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Applied Materials P5000 is a landmark monolithic, multi-chamber cluster system in semiconductor manufacturing. It is positioned in a high-precision thin film deposition and etching process and adopts a classic “star-shaped” structural design. The central load lock can connect up to four independent processing chambers at the same time. This construction not only achieves seamless wafer transfer in a vacuum environment, but also ensures process continuity and extremely high cleanliness. As a highly flexible platform, the P5000 is compatible with various technologies such as PECVD, SACVD and dry etching, meeting multiple needs from scientific research experiments to large-scale mass production. At its core, the system enables precise control of plasma distribution and wafer temperature (operating temperatures up to 400 °above C) thanks to its superior DxZ chamber design. Its modular configuration allows users to flexibly change hardware according to specific materials (such as silicon dioxide, silicon nitride, tungsten, etc.). This diversity makes it extremely adaptable to the environment in MEMS, photonics and power device manufacturing. In addition, the P5000 is known for its high throughput and low maintenance costs. Even while pursuing advanced process nodes, it can still provide stable economic benefits for mature processes.
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0010-13264
This robotic arm achieves a repetitive positioning accuracy of ±0.05mm through a high-precision stepper motor, significantly reducing the breakage rate in wafer transmission. Mainly used in Centura 5200 system, PECVD vapor deposition equipment, single wafer processing platform.
UNIT PRICE
$45645.00
Inventory
In-stock
0010-01712
Made of reinforced aluminum alloy and designed with low-friction bearings, it effectively extends the continuous operation time of the robot arm in vacuum high temperature environment. Mainly used in Precision 5500 series, vacuum wafer transmission module, automated production line transformation.
$52625.00
0010-21631
The high-purity anodized aluminum cover has excellent resistance to plasma corrosion, and the sealing structure design ensures that the chamber achieves ultra-high vacuum stability. Mainly applied in P5000 reaction chamber, gas distribution system, physical vapor deposition equipment.
$25885.00
0040-39883
This chamber assembly improves film deposition uniformity by 15% by optimizing thermal field distribution. Its modular design simplifies on-site installation and daily maintenance. Mainly applied in Centura WXZ system, tungsten deposition process, semiconductor front-end mass production line.
$55154.00
0020-32036
Optimizes the secondary distribution of the gas flow field through high-precision hole placement, ensuring consistent surface treatment and process stability for large-scale wafers. Mainly used in 100SX universal chamber, MES management system compatible equipment, CVD reactor.
$51846.00
715-330106-003
The fixed gap structure design eliminates dust generated by wear on moving parts, significantly improving the repeatability of the etching process while ensuring a constant discharge spacing. Mainly applied to fixed gap reaction cavity, medium etching equipment, high frequency plasma treatment.
$85652.00
715-028405-001
Manufactured from corrosion-resistant special alloy materials, its base reinforcement structure can withstand extremely high heat loads, protecting the core sensor from chemical attack. Mainly applied to the lower shell of the reaction chamber, wafer bearing system, and high-temperature annealing furnace.
$46568.00
715-330834-002
This enhanced lower housing accelerates chamber cooling by 20% by optimizing cooling water circulation, effectively preventing seal aging leakage caused by high temperatures. Mainly used in enhanced reaction systems, rapid heat treatment equipment, and high-batch wafer processing.
$85415.00
715-031986-005
High-cleansing interior coating technology significantly reduces cross-contamination during the process cycle, and the structural strength design matches the connection needs of various high-vacuum pump units. Mainly used in general reaction chamber shell, PECVD deposition module, semiconductor equipment maintenance and replacement.
$75415.00
Modular four-chamber cluster design
The system supports the configuration of 4 independent processing chambers on a single platform, allowing the process conversion from deposition to etching to be completed without destroying the vacuum, reducing the risk of wafer cross-contamination by more than 50% and significantly improving the yield.
DxZ Chamber Precision Process Control
With the optimized DxZ chamber architecture, film formation uniformity deviation can be controlled within 1.5%, ensuring that extremely high thickness consistency can still be maintained at the edge of the 8-inch wafer, meeting the manufacturing needs of high-precision semiconductor devices.
All-round material compatibility
Supports the deposition of various thin films such as TEOS, silane oxides, silicon nitride and metallic tungsten. A single device can process the insulation layer, passivation layer and metal connection layer, providing the production line with an extremely high equipment reuse rate.
Vacuum cold extraction and rapid cooling system
Equipped with a water-cooled base and a multi-slot cooling elevator, it can quickly cool the wafer to a safe level before transmission, prevent material deformation caused by high temperature, and improve the efficiency of single-chip processing cycle by about 20% compared with similar old equipment.
Highly mature automated transmission logic
Equipped with a high-reliability robotic arm and groove/flat edge alignment function, the wafer placement accuracy reaches the micron level, effectively reducing the wafer fragmentation rate caused by transmission failures and extending the continuous trouble-free operation time of the equipment.
Low operating costs and excellent durability
The key components use ceramic heaters and anti-corrosion liners, which increase chemical erosion resistance by more than 3 times, greatly extend maintenance cycles and reduce spare parts replacement costs. It is the most preferred choice for mature process production lines that balance performance and profit.
Advanced semiconductor logic chip manufacturers
DRAM and NAND memory manufacturers
MEMS Micro-Electromechanical Systems R&D and Manufacturing Agency
Developer of silicon-based photonics and optoelectronic devices
Silicon carbide and gallium nitride power semiconductor manufacturers
Automotive Electronics and Industrial Control Chip Packaging Factory
Third Generation Semiconductor New Materials Laboratory
Wafer foundry (Foundries)
IoT sensor manufacturing company
Semiconductor equipment refurbishment and solution provider for 150mm/200mm process
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