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Chinsor Tech provides professional AMAT P5000 MxP reaction chamber and core components to ensure extremely high uniformity of etching process through precision repair and performance optimization. As a source factory integrating R & D and manufacturing, Chinsor Tech has its own production base and technology patents, eliminating the need for intermediate agents and providing you with competitive direct selling prices and efficient technical response.
AMAT P5000 MxP is mainly used in oxide etching, metal etching, passivation layer processing and dielectric layer processing of 8-inch wafers.
Chinsor Tech’s optimized MxP cavity internal geometry can ensure extremely uniform plasma distribution on 200mm wafer surface and strictly control etching deviation within 3%.
high-purity alumina ceramic materials, with strong resistance to plasma erosion performance, even in continuous high-load production environment, the particle generation rate can still be reduced by 60%.
equipped with high-precision RF matcher, to achieve very low reflected power loss, to ensure the stability of each wafer in the etching process of energy input, significantly improve the process repeatability.
real-time and accurate monitoring of the negative pole temperature through sensors can effectively prevent process drift caused by local overheating and protect core components from thermal damage.
the use of high-grade vacuum seals and precision sealing surface processing technology, vacuum leakage rate is lower than the industry standard, to ensure the stability of the MxP cavity in ultra-low pressure environment.
For original parts that are discontinued or have a long delivery period, Chinsor Tech provides a full set of independently developed compatible spare parts, shortening the delivery cycle by more than 50% to ensure continuous operation of the production line.
Compared with traditional remanufactured equipment, Chinsor Tech’s AMAT P5000 MxP optimization solution offers superior process adaptability. We not only repair the hardware, but also solve the problem of easy wear and tear of original factory parts through material upgrades, thereby nearly doubling the maintenance cycle of the cavity under high RF power. Chinsor Tech’s refurbished chamber: By conducting a secondary computational fluid dynamics (CFD) simulation to optimize the internal flow field, the edge-effect issue that plagued previous-generation equipment when processing new materials has been significantly reduced, ensuring yield rates meet the mass-production standards of world-class foundries.
Chinsor Tech has established in-house production of critical MxP ceramic and metal components, resolving the pain point of uncontrollable lead times for discontinued parts from original equipment manufacturers that often cause production line stoppages in traditional procurement channels.
in view of the defect of inaccurate temperature control after long-term operation of P5000, we have introduced a high-sensitivity temperature detection feedback system to solve the uneven etching rate caused by thermal drift.
In response to communication failures of refurbished equipment on different production platforms, Chinsor Tech has re-optimized the electronic control interface to solve the problem of low matching between hardware and system software.
responsible for the daily operation and maintenance of the 8-inch semiconductor production line, the need to purchase high-quality, long-life MxP cavity spare parts to reduce equipment failure rate and maintenance costs.
looking for stable upstream factory cooperation, through the procurement of Chinsor Tech with technical support of the whole machine cavity and key components, to provide its customers with the whole machine refurbishment program.
When developing new thin film etching processes, high-performance P5000 experimental platform with stable performance and wide adjustable range of parameters and supporting cavity support are required.
focus on improving the performance of customers’ stock equipment, through the introduction of Chinsor Tech’s technical transformation module, to solve the problem of old equipment can not handle precision technology.
Before installing the MxP cavity, ensure that the host is completely vacuum isolated, and check the integrity of the interface sealing ring to prevent trace air from entering and contaminating the system.
after the installation is completed, enter the system interface, set the RF power, magnetic field strength and pressure parameters according to the process requirements, and conduct no-load test to verify the tuning range of the matcher.
regularly check whether the temperature sensor probe is in close contact with the negative pole to ensure real-time and accurate data transmission and avoid overheating and shutdown of the cavity caused by abnormal monitoring.
After each specific number of wafers are processed, the chamber needs to be dry cleaned or manually maintained according to the process residue to maintain the purity of the internal environment of the chamber.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
single wafer reaction chamber
Cavity type
Applied Materials 5000
Compatible Platform
Dielectric Metal Etching
Process Application
Wuxi Zhanshuo