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Chinsor Tech focuses on providing high-precision AMAT P5000 MxP etching chamber core components for mature process fabs around the world. With excellent material purity and processing accuracy, it significantly improves chip yield and extends the mean time between failures of equipment. As an entity source manufacturer, Chinsor Tech has its own research and development base and mass production factory, eliminating the need for middlemen to earn the difference, and providing you with highly competitive factory direct sales prices and faster delivery cycles.
This product is mainly used in 8-inch semiconductor wafer manufacturing in the dielectric etching process, oxide and nitride film stripping, polysilicon etching processing and silicon wafer surface micro-pattern of high-precision physical dry etching device.
the internal key components adopt ultra-high-purity ceramic and quartz materials with 99.99% purity, which can maintain extremely high structural stability under long-term plasma bombardment, reduce the number of dust particles in the cavity by more than 85%, directly protect the wafer from impurity pollution and significantly improve the yield of wafer pattern transfer.
all processed parts are formed by five-axis precision CNC machine tools, and the tolerance of key fit dimensions is strictly controlled within plus or minus 0.01mm. This means that the product can replace original components 100% seamlessly, and engineers can quickly install it in situ without any secondary machining.
The metal surface of the cavity is treated with a special process of deep and high-density anodizing, and the protective layer formed is dense and uniform. In the face of highly corrosive high-density plasma cleaning gases such as fluorine-based or chlorine-based, the surface erosion rate slows down by nearly 1 times, thus effectively preventing wafer metal contamination caused by substrate metal exposure.
The improved wafer heating and electrostatic chuck assembly uses an optimized internal heating wire layout and high thermal conductivity ceramic material to control the temperature unevenness of the eight-inch wafer surface within plus or minus 1 degrees Celsius. This helps to greatly improve the uniformity of the etch rate and eliminate over or under etching of the edge wafer due to temperature gradients.
The sealing surface of the vacuum chamber is ultra-fine ground and polished, and the overall limit air leakage rate is stably maintained at a very low level with customized high-specification fluorine rubber sealing ring. Excellent static and dynamic sealing performance not only ensures the stability of high vacuum environment, but also extends the overall replacement cycle of parts by six months.
The core conductive components and RF inputs are treated with surface silver plating or conductivity optimization, which significantly reduces impedance loss and heat accumulation during high-frequency current transmission. RF power transmission efficiency is improved 5%, effectively preventing plasma discharge flicker or abnormal extinction, and ensuring continuous and stable process.
By upgrading the raw material formula and surface treatment coating, the components provided by Chinsor Tech have improved the anti-erosion ability of spare parts in strong corrosive plasma environment by 40% compared with ordinary third-party refurbished parts on the market. At the same time, relying on the strength of strong local production plants, Chinsor Tech has reduced the delivery cycle of the traditional supply chain to two to 3 weeks, greatly reducing the pressure on the fab’s spare parts inventory.
in view of the problems that the old etching machine often causes accelerated wear of the sealing surface of the vacuum valve and frequent air leakage of the cavity due to mechanical micro-vibration in mature process, we have successfully eliminated the displacement of the sealing surface caused by micro-vibration by improving the connection stiffness of the cavity and the geometric design of the sealing groove, and solved the persistent problem of vacuum fluctuation affecting process stability 1 the industry.
In view of the defect that the wafer edge temperature is too high during the high-power continuous etching process, which leads to inconsistent chip etching critical dimensions, we reconstructed the power density distribution of the internal heating element to solve the problem of low edge chip yield caused by uneven thermal field distribution in traditional heaters.
In view of the pain point that ordinary ceramic cover ring is easy to consume and produce a large number of tiny particles in the etching process, resulting in high wafer surface pollution, we fully adopt high-density Shi Ying and high-purity alumina materials to solve the problem of frequent shutdown for cavity PM maintenance and replacement of consumable parts, resulting in low production line growth rate.
suitable for managers responsible for the smooth operation of six-inch or eight-inch wafer production line equipment. The product is a perfect replacement for discontinued or high-priced original wearing parts, helping it to significantly reduce annual equipment maintenance and operating costs while maintaining or even increasing the overall yield of production line chips.
suitable for third-party independent service providers or technical teams specializing in refurbishment and upgrading of second-hand equipment. The highly compatible precision mechanical dimensions and control software and hardware interfaces enable them to quickly complete the assembly and process debugging of the cavity part when reconstructing the old complete machine system.
suitable for purchasing decision makers who are looking for high-quality and stable parts supply chain on a global scale. Chinsor Tech has a number of independent intellectual property rights, quality system certification and transparent factory direct sales channels, which can perfectly meet the strict audit requirements of its anti-risk supply chain and traceable quality management system.
suitable for technical personnel responsible for operating scientific research etching equipment in universities and national key microelectronics laboratories. The cavity spare parts with high reliability and long maintenance-free cycle can meet the high requirements of various multi-user and multi-material cross scientific research process tests on the vacuum environment and anti-pollution of the equipment.
Before loading the new assembly into the etching chamber, the sealing surface must be thoroughly cleaned with high purity isopropyl alcohol. Make sure that there is no dust or fiber residue, then apply a small amount of high vacuum fluorine vacuum grease evenly and insert the sealing ring correctly to prevent air leakage from the cavity.
When placing the heating component or wafer tray into the cavity, a special centering gauge must be used for multi-point measurement. Ensure that the wafer placement position is completely coincident with the axis of the upper gas shower head, and the error is controlled within 0.05mm to ensure the uniformity of etching.
After the components are installed and the cavity is closed, do not directly pass the process gas. The vacuum pump system should be turned on first to pump the cavity to the ultimate vacuum, and the heating system should be turned on to bake at a high temperature of not less than four hours inside the cavity to completely discharge the water vapor and impurities adsorbed on the surface.
when the process is first powered on, the method of gradually increasing power shall be adopted. Inert gas is first introduced for low-power plasma ignition test, and after confirming that the reflected power of the radio frequency matching device is normal, it is gradually switched to the normal fluorine-based etching process gas to prevent thermal shock from damaging the ceramic parts.
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Welcome to our Frequently Asked Questions page. We have compiled answers to common questions you may have, hoping to provide you with clear and quick solutions. If you cannot find the information you need here, please feel free to contact our customer support team.
high-grade aluminum alloy
Process cavity
high purity anodized
Internal coating
eight inches
Applicable wafer
Wuxi Zhanshuo