configuration Review

Applied Materials Centura II DPS, 8-inch, Tool ID DRP1P3

Used Applied Materials Centura II DPS equipment, Tool ID DRP1P3

E10-0015_DRP1P3-AMAT_Centura II DPS

The asset record ties this review to Tool ID DRP1P3 instead of a generic Centura family name. Its installed chamber set and process family remain items for document review. Request current availability, the installed chamber inventory, included hardware, condition evidence, and quote scope for E10-0015_DRP1P3-AMAT_Centura II DPS.

  • Formal product nameE10-0015_DRP1P3-AMAT_Centura II DPS
  • Product designationAMAT Centura DPS
  • ManufacturerApplied Materials
  • Host generationCentura II
  • Wafer size8-inch (200 mm)
  • Serial number9532
  • Tool IDDRP1P3
  • Listed conditionUsed – As Is / Deinstalled
  • Installed chamber configurationConfirm from the chamber inventory, nameplates, and equipment records
  • Current operating and test statusConfirm through inspection and agreed test evidence
Ask About Tool DRP1P3View Product Details

Follow a Configuration Review Path Before Comparing Tools

1. Confirm the individual asset

Record the host nameplate, serial number, Tool ID, manufacturing labels, and any asset-list reference. These identifiers connect photos and documents to the same physical system.

2. Verify the host and wafer-handling configuration

Confirm Centura, Centura II, or Centura AP; then record wafer size, robot configuration, load locks, orientation equipment, and cassette interfaces. The same process-family name can appear in different wafer-size and host contexts.

3. Build the installed chamber inventory

List every process chamber by its complete recorded name. Include the process prefix, such as Silicon Etch, Metal Etch, or Dielectric Etch; the family or generation, such as DPS, DPS Plus, eMax, or Super e; and the chamber serial, hardware revision, and installed process kit when available.

4. Document the current physical and test condition

For a deinstalled tool, identify missing modules, disconnected utilities, storage history, visible damage, contamination controls, and completed tests. Keep power-up, vacuum, motion, RF, gas-box, endpoint, and chamber test evidence separate so the quote reflects the evidence actually available.

5. Compare the requirement with the recorded configuration

Match the required material family, wafer size, process objectives, factory interfaces, facility limits, software/control needs, and acceptance plan to the documented asset. Hardware changes, chamber conversions, and process qualification should appear as defined project scope when the recorded configuration does not match the requirement.

Compare Used-Tool Quotes on the Same Scope

Used AMAT Centura Etch pricing depends on the identified configuration, included hardware, condition, verification level, and delivery scope. Ask each seller to state the same fields in its quote so a lower price does not conceal missing modules or a narrower service boundary.

Quote fieldDetails to request
Asset identityFormal tool name, serial number, Tool ID, wafer size, and seller asset reference
Included configurationHost, robot, load locks, chamber inventory, pumps, RF/power hardware, gas delivery, endpoint hardware, accessories, and documentation included in the offer
Condition and completenessAs-is, deinstalled, refurbished, or tested status; missing items; known faults; storage condition; and inspection date
Test evidenceExact tests completed, test date, observed results, limitations, and available photos, videos, logs, or reports
Conversion or restoration scopeRequired chamber work, missing-module replacement, software/control work, cleaning, refurbishment, installation, start-up, and process qualification responsibility
Commercial scopePrice, currency, validity, lead time, payment terms, warranty or return terms, packing, Incoterm, destination, and freight responsibility

A comparable quote separates confirmed hardware, optional work, and items still awaiting inspection.

AMAT Centura Etch Configuration FAQ

Can any 200 mm Centura chamber be installed on a 200 mm Centura host?

Matching wafer size is only one condition. The host interface, robot and load-lock arrangement, chamber generation, utilities, RF and control hardware, software, and process kit must also match the target configuration.

Which configuration record should be used after an upgrade or chamber conversion?

Use the current installed-hardware inventory and current configuration files, supported by the upgrade or conversion record. The original product name remains part of the asset history, but it may not describe the hardware now installed.

When should process qualification be included in the project scope?

Include process qualification when the acceptance requirement depends on wafer results, such as etch rate, uniformity, profile, selectivity, defect performance, or repeatability. Power-up, vacuum, motion, and subsystem tests establish hardware condition but do not replace an agreed process-qualification plan.

Review Your Centura Etch Requirement

Send the available equipment records and the process configuration you need. Chinsortech will use the submitted identifiers to review the asset scope, identify open configuration questions, and prepare the next commercial discussion.

  • Phone: 18015354460
  • Email: [email protected]
  • WhatsApp: 18015354460
  • Address: No.29-1, Huibei Road, Liangxi District, Wuxi City, China.

Include the required etch family, wafer size, host generation, chamber names, Tool ID or serial number, known condition, destination, and target schedule. Thank you. Your configuration details have been submitted for review.